Reduced profits translate more into more money spend in research and development, overcoming US sanctions and expanding. No necessary in low yields. A bad chip is a chip that is not sold, so a decrease in revenue, I guess.
Chinese semiconductor thread II
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Hefei Tianyao, a developer of semiconductor material cadmium zinc telluride, has completed a round of financing worth tens of millions of yuan.
Hefei Tianyao New Materials Technology Co., Ltd. (hereinafter referred to as "Hefei Tianyao"), a developer of semiconductor materials cadmium zinc telluride, completed a round A financing of tens of millions of yuan, led by Houxue Capital and followed by SMIC Juyuan and Guoyuan Fund. The funds will be mainly used for production line expansion and product research and development, expansion of overseas markets and downstream detector integration business.
Public information shows that Hefei Tianyao was established in April 2020 and is located in the Economic and Technological Development Zone of Hefei City. It is a high-tech enterprise focusing on the research, development, production and sales of third-generation strategic semiconductor crystal materials. Its core products are cadmium zinc telluride (CdZnTe) substrates and devices. It is expanding high-end indium phosphide (InP) and aluminum nitride (AlN) compound semiconductor products. It is committed to breaking the technology monopoly of Europe, the United States and Japan, and realizing the independent control of domestic high-end semiconductor materials.
Cadmium zinc telluride (CdZnTe), known as the "golden material," is crucial in infrared and radiation detection due to its high resistivity, wide bandgap, and strong radiation absorption. Hefei Tianyao has successfully increased its yield rate from the industry average of 10% to over 50%, rivaling the performance of Japanese companies.
Public information shows that Hefei Tianyao was established in April 2020 and is located in the Economic and Technological Development Zone of Hefei City. It is a high-tech enterprise focusing on the research, development, production and sales of third-generation strategic semiconductor crystal materials. Its core products are cadmium zinc telluride (CdZnTe) substrates and devices. It is expanding high-end indium phosphide (InP) and aluminum nitride (AlN) compound semiconductor products. It is committed to breaking the technology monopoly of Europe, the United States and Japan, and realizing the independent control of domestic high-end semiconductor materials.
Cadmium zinc telluride (CdZnTe), known as the "golden material," is crucial in infrared and radiation detection due to its high resistivity, wide bandgap, and strong radiation absorption. Hefei Tianyao has successfully increased its yield rate from the industry average of 10% to over 50%, rivaling the performance of Japanese companies.
North Huachuang announced their first half results
In the first half of 2025, North Huachuang achieved operating income of 16.142 billion yuan, a year-on-year increase of 29.51%; and achieved net profit attributable to shareholders of listed companies of 3.208 billion yuan, a year-on-year increase of 14.97%.
North Huachuang focuses on the research and development, production, sales and technical services of semiconductor basic products. Its main products are electronic process equipment and electronic components. Electronic process equipment includes semiconductor equipment, vacuum and new energy equipment.
In the first half of 2025, the company completed the acquisition of Shenyang Xinyuan Microelectronics Equipment Co., Ltd., enriching its presence in front-end physical and chemical cleaning . Shenyang Xinyuan Microelectronics Equipment Co. , Ltd.'s main products are developing equipment and cleaning equipment, many of which can be used in OLED manufacturing.
In terms of technological achievements, NAURA has successively reached the 1,000th delivery milestone for its vertical furnace and physical vapor deposition (PVD) equipment. Together with the etching equipment, which previously achieved this milestone, the company's cumulative shipments of these three core equipment products have exceeded 1,000 units. The company has also released new products, including ion implantation equipment, electroplating equipment, an advanced low-pressure chemical vapor silicon deposition vertical furnace, and metal organic chemical vapor deposition equipment .
North Huachuang focuses on the research and development, production, sales and technical services of semiconductor basic products. Its main products are electronic process equipment and electronic components. Electronic process equipment includes semiconductor equipment, vacuum and new energy equipment.
In the first half of 2025, the company completed the acquisition of Shenyang Xinyuan Microelectronics Equipment Co., Ltd., enriching its presence in front-end physical and chemical cleaning . Shenyang Xinyuan Microelectronics Equipment Co. , Ltd.'s main products are developing equipment and cleaning equipment, many of which can be used in OLED manufacturing.
In terms of technological achievements, NAURA has successively reached the 1,000th delivery milestone for its vertical furnace and physical vapor deposition (PVD) equipment. Together with the etching equipment, which previously achieved this milestone, the company's cumulative shipments of these three core equipment products have exceeded 1,000 units. The company has also released new products, including ion implantation equipment, electroplating equipment, an advanced low-pressure chemical vapor silicon deposition vertical furnace, and metal organic chemical vapor deposition equipment .
This may be the first ReRAM AI Card ever. ReRAM could probably allows compute in memory.
Suzhou Daweige plans to acquire Changzhou Weipu Semiconductor
Suzhou Daweige plans to acquire up to 51% equity of Changzhou Weipu Semiconductor Equipment Co., Ltd. in cash. Upon completion, Suzhou Daweige will gain a controlling stake.
Suzhou Daweige is a leading domestic manufacturer and technology service provider of micro-nanostructure products. It develops key equipment for micro-nano-optical manufacturing including laser direct writing lithography machines and nanoimprint lithography machines, establishing an integrated R&D and production platform offering design, development, and manufacturing services for micro-nano-optical products.
Suzhou Daweige is a leading domestic manufacturer and technology service provider of micro-nanostructure products. It develops key equipment for micro-nano-optical manufacturing including laser direct writing lithography machines and nanoimprint lithography machines, establishing an integrated R&D and production platform offering design, development, and manufacturing services for micro-nano-optical products.
In the first half of 2025, Suzhou Daweige's operating income was approximately RMB 982 million, up 5.27% year-on-year.
Changzhou Weipu is a Jiangsu Province "little giant" enterprise specializing in innovative semiconductor equipment. Its main products are photomask defect inspection equipment and wafer defect inspection equipment—core tools for semiconductor mass testing. It is one of the few Chinese companies to achieve large-scale production of photomask defect inspection equipment, with independently developed technology, products, and core algorithms possessing full intellectual property rights. Its products have been adopted in mass production lines at leading domestic and international wafer fabs and mask manufacturers.
The acquisition will allow Suzhou Daweige to leverage Changzhou Weipu’s customer base, reducing customer development costs and product verification cycles. Laser direct writing lithography machines and photomask defect inspection equipment share similar core components: optical systems, core algorithms, software systems, precision motion control platforms, and electrical/electronic control systems. Suzhou Daweige has strong expertise in optical systems and precision motion control; Changzhou Weipu excels in core algorithms, software systems, and electrical/electronic control systems. The combination will enhance R&D capabilities in direct writing lithography, accelerate product iteration, strengthen equipment competitiveness, support strategic goals, and align with national integrated circuits development initiatives.
You have to have technical knowledge to know how to read the information. The people in American finance and media mostly don’t.
Chinese team from CAS 宁波材料 achieves breakthrough in ultra thin, ultra flat 4-inch diamond films. Provides a core material solution for solving the warpage problem that has long plagued the chip thermal management issue. It's a key step forward for heat dissipation substrate for next generation high power chips.
Can be used for high power RF IC (GaN HEMT) as dissipation substrate.
3rd generation ICs (SiC/GaN) packaging as heat sink
micro electronics packaging and laser gear cooling and heat sinks. Could be used in AI chips, auto power modules and advanced communication.
芯碁微装 (CFMEE, Xingji Micro) announced company's production capacity is overloaded. In March, its monthly shipment exceeded 100 units, a new record, April deliveries increased by nearly 30% MoM.It is working on phase 2 facility
Its products include PCB direct imaging equipment and automated production lines, and semiconductor direct-write lithography equipment and automated production lines. Its wafer-level packaging (WLP) models for the semiconductor industry support advanced process technologies such as 2.5D/3D packaging, CoWoS (chip-on-wafer), and SoW (wafer-level system).
Its products include PCB direct imaging equipment and automated production lines, and semiconductor direct-write lithography equipment and automated production lines. Its wafer-level packaging (WLP) models for the semiconductor industry support advanced process technologies such as 2.5D/3D packaging, CoWoS (chip-on-wafer), and SoW (wafer-level system).
Definitely true and a lot of the reporting reflects that.
However semiconductor industry experts in the US do have that technical knowledge, and I'm sure they are aware of what China is doing, considering people here are also aware. We don't hear from them at all and I highly doubt we are the only people in the western world with that sort of knowledge.
It'll be interesting to see how China's EUV makes it into the news sooner or later.
Huahai Qingke's 12-inch wafer edge trimming equipment is shipped in batches to leading domestic semiconductor companies
Recently, the 12-inch wafer edge trimming equipment Versatile-DT300 independently developed by Huahai Qingke Co., Ltd. (referred to as "Huahai Qingke", stock code 688120) has been shipped in batches to many domestic semiconductor companies and has been recognized by the market.
The edge trimming equipment processes the edges of wafers during the stacking process, effectively reducing the risk of edge collapse and cracking before and after thinning, coating and other processes, thereby improving chip production yield. Huahai Qingke's Versatile-DT300 has excellent process performance and stable mass production capabilities. The equipment is flexibly compatible with a variety of complex processes such as fully automatic dual-axis cutting, one-time alignment and multiple feed cutting, and angle cutting to meet the wafer processing needs of different customers. It can achieve micron-level precision control of cutting width and cutting depth, and exhibits excellent cleaning performance, reaching domestic leading and internationally advanced technical levels. At present, Huahai Qingke's edge trimming equipment has completed large-scale sample processing for more than ten customers, and has obtained multiple repeat purchase orders and in-depth cooperation intentions.
With the rapid development of 3D IC and advanced packaging technologies, the application of multi-layer wafer stacking processes is becoming increasingly widespread. To improve product yield, wafer edge processing is required both before and after the stacking process, and the processing requirements for this step are constantly increasing. Wafer edge trimming has become an indispensable step in the advanced processes and manufacturing of high-bandwidth memory (HBM), through-silicon vias (TSV), back-illuminated sensors (BSI), and microelectromechanical systems (MEMS), and the market demand for corresponding equipment has increased significantly. Huahai Qingke's edge trimming equipment, with its highly flexible process adaptability and continuous iterative upgrade capabilities, is well aligned with the market trend towards more sophisticated and diversified processing.
The mass shipment of the Versatile-DT300 marks another breakthrough for Huahai Qingke in its comprehensive solutions for 3D IC cutting, grinding, and polishing. This not only demonstrates the company's technological strength in high-end semiconductor equipment, but also highlights the increasing competitiveness of domestically produced equipment in the semiconductor industry chain. Going forward, Huahai Qingke will continue to uphold its core values of "customer-oriented, innovation-driven, and superior quality," further deepening its "equipment + service" platform development strategy, and contributing to the independent, controllable, and high-quality development of China's semiconductor industry.