Chinese semiconductor thread II

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Ruimeng Semiconductor completes tens of millions of RMB in pre-A+ round financing, deploying AI chip cooling​


Shenzhen Ruimeng Semiconductor Co., Ltd. ("Ruimeng Semiconductor") recently announced the completion of tens of millions of RMB in pre-A+ round financing, jointly invested by Hechuang Capital and Yida Capital. The funds will be primarily used for the company's intelligent human-machine interface processor chip R&D and market expansion. Yuewei Capital served as exclusive financial advisor. This is Ruimeng Semiconductor's third round of financing in a year, bringing its annual financing total to nearly 100 million RMB.

According to public information, Ruimeng Semiconductor, founded in August 2020, is a high-tech enterprise specializing in intelligent human-machine interface processor chips and solutions. The company is committed to the research and development of cutting-edge technologies such as intelligent tactile perception, intelligent voice wake-up and recognition, and intelligent brain-computer interfaces. It has proposed the innovative concept of "user-defined interface" and aims to empower various smart devices through chip technology to enhance the user experience. Currently, Ruimeng Semiconductor's products are widely used in TWS headphones, smartphones, smart Internet of Things, wearable smart devices, smart cars, health care and other fields.

Ruimeng Semiconductor is accelerating the large-scale commercialization of active cooling microsystems for smart terminals and high-computing chip-level applications. The company's MagicCool cooling micropump product achieves a breakthrough balance between millimeter-level thickness and industrial-grade cooling performance. Based on piezoelectric MEMS technology and compatible with existing semiconductor and advanced packaging processes, it is a full-stack cooling solution that uses high-frequency piezoelectric vibrations to drive the flow of gas or liquid, achieving efficient heat dissipation. Currently, the company is collaborating deeply on mass production projects with several leading end-users and is about to achieve mass shipments

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Semiconductor testing equipment company Zhongdao Optoelectronics starts IPO guidance​


According to the official website, Zhongdao Optoelectronics was established in 2006. Since its inception, it has been targeting the field of testing equipment with extremely high technical barriers in the semiconductor industry chain. It is a national-level specialized and innovative "little giant" and was selected as a gazelle enterprise and innovative small and medium-sized enterprise in 2023. Zhongdao Optoelectronics is a domestic company that can mass-produce "graphic" testing equipment for display panels and semiconductor front-end processes. It is mainly engaged in the research and development, production and sales of automatic optical inspection equipment for display panels and semiconductor wafers. The company focuses on the front-end inspection link with obvious "bottleneck" characteristics, relying on its independently developed core technology, and is committed to promoting the localization process of high-performance testing equipment; by providing high-end equipment and services to internationally renowned display panel and semiconductor wafer manufacturers, it helps customers optimize process technology, improve yield and production efficiency, and reduce production costs.

In June of this year, Zhongdao Optoelectronics completed a new round of financing, raising nearly 100 million yuan from several large, well-known funds. The funds raised will be primarily invested in the research and development of display panel and semiconductor technologies and products, continuing to expand its high-performance semiconductor product portfolio to cover a wider range of application scenarios. The company is committed to improving front-end wafer defect inspection capabilities, mass-producing products at 90nm to 40nm process nodes, and accelerating their adoption in the manufacturing lines of industry-leading customers. Furthermore, the company will soon launch a prototype with even more advanced detection sensitivity for customer validation.

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Gallium Future completes RMB100 million Series B++ financing, focusing on the research and development of gallium nitride power devices​


Zhuhai Gallium Future Technology Co., Ltd. (Gallium Future) recently completed a multi-million-yuan Series B++ financing round led by Beihai Shanpangbang Investment Partnership (Limited Partnership). This financing will further propel Gallium Future's innovation and development in semiconductor device R&D and the photovoltaic field.

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Public information indicates that Gallium Future, founded in 2020, is a high-tech enterprise specializing in the research and development of semiconductor devices, particularly gallium nitride power devices, and is committed to providing users with high-performance gallium nitride device products and chip testing services. The company has mass-produced over 40 product models, covering a wide range of application scenarios including mobile phones, photovoltaic microinverters, and AI supercomputing. Its clients include leading companies such as Lenovo, Xiaomi, and APsystems.
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Previously, Gallium Future has completed multiple rounds of financing, and its historical investors include Shunwei Capital, Hillhouse Capital, and Zhuhai Science and Technology Venture Capital.


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