Chinese semiconductor thread II

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1. High-speed 3D stacked GaN/SiC cascode power device with superior switching speed control capability

For many years, the low MOS channel mobility ( < 40 cm 2 /V · s ) of commercial SiC MOSFETs has been a bottleneck problem that restricts wide bandgap SiC materials from fully releasing their performance. The GaN/SiC hybrid cascode device proposed by Professor Chen Jing's research group replaces the low-mobility MOS channel of SiC MOSFET with a GaN - based 2DEG channel, greatly improving the channel mobility to around 2000 cm 2 /V · s . In order to give full play to the switching performance of GaN/SiC cascode devices, the team developed a 3D stacked packaging solution for the device, effectively solving the long-standing parasitic inductance bottleneck of sealed devices. Compared with the latest generation of wide bandgap semiconductor 1.2 kV high-power commercial devices, the switching speed of the new device has been significantly improved.​

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2. All-GaN-based semiconductor gate enhancement HEMT for gate high voltage protection and optical-electrical synchronous drive

In recent years, p -GaN gate enhancement mode GaN- based power HEMT has achieved rapid development and initial commercialization, but due to the lack of intrinsic gate overvoltage protection structure, the device is troubled by low gate withstand voltage capability and safe gate voltage limit during use. In response to this bottleneck, Professor Chen Jing's research group proposed to use N- type doped GaN cap layer as semiconductor gate to replace the traditional metal gate to construct n-GaN/p-GaN/AlGaN/GaN enhancement mode HEMT . The specific structure is shown in Figure 2-1 , where the n-GaN above the active area channel is the intrinsic gate ( IG ), and the external gate ( XG ) outside the active area is connected to the gate metal to provide gate voltage.​

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3. Wide-bandgap semiconductor reconfigurable neural transistor for reservoir computing

Jing's research group proposed a reconfigurable transistor based on gallium nitride (Figure 3-1 ). The device is based on the p-GaN/AlGaN/GaN platform, uses p- type gallium nitride as the channel material, and combines different gate structure designs to form volatile and non-volatile memory devices, which serve as the reserve layer and readout layer in the reserve pool calculation, respectively. Among them, the volatile device is based on the gate structure of top gate / dielectric / floating gate / semiconductor / back gate, uses the floating gate as the medium for short-term charge storage, and uses the double gate structure to adjust the nonlinear input and output response and short-term memory retention time of the device, respectively, to achieve a reconfigurable physical reserve pool. The non-volatile device is based on the gate structure of top gate / dielectric / semiconductor / back gate, uses the deep energy level trap state of the dielectric / semiconductor interface as the medium for long-term charge storage, and uses electron and hole injection to achieve fast weight update, multi-state storage and high durability. Using this reconfigurable transistor, a highly adaptable reserve pool computing system was further constructed to achieve chaotic time series prediction on different time scales

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Zhejiang Jiaxing, 1.23 billion semiconductor material project landed​


Lianwei issued an announcement stating that the company plans to sign an "Investment Agreement" with the Management Committee of Jiaxing Nanhu High-tech Industrial Park to invest in the "annual production of 960,000 pieces of 12-inch silicon epitaxial wafer project" in Jiaxing Nanhu High-tech Industrial Park. The total planned investment of the project is 1.23 billion yuan.

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Lianwei said that in recent years, benefiting from the rapid growth of the market size of power devices and analog chips downstream of the company's silicon wafer business, the market demand for epitaxial wafers has also continued to expand.

Given that the company's holding subsidiary Jiaxing Jinruihong has built a 150,000-piece/month 12-inch silicon polished wafer production capacity by the end of 2024, in order to meet customers' demand for silicon wafer epitaxy growth for high-performance integrated circuits, the company plans to further extend the epitaxial wafer production capacity based on Jiaxing Jinruihong's 12-inch advanced process lightly doped polished wafers to meet customer needs and improve the company's strategic layout.

It is expected that after the project is fully completed and put into production, it will have an annual production capacity of 960,000 12-inch silicon epitaxial wafers. The implementation site is located in the factory of Jiaxing Jinruihong Microelectronics (Jiaxing) Co., Ltd. and will be implemented by Jinruihong Angxin Microelectronics (Jiaxing) Co., Ltd., a wholly-owned subsidiary of Lianwei. The construction period is about 5-8 years, and the funds will come from self-owned funds and self-raised funds.

Lianwei's main business covers three major sectors: semiconductor silicon wafers, semiconductor power device chips, and compound semiconductor RF chips, and its products are widely used in multiple fields.

As of January 2025, Lianwei has a monthly production capacity of 600,000 6-inch polished wafers (including substrate wafers), 570,000 8-inch polished wafers (including substrate wafers), and 700,000 6-8 inch (compatible) epitaxial wafers (expected to reach 900,000 wafers/month by the end of March 2025). The Quzhou base also has a monthly production capacity of 150,000 12-inch polished wafers (including substrate wafers) and 100,000 12-inch epitaxial wafers.

The Jiaxing base has a monthly production capacity of 150,000 12-inch polished wafers. The 1.23 billion yuan new 12-inch silicon epitaxial wafer project is a further expansion of Lianwei's existing production capacity, aiming to meet customers' demand for silicon wafer epitaxy for high-performance integrated circuits.

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Shenzhen Pinghu Laboratory has made important progress in the field of SiC substrate laser lift-off technology​


According to the official microblog of Shenzhen Pinghu Laboratory, in order to reduce material loss, the New Technology Research Department of Shenzhen Pinghu Laboratory has developed a laser lift-off process to replace the traditional multi-wire cutting process. The process diagram is shown below:
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Comparison between laser lift-off process and multi-wire cutting process:
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Beneficial effect: Using the laser lift-off process, the material loss of 6/8 inch SiC substrate 500μm and 350μm products is ≤120μm, the chip yield is increased by 40%, and the cost per chip is reduced by about 22%.

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Peking University research team and collaborators report the first low-power two-dimensional ring-gate transistor

The research team of Professor Peng Hailin from the School of Chemistry and Molecular Engineering of Peking University and the team of Researcher Qiu Chenguang from the School of Electronics of Peking University published an online research paper titled "Low-power 2D gate-all-around logics via epitaxial monolithic 3D integration" in Nature Materials, reporting the world's first low-power two-dimensional ring-gate transistor (2D GAAFET) and developing a high-performance, low-power two-dimensional ring-gate logic device

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YueMo Advanced officially announced that it had recently completed the trial production of the first ultra-large glass substrate sample, realizing independent research and development and manufacturing of the entire packaging process, and providing an advanced solution for the high-density packaging field with ultra-low warpage characteristics and lightweight advantages. This product has the characteristics of ultra-large size packaging, ultra-thin and ultra-light, and zero-compromise stability.

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With a total investment of 3.05 billion yuan, AMEC has set up a plant in Chengdu Hi-tech Zone and will start production in 2027

Shanghai Advanced Micro-Semiconductor Equipment Co., Ltd. (hereinafter referred to as "AMEC") signed an investment cooperation agreement with Chengdu Hi-tech Zone. The company will set up a wholly-owned subsidiary in Chengdu Hi-tech Zone and build a research and development and production base and a southwest headquarters project.

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Semiconductor equipment manufacturer Sirui Intelligent plans to IPO on the A-share market and has completed the listing guidance filing​

On February 19, the China Securities Regulatory Commission disclosed the filing report on the initial public offering and listing guidance of Qingdao Sirui Intelligent Technology Co., Ltd. (hereinafter referred to as Sirui Intelligent). Its listing guidance institution is Guotai Junan Securities.
According to the official website, Sirui Intelligent was established in 2018, focusing on the research and development, production and sales of key semiconductor front-end process equipment, and providing system equipment products and technical service solutions with independent and controllable core key technologies. The company's products include atomic layer deposition (ALD) equipment and ion implantation (IMP) equipment, which are widely used in many high-tech fields such as integrated circuits, third-generation semiconductors, new energy, optics, and component coating.
In 2018, SIRUI completed the acquisition of 100% equity of Beneq, the birthplace of ALD technology. SIRUI integrated Beneq's overseas cutting-edge technology R&D resources, carried out joint R&D of ALD technology at home and abroad and domestic industrialization, established a complete ALD product system, covering many global leading customers and achieving a leading market competitive position in many segments. At present, SIRUI and its subsidiaries have more than 300 related patents and have strong technical accumulation in ALD technology and applications.
After promoting the transformation and upgrading of ALD business, SIRUI Intelligent has laid out the ion implantation equipment business and achieved a breakthrough. SIRUI Intelligent has carried out research and development with high-energy ion implanters as the entry point to solve the "bottleneck" problem of domestic high-end ion implanters and gradually completed the layout of a full range of models in the silicon-based and compound semiconductor fields.


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