Shanghai Hejingli Joint Venture specializes in SOI silicon wafers
Shanghai Hejing disclosed a major industrial layout at an institutional performance exchange meeting. The company will establish a joint venture to focus on the SOI silicon wafer track and plans to build a 12-inch SOI wafer production line in three phases, with a long-term annual capacity of 216,000 wafers. This will allow the company to enter the blue ocean market of high-end semiconductor silicon wafers and accelerate the domestic substitution of core silicon-based materials.
This SOI project will create industrial synergy with the Zhengzhou 12-inch epitaxial wafer production line. The second phase of the Zhengzhou 12-inch epitaxial production line will be put into operation in June, adding an annual capacity of 720,000 wafers. After reaching full capacity, the company's total 12-inch integrated epitaxial capacity will reach 1.2 million wafers. The mature large-size production line can provide mature process support for SOI R&D and mass production, effectively sharing equipment, R&D and operating costs, and significantly reducing the threshold for the mass production of high-end silicon wafers.
The continued expansion of AI computing power, new energy vehicles, and the communications radio frequency industry is driving a sustained increase in demand for SOI silicon wafers. Previously, domestic companies lacked stable local supply channels, posing a risk to the security of the supply chain. Shanghai Hejing has implemented a phased rollout of 216,000 SOI wafers, which will provide domestic downstream chip design and wafer manufacturing companies with a self-sufficient and controllable supply of high-end silicon wafers, alleviating overseas supply constraints.
