Chinese semiconductor thread II

[tphuang]

Please, Log in or Register to view URLs content!

晶镁半导体's high end photomask has been topped out. It's for the production of 28nm and above photomask. Expects to produce 3200 per year with a high automated production line. Phase 1 attracted investment of 6.5B RMB. To enter production by 2027.

 

[tphuang]

Please, Log in or Register to view URLs content!

U-Precision delivering its W2W Fusion Bonding Equipment to customer. Another milestone for the company after its D2W chiplet hybrid bonding equipment got delivered in 2026/2/4

This equipment/technology can be used for 3D IC stacking. It fills a whole in China's advanced packaging equipment, especially HBM supply chain, where domestic market share is 5%.

Can be used to vertically stack multiple DRAM chip layers

 

[pbd456]

many years ago, I remember we discussed about a Huawai patent on chiplet. is that really for logic folding?

 

[tokenanalyst]

Please, Log in or Register to view URLs content!

U-Precision delivering its W2W Fusion Bonding Equipment to customer. Another milestone for the company after its D2W chiplet hybrid bonding equipment got delivered in 2026/2/4

This equipment/technology can be used for 3D IC stacking. It fills a whole in China's advanced packaging equipment, especially HBM supply chain, where domestic market share is 5%.

Can be used to vertically stack multiple DRAM chip layers

Uprecision, Piotech, ISabers look like they are big three in bonding technology in China. Piotech and ISabers looks like they have a more complete with metrology and surface treatment. U-precision seems to be weaker in that part but given that they do wafers stages for lithography machines, I estimate that their tools are the most precise in the market, thought HB precision is in the range of 200nm to a few microns.