Chinese semiconductor thread II

[tokenanalyst]

Ren Tianling's team from the School of Integrated Circuits proposed an adaptive spatiotemporal information processing paradigm inspired by the attention mechanism.​

A research team from Tsinghua University’s School of Integrated Circuits has developed an attention-inspired in-memory computing device that mimics the human brain’s ability to efficiently process both temporal and spatial information with low energy consumption.

Inspired by the brain’s attention mechanism, particularly the frontoparietal network’s dynamic filtering of sensory input. The team created a 0D-2D heterodimensional interface using MoS₂ channels and Ag conductive filaments. This structure enables nonvolatile storage of past data and analog computation with adjustable weights between current and stored information, allowing adaptive, real-time attention allocation.

The device performs spatiotemporal processing directly in memory, reducing hardware overhead and power use. A 5×5 array was fabricated and tested to demonstrate its ability to dynamically prioritize moving (point A) versus stationary (point B) objects by adjusting gate voltages—controlling the intensity of temporal and spatial signals.

Simulations show the system can support real-time, context-aware attention allocation in autonomous driving scenarios, enabling roadside and vehicle-side systems to respond adaptively to changing environments with full-range (0–100%) flexibility.

This breakthrough paves the way for energy-efficient, low-power edge intelligence applications—especially in dynamic fields like autonomous vehicles.​

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

They benchmark their products against Zeiss.

 

[tokenanalyst]

A rapid modeling method for stochastic effects in extreme ultraviolet photoresists​

Abstract​

Compared to deep ultraviolet (DUV) sources, extreme ultraviolet (EUV) sources have higher photon energy, and their random photon fluctuations have a stronger impact on photoresist morphology. To address the need for rapid modeling of random effects during the EUV photoresist exposure-bake process, this paper proposes a discrete event fast modeling method for the post-bake (PEB) process based on the Gillespie algorithm for the chemical master equation. Its innovative features include: first, separate modeling of four reactions: deprotection, neutralization, acid diffusion, and base diffusion; second, constructing an accumulation array by converting three-dimensional coordinates to one-dimensional coordinates, and employing a binary search algorithm to precisely locate reaction units; and finally, combining a batch delayed update mechanism with a one-dimensional diffusion optimization strategy to achieve efficient simulation of the PEB process. Simulation data demonstrate that this method achieves a 2.15-3.75x improvement in computational efficiency while maintaining nearly unchanged simulation accuracy. This proposed method not only provides an efficient numerical solution for modeling random effects in EUV photoresists, but also offers valuable insights for simulating complex reaction systems.​

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Shanghai Silicon Industry's 2025 First Half Report: Revenue of 1.697 billion yuan​

Shanghai Silicon Industry recently officially released its 2025 semi-annual report. The report disclosed important information such as the company's operating results and financial status in the first half of the year.

According to the report, Shanghai Silicon Industry achieved operating revenue of 1.697 billion yuan in the first half of 2025, an 8.16% year-on-year increase. In the second quarter, Shanghai Silicon Industry achieved revenue of 896 million yuan, an 11.75% increase from the first quarter.

The report shows that the company is actively promoting capacity construction projects in Shanghai Lingang and Taiyuan, Shanxi. The combined monthly production capacity of 300mm semiconductor silicon wafers in Shanghai and Taiyuan has reached 750,000 wafers. In the first half of 2025, the company's R&D investment totaled 155 million yuan, a 25.88% increase over the same period last year, with R&D expenses accounting for 9.16% of operating revenue. In the first half of the year, Shanghai Silicon Industry developed over 50 new 300mm semiconductor silicon wafer products. The company achieved a breakthrough in the development of SOI materials based on 300mm silicon wafer technology and has begun shipping samples in bulk to customers in the RF, power device, and silicon photonics sectors.

Please, Log in or Register to view URLs content!

​

 

[JPaladin32]

Huawei just unveiled the CPU on the Mate XTs launch event. The last publicly announced Kirin chip was five years ago.

 

[tokenanalyst]

 

[tokenanalyst]

China Micro Corporation(AMEC): The company recently launched six new semiconductor equipment products​

China Micro Corporation (AMEC) has launched six new semiconductor equipment products, marking a significant step in its transformation into a high-end semiconductor equipment platform company. The innovations span key processes such as plasma etching, atomic layer deposition (ALD), and epitaxy.

In plasma etching, AMEC introduced two advanced systems:

PrimoUD-RIE®: An upgraded version of the PrimoHD-RIE®, featuring six single-stage reaction chambers. It delivers high ion bombardment energy via a low-frequency, high-power RF bias supply, optimized for ultra-high aspect ratio etching. Key innovations include a dynamic edge impedance adjustment system that improves wafer edge yield and a multi-zone temperature control system enhancing stability and reliability.

The Primo UD-RIE® system utilizes a new temperature-switchable multi-zone electrostatic chuck and an actively temperature-controlled edge assembly, which not only enhances arcing resistance but also significantly improves wafer edge yield, providing strong support for the production of advanced memory chips.



Primo Menova™ 12-inch ICP: Specialized in metal etching (e.g., Al lines and blocks), it supports power semiconductors, memory devices, and advanced logic chips. It offers high etch rates, selectivity, and low dielectric damage, with an efficient chamber cleaning process and integrated degumming to reduce contamination and extend operational time.

Its efficient chamber cleaning process can effectively reduce chamber contamination and extend continuous operation time; the integrated high-temperature water vapor degumming chamber can efficiently remove residual photoresist and byproducts on the wafer surface after metal etching. In addition, the main etching chamber and the degumming chamber can be flexibly combined according to customer process requirements to maximize the satisfaction of high production efficiency requirements and ensure stability and yield in high-load production.



In atomic layer deposition (ALD), AMEC launched the PreformaUniflash® metal gate series — including TiN, TiAl, and TaN variants — designed for advanced logic and memory devices. The system uses a dual-stage design with up to five reaction chambers, enabling high-vacuum integration and superior film uniformity, contaminant control, and production efficiency through advanced gas mixing and heating technologies.

The Preforma Uniflash® metal gate series utilizes AMEC's unique dual-stage design, allowing for flexible configuration of up to five dual-stage reaction chambers. This system meets the demands of high-vacuum system integration while achieving industry-leading production efficiency. Equipped with AMEC's unique multi-stage gas mixing system, this series integrates core technologies such as model-based heating system design and chamber flow conductance design for efficient atomic layer deposition reactions. These core technologies not only meet the performance requirements of advanced logic customers, but also achieve world-class performance in film uniformity, contaminant control, and production efficiency.

With the continuous advancement of semiconductor technology, demand for atomic layer deposition (ALD) technology continues to rise. Metal gate applications, a key component of advanced logic devices, place extremely high demands on precise control of film thickness and characteristics, step coverage, particulate contamination control, and system integration capabilities. The launch of the Preforma Uniflash® series not only further enriches AMEC's thin-film equipment product line but also, leveraging its expertise in high-precision, high-performance ALD, achieves new breakthroughs in semiconductor process applications, opening up broader opportunities for AMEC's long-term development.





In epitaxial growth, AMEC unveiled the PRIMIO Epita® RP, a unique dual-chamber decompression epitaxy system with the world’s smallest reaction chamber volume. It supports up to six chambers, reducing chemical consumption and costs while maintaining high production efficiency. Its independently designed dual-chamber architecture features multi-layer gas partitions and precise temperature control, ensuring excellent flow and thermal uniformity.

The equipment features a dual-chamber design with completely independent intellectual property rights, multi-layer independently controlled gas partitions, and a temperature field and temperature control design with multiple radial adjustment capabilities, ensuring excellent flow and temperature field uniformity and adjustment capabilities. With its excellent process adaptability and compatibility, the equipment can meet the epitaxial growth process requirements of multiple fields, including logic, storage, and power devices, from mature to advanced nodes.



These new products reinforce AMEC's capability in delivering cutting-edge semiconductor equipment essential for next-generation chip manufacturing, supporting both advanced logic and memory technologies.​

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

AI packaging drives PSPI demand, creating a golden opportunity for domestic substitution: Top ten Chinese manufacturers accelerate their breakthroughs​

As the "golden skeleton" in the field of semiconductor packaging, PSPI (photosensitive polyimide) undertakes core functions such as chip surface protection, bump passivation and redistribution layer insulation. Its unique advantage lies in its combination of photosensitivity and extreme environmental tolerance (-269°C to 400°C), making it an essential material for advanced processes such as 2.5D/3D packaging and wafer-level packaging (WLP).



1-Bomi Technology Co., Ltd.:
Was established in April 2017. It specializes in the research and development, production, sales and technical services of polyimide materials. It broke the 40-year monopoly of foreign countries in photosensitive polyimide coating adhesives and has a current production capacity of 500 tons.Bomi Technology focuses on the research and development and industrialization of semiconductor materials such as " photosensitive polyimide and polyimide liquid crystal alignment agents " .
In 2024, Bomi Technology will undertake the national key R&D program project "Research and Application of Key Technologies of Photosensitive Polyimide Materials for 2.5D/3D Packaging Technology" . The R&D results will provide key material support for the development of domestic AI chips.

2-Jiangsu Aisen Semiconductor Materials Co., Ltd.:
Established in 2010, is a major supplier of key semiconductor materials and a key player in the wafer wet chemical market. The company successfully listed on the STAR Market (stock code: 688720.SH) in December 2023, becoming the first photoresist stock listed on the STAR Market. The independently developed positive PSPI product was officially shipped in 2024 , which is the first domestically produced material order for positive PSPI in a mainstream wafer fab.
At the same time, we are actively developing negative PSPI, low-temperature cross-linked PSPI, ultra-high-sensitivity PSPI, and PI-like materials. Currently, advanced packaging negative photoresist is being used for customer wafer verification at a leading advanced packaging and testing facility.

3-Dinglong Holdings:
Founded in 2000, Hubei Dinglong Holding Co., Ltd. has been engaged in the research, development, and production of cutting-edge materials for key industries. In strategic areas such as integrated circuit design, semiconductor process materials, semiconductor display materials, and printing and copying consumables, the company has successfully developed a series of high-tech products with independent intellectual property rights.Dinglong Co., Ltd.'s series of PSPI positive/negative photoresists are specially designed for advanced packaging and support g/h/i line exposure. They can achieve a resolution of 5μm to 10μm and meet the precision requirements of most packaging structures. The product offers a wide range of performance, with film thickness options ranging from 5μm to 15μm and compatible with curing processes from 200°C to 400°C. After high-temperature cross-linking and imidization, the resulting polyimide film exhibits comprehensive and excellent ultimate performance.

4. Changzhou Qiangli Electronic New Materials Co., Ltd:
Qiangli New Materials was founded in 2000. It is a high-tech enterprise focusing on the research and development of electronic materials, green photosensitive materials and semiconductor materials. Its main products include photoinitiators, resins, etc., and it continues to innovate and expand into new fields such as advanced semiconductor packaging materials and high-end display materials.
Recently, Qiangli New Materials has deployed PSPI and electroplating solutions in the field of semiconductor packaging , and developed high-temperature/low-temperature curing PSPI , which is currently under small-batch verification.

5. Jinan Shengquan Group Co., Ltd:
Founded in 1979, Shengquan Group is a high-tech enterprise specializing in independent research and development and innovative applications of various plant straws and synthetic resins. The production and sales scale of its leading products, furan resin and phenolic resin, ranks among the top in the world.
Shengquan Group currently has a synthetic resin production capacity exceeding 1.2 million tons/year and possesses the technological foundation for rapid expansion of PSPI production. An 8-inch wafer-level PSPI pilot line was completed and put into production in 2024, with completion expected in Q1 of 2025. The company plans to build a 1,000-ton production line by 2025, with a target cost over 30% lower than imported products.

6. Mingshi New Materials Co., Ltd.:
Mingshi New Materials was established in 2017 and focuses on the research, development, production and sales of photosensitive polyimide (PSPI, PSPBO) in the semiconductor and display fields. Its products include negative PSPI, positive PSPI/PBO, photosensitive PI film, high-performance non-photosensitive PI, BCB, etc., which are widely used in advanced packaging, power device IGBT, memory devices, MEMS and display panels. PAE-806s High Temperature Positive PSPI Photoresist
Leveraging years of technological expertise and rigorous R&D and validation, Mingshi has launched a variety of low-temperature PSPI products that meet the requirements of advanced packaging. The PAE-130 (negative PI) and PBO-801 (positive PBO) series products have been fully validated by multiple companies and maintain a stable supply. Low-temperature PSPI products are already undergoing validation at several key packaging companies.
The company's advanced photosensitive polyimide (PSPI) photoresist project has a first -phase production capacity of 20 tons/year, and the second-phase production capacity is planned to reach 500 tons/year by the end of 2026.

7. Jilin Aolaid Optoelectronic Materials Co., Ltd:
Founded in 2005 and headquartered in Changchun, Jilin Province, Orlight is a leading domestic company specializing in OLED materials and evaporation source equipment. In the photoresist field, the company has a presence in both PSPI and PR materials. PSPI is a photoresist used in OLED display manufacturing , and the company has already achieved production line supply.
In the first half of 2025, Orlight's materials business is expected to achieve revenue of 250-260 million yuan , a year-on-year increase of 18.7%-23.4%. This growth is primarily due to the continued increase in the volume of OLED finished materials at the client end and the introduction of new products such as PSPI .
In the fields of packaging materials and PSPI, we have accelerated the localization process of related products in the thinning formula of packaging materials such as PFAS-Free PSPI and the development of low dielectric constant technology.

8. Nantong Jingai Microelectronics Technology Co., Ltd.:
Nantong Jingai Microelectronics Technology Co., Ltd. is a high-tech enterprise specializing in the research and development, production, sales and technical support of polyimide materials for microelectronics.
Nantong Jingai's main products include photosensitive polyimide, non-photosensitive polyimide, special functional polyimide, liquid crystal alignment agents, etc. Some of these products have reached the performance requirements of similar imported products and are recognized by customers.

9. Shanghai Feikai Materials Technology Co., Ltd.:

Shanghai Feikai Materials Technology Co., Ltd. Since its establishment in 2002, Feikai Materials Technology has always focused on innovation and breakthroughs in the materials industry.
Feikai Materials is a company focusing on electronic chemicals and new materials. It initially started out by breaking the foreign monopoly with UV-curing optical fiber coating materials, and gradually grew to cover multiple fields including semiconductors, display panels, and optical communications. It is one of the few companies in China that has achieved a full range of semiconductor packaging materials.
In the advanced packaging sector, their product offerings include photoresists suitable for 2.5D/3D packaging technologies. Our temporary bonding solutions meet customer process requirements, and our ULA tin alloy microspheres address the domestic bottleneck of advanced packaging substrates. We also offer solder balls, epoxy molding compounds, and other products to serve customers across a wide range of packaging applications.

10.Shanghai Wenxin Technology Co., Ltd.:

Shanghai Wenxin Technology Co., Ltd., founded in 2019, specializes in the research, development, production, and sales of photo- and thermosetting functional materials. The company has developed a range of photosensitive dielectric materials, optical adhesives, and photolithographic polyimides, primarily for applications in 5G optical communications, new display technologies, and advanced semiconductor packaging.
Shanghai Minxin's PSPI products have high resolution, high sensitivity, low water absorption and other properties.They are used in new display and advanced semiconductor packaging. They are used to flatten and protect some layers with high step differences, as well as provide dielectric insulation protection. At the same time, they require openings and patterning.
The materials developed by Minxin Technology are divided into acrylic system, polyimide system and epoxy resin system. The final products are used as interlayer materials in display and semiconductor devices. It has two production bases in Shanghai and Quzhou, and the annual production capacity of various display and semiconductor-related products is about 1,500 tons.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

NationalChip Technology: New high-performance automotive BLDC motor drive control chip successfully completed internal testing​

NationalChip Technology's Guoxin Technology has successfully completed internal testing of its new high-performance automotive brushless DC (BLDC) motor drive control chip, the CBC2100B. Developed using a 130nm BCD process, this three-phase BLDC motor drive chip is designed for automotive applications such as water pumps, oil pumps, and air-conditioning fans, as well as industrial control systems.



Key features include:
- Support for input voltages up to 28V, compatible with both 12V/24V automotive and industrial systems.
- An embedded 32-bit CPU core with programmable control and integrated PWM module for flexible output.
- Sensorless control via an on-chip BEMFC module.
- MOSFET/IGBT gate drivers capable of delivering up to 350mA gate drive current, with programmable output currents.
- On-chip power management and low-power modes to simplify design and improve efficiency.
- Embedded security features including AES-128 encryption and secure boot for data protection.
- Multiple automotive-standard communication interfaces: LINFlex, CANFD (with integrated transceiver), and SPI.
- Comprehensive motor protection against overvoltage, undervoltage, overcurrent, overtemperature, and external short circuits.
- 128KB Flash, 32KB SRAM, and 32KB ROM for efficient system operation.

Designed to meet automotive Grade 0 and ASIL-B functional safety standards, the CBC2100B offers high reliability and safety. It is available in LQFP64/TQFP64/LQFP48/TQFP48 packages and competes with Infineon’s TLE988x/9x series, supporting both sensored and sensorless FOC (Field-Oriented Control) control.

Guoxin Technology has already distributed samples to customers, who are now actively integrating the chip into their product development pipelines.​

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Immersion lithography sub-system provider Qier Electromechanical showcased their ultra-clean products.​

the 13th Semiconductor Equipment, Core Components, and Materials Exhibition opened at the Wuxi Taihu International Expo Center. Zhejiang Qier Electromechanical Technology Co., Ltd., a national high-tech enterprise and a specialized "little giant" enterprise, exhibited its ultra-clean fluidic components, including liquid purification systems, magnetic levitation pumps, bellows pumps (bladder pumps), and liquid ultrasonic flow sensors and controllers.

Qier Electromechanical , formerly a research team from the State Key Laboratory of Fluid Power and Electromechanical Systems at Zhejiang University, has been deeply engaged in the research and development of semiconductor equipment components for over 20 years. Its products have been widely used by leading domestic semiconductor equipment companies and chip production lines, contributing to the independent development of domestic equipment. During the exhibition, the company will engage in in-depth exchanges with representatives from the global industry chain on the localization of core components and technological innovation, providing innovative momentum for the high-quality development of the industry.​

Please, Log in or Register to view URLs content!