It is learned that on February 21, Jingsheng Electromechanical said in an institutional survey that under the background of the continued recovery of the semiconductor industry, downstream customers have gradually planned and implemented production expansion, and the company's original 8-12 inch large silicon wafer equipment market has been further improved, and it has quickly achieved market breakthroughs in power semiconductor equipment and advanced process equipment. The company's 8-inch silicon carbide epitaxial equipment and optical measurement equipment have been successfully sold, and the 12-inch three-axis thinning and polishing machine has been expanded to domestic leading packaging customers. The 12-inch silicon decompression epitaxial growth equipment has achieved sales and shipments and expanded new customers, and orders for related equipment continue to grow.
6-8 inch silicon carbide substrates are shipped in batches
Jingsheng Mechanical & Electrical has built a large-scale production capacity for 6-8 inch silicon carbide substrates and achieved batch shipments, actively promoted the capacity expansion of 8-inch silicon carbide substrates, and expanded overseas customers; at the same time, the company's core parameter indicators for mass-produced silicon carbide substrates have reached the industry's first-class level. On the basis of maintaining its existing technological advantages, the company will drive development with innovation, pay attention to the development of and make scientific layouts to maintain its technological leadership.
In the field of silicon carbide equipment, the company has developed 6-8 inch silicon carbide crystal growth equipment, slicing equipment, thinning equipment, polishing equipment, epitaxial equipment, measurement equipment, etc., realizing domestic substitution of silicon carbide epitaxial equipment, and innovatively launched double-wafer silicon carbide epitaxial equipment, greatly improving epitaxial production capacity, and successfully .
