While maintaining a high cycle time, the product achieves low vibration control, meeting the stringent requirements of the packaging process for particle size and yield. The overall MCBF (mean time between failures) exceeds 150,000 cycles, and its stability indicators surpass those of similar products from leading international competitors.
On June 8 , Suzhou Xinshenguo launched its newly developed 50kg heavy-duty PLP OHT ( Panel Level Package Overhead Hoist Transport ), providing board-level packaging factories with a high-cleanliness, high-precision, and high-reliability automated handling solution .
As the first company in China to achieve PLP OHT from design and manufacturing to production line delivery, the product released by NewSino not only fills the gap in the company's high-load product line, but also marks a key step forward for China in the field of next-generation semiconductor advanced packaging logistics equipment.
PLP OHT : Magnitude Restructuring of Transportation Demand
As AI chips continue to demand higher integration and performance, the limitations of 12- inch wafer-level packaging (WLP) in terms of area utilization and cost control are becoming increasingly apparent. The industry is accelerating its shift to large-size rectangular board-level packaging as a new carrier, and PLP technology is thus rapidly moving from the proof-of-concept stage to the early stages of industrialization.
However, the material handling requirements of PLP factories are fundamentally different from those of traditional semiconductor factories: traditional overhead cranes handle 300mm wafer cassettes weighing no more than 15 kg , while PLP carriers weigh up to 50 kg. This means that the clamping mechanism, lifting structure, vibration damping design, and safety system of the overhead cranes face a reconstruction on a scale, rather than a simple upgrade of the existing semiconductor overhead crane solutions.
At the same time, PLP factories have strict requirements for cleanliness. The overhead cranes must meet cleanroom standards, and there are strict restrictions on power supply, communication, and materials.
Addressing this industry pain point, NewSino has conducted forward R&D focused on PLP scenarios, achieving comprehensive innovation. The newly launched PLP OHT product boasts a 50kg load capacity and can still achieve a linear speed of 180m/min under full load conditions , with ±1mm high-precision positioning and ≤0.5G low-vibration control. It supports CPS contactless power supply and full traceability throughout the handling process. Combined with Class 10 ultra-high cleanliness standards, it comprehensively ensures the yield and reliability of advanced packaging processes.
This product achieves low vibration control while maintaining high cycle time, meeting the stringent requirements of packaging process for particle size and yield. The overall MCBF (mean time between failures) exceeds 150,000 cycles, and its stability indicators surpass those of similar products from leading international competitors.
Unlike traditional AMHS manufacturers that focus on hardware architecture , NewSino's core competitiveness lies in its full-stack self-developed capabilities integrating hardware and software. Its independently developed MCS ( Material Control System), TCS (Overhead Crane Control System), and VCS (Vehicle Control System) are deeply coupled and embedded with AI optimal allocation algorithms, enabling real-time collaborative scheduling, dynamic path planning, and congestion prediction for large-scale fleets, significantly improving production line throughput efficiency and equipment utilization.
In addition, the product adopts a non-contact power supply solution, supports data traceability throughout the entire handling process, and is equipped with a large-stroke lifting mechanism and a single-sided sliding mechanism, which can flexibly adapt to the diverse equipment layout needs of downstream packaging and testing plants.
