Chinese semiconductor thread II

[tokenanalyst]

It also says Naura is involved in Lithography (probably due to the paper Naura released on Lithography) so should take it with a grain of salt.

Naura and SMEE are indirectly connected in lithography research due to the 上海集成电路装备材料产业创新中心有限公司( Shanghai IC Equipment Material Industry Innovation Center Co Ltd) in which both have an stake on it.

Ion Implant companies are interesting part of the table. I want to say this segment will reach 50-60% by this year but not sure. The interesting part is, I knew KingStone and CTEC were making Ion Implant. But I never heard Naura and AMEC getting involved too (@tokenanalyst if you can verify this please).

I don't think directly neither Naura or AMEC are involved in Ion Implantation, AMEC invested in Piotech <deposition> and Raintree Scientific Instruments <metrology>

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Chinese semiconductor industry

https://news.mydrivers.com/1/914/914165.htm more on S70 important things that Moore Threads hve done this is pretty cool, they make it easy to port all the CUDA process to MUSA. This makes it easy going forward for applications to use Moore Threads GPUs, cause there is already a lot of...

www.sinodefenceforum.com

 

[tokenanalyst]

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Qinghe Wafer's new plant started construction, hybrid bonding and C2W technology lead the industry upgrade​

Qinghe Jingyuan Group held a groundbreaking ceremony for a new factory in the Innovation and Entrepreneurship Park of Tianjin Binhai Hi-tech Zone, marking a new chapter in the company's large-scale development.

At the groundbreaking ceremony, leaders from Tianjin Binhai Hi-Tech Zone also attended the ceremony, spoke highly of Qinghe Jingyuan’s past achievements, and expressed full confidence in the company’s future development.

The new plant covers an area of 17,000 square meters and has a huge investment scale. It will be built into a semiconductor bonding technology innovation center integrating production, R&D and testing. After the project is completed and put into production, it is expected to produce about 100 sets of advanced semiconductor equipment annually, with an annual output value of nearly 1.5 billion yuan. The new plant will meet the simultaneous production needs of multiple models of equipment such as W2W hybrid bonding, C2W hybrid bonding, flip-chip bonding, ultra-high vacuum room temperature bonding, and hot pressing bonding.



As a leader in the semiconductor industry, Qinghe Jingyuan has been working hard in the field of advanced semiconductor bonding and integration technology . The company has made significant breakthroughs in hybrid bonding technology and C2W technology. The independently developed 12-inch C2W and W2W bonders have an alignment accuracy of ±50nm, and the accuracy after bonding is better than ±100nm. The performance is comparable to that of international leading companies. These technologies not only realize the interconnection between chips, significantly improve the integration and reliability of products, but also support individual testing and screening of high-quality chips for bonding with higher flexibility, reducing the overall defect rate, while supporting heterogeneous integration, reducing material waste and reducing costs.

In the future, Qinghe Jingyuan will focus on the research and development of bonding equipment for 2.5D/3D advanced packaging , and plans to launch more high-end products to meet the ever-increasing market demand.

Qinghe Jingyuan will continue to uphold the spirit of innovation, pragmatism and enterprising, keep up with the development trend of the global semiconductor industry, constantly bring forth new products to meet the diversified needs of the market, actively expand overseas markets, strengthen cooperation with overseas customers, and promote advanced technologies and products to the world stage. At the same time, we will work with domestic semiconductor companies to jointly promote the rise and prosperity of China's semiconductor industry.

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[Wahid145]

Naura and SMEE are indirectly connected in lithography research due to the 上海集成电路装备材料产业创新中心有限公司( Shanghai IC Equipment Material Industry Innovation Center Co Ltd) in which both have an stake on it.

View attachment 145632View attachment 145633

I don't think directly neither Naura or AMEC are involved in Ion Implantation, AMEC invested in Piotech <deposition> and Raintree Scientific Instruments <metrology>

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Chinese semiconductor industry

https://news.mydrivers.com/1/914/914165.htm more on S70 important things that Moore Threads hve done this is pretty cool, they make it easy to port all the CUDA process to MUSA. This makes it easy going forward for applications to use Moore Threads GPUs, cause there is already a lot of...

www.sinodefenceforum.com

Hmm Makes sense about the Naura being "involved" with the lithography.

And also Naura and AMEC being in Ion Implantation. I wonder where they got that info from or is it correct. Which means there are some problems with that table as I mentioned earlier.

 

[sunnymaxi]

This is very interesting and insightful info. Back in 2022 I saw some reports saying Deposition Tools reached 35-40% self sufficiency at that time.

But in past 2 years of looking at data I realized Deposition Tools self sufficiency is more like what's mentioned in here (15-20%). I think by this year there will be a dramatic rise in Deposition Tools self sufficiency.

I'm no longer worried about the etching tools. Quite confident that they will be on par to leading companies in Etching by this year.

Ion Implant companies are interesting part of the table. I want to say this segment will reach 50-60% by this year but not sure. The interesting part is, I knew KingStone and CTEC were making Ion Implant. But I never heard Naura and AMEC getting involved too (@tokenanalyst if you can verify this please).

It also says Naura is involved in Lithography (probably due to the paper Naura released on Lithography) so should take it with a grain of salt.

Overall 2025 and 2026 will be the year Chinese SME will break the Olygopoly of AMAT, LAM, TEL & KLA. What an amazing accomplishment!

so many mistakes in this chart..

NAURA is not involved in ion implanter neither in Metrology and barely involved in Lithography sector.. don't know on what basis author add NAURA in almost all mentioned tools.. same with AMEC.

basically NAURA/AMEC are two most popular Chinese SME firms so they keep adding their names in everything.
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this chart basically missed many big companies. for example

in ion implantation they missed these two important players

1. Sirui Intelligent Technology Co., Ltd
2. Shuoke Zhongkexin


in fact, Sirui is very very important player in High energy ion implanter sector..
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in Metrology they totally missed out top companies.. LOOL

1. DJEL
2. Angstrom-E
3. Ruili Scientific Instruments (Shanghai) Co., Ltd.

there are many more companies in Metrology..

even in CMP/ALD/PVD author missed many many players. even the localization percentage is completely outdated.

so basically this chart is incomplete..

 

[tokenanalyst]

so many mistakes in this chart..

NAURA is not involved in ion implanter neither in Metrology and barely involved in Lithography sector.. don't know on what basis author add NAURA in almost all mentioned tools.. same with AMEC.

basically NAURA/AMEC are two most popular Chinese SME firms so they keep adding their names in everything.
--------------------------------------------------------------------------
this chart basically missed many big companies. for example

in ion implantation they missed these two important players

1. Sirui Intelligent Technology Co., Ltd
2. Shuoke Zhongkexin

View attachment 145635
in fact, Sirui is very very important player in High energy ion implanter sector..
----------------------------------------------------------------------------------------
in Metrology they totally missed out top companies.. LOOL

1. DJEL
2. Angstrom-E
3. Ruili Scientific Instruments (Shanghai) Co., Ltd.

there are many more companies in Metrology..

even in CMP/ALD/PVD author missed many many players. even the localization percentage is completely outdated.

so basically this chart is incomplete..

The list is missing a lot of companies.

 

[tokenanalyst]

The establishment ceremony of Daohetuo Jingxin Chain Fund was successfully held​

Tuojing Technology has achieved remarkable results in product innovation, market expansion and customer service, but there are still a large number of key technologies and core components in the domestic semiconductor industry that face challenges and bottlenecks. The joint planning and establishment of the Core Chain Fund with Daohe Long-term Investment is an important milestone in the development of Tuojing Technology, and it is also a new starting point for both parties to jointly promote the vigorous development of the semiconductor equipment industry. Tuojing Technology will give full play to its own technological advantages and industrial experience, work closely with the invested companies of the Core Chain Fund, and make layouts around the core bottleneck links in the supply chain, aiming to gather resources from all parties through investment and research linkage, form a joint force for industrial development, and jointly overcome the difficulties of localization of China's semiconductor industry.

The completion of the Tuojing Advanced Equipment Industrialization Base in Lingang and the establishment of the Core Chain Fund are new milestones in the localization of integrated circuit core equipment, and also open a new chapter in the development of the integrated circuit industry in Minlian Lingang. Real Estate Minhong will become a strategic partner with Tuojing Technology and Daohe Long-term Investment. The three parties will work together to play the role of the Core Chain Fund as a bridge and link based on Tuojing's industrial chain, Daohe's capital chain, and Minhong's service chain, focusing on the key areas and key links of the integrated circuit industry to continuously supplement, consolidate, and strengthen the chain, and support the development of key component companies supporting Tuojing's localization.
​

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[tokenanalyst]

Lianwei plans to invest 1.23 billion yuan to build a 12-inch silicon epitaxial wafer project​

Lianwei announced that it plans to sign an "Annual Production of 960,000 Pieces of 12-Inch Silicon Epitaxial Wafers Production Project Investment Agreement" with the Jiaxing Nanhu High-tech Industrial Park Management Committee, and plans to invest 1.23 billion yuan to build an "Annual Production of 960,000 Pieces of 12-Inch Silicon Epitaxial Wafers Project" in Jiaxing Nanhu High-tech Industrial Park.
According to the agreement, Lianwei will register a wholly-owned subsidiary, Jinrui Hongangxin Microelectronics (Jiaxing) Co., Ltd., in Jiaxing Nanhu High-tech Industrial Park as the project implementation entity. The registered capital of the subsidiary is 100 million yuan, and in the future it will jointly establish a new company with the city, district and park management committee, with a registered capital of 500 million yuan.
The epitaxial wafer project is planned to be implemented in the factory of Jiaxing Jinruihong Microelectronics (Jiaxing) Co., Ltd., and the construction period is expected to be 5 to 8 years. After the project is fully completed and put into production, it will form an annual production capacity of 960,000 12-inch silicon epitaxial wafers. Epitaxial wafers are key materials in semiconductor manufacturing and are widely used in power devices and analog chips. The market demand continues to grow.
Lianwei said that this investment will help the company further improve its strategic layout and enhance its sustainable operating capabilities, which is in the interests of the company and all shareholders. The project funds will mainly come from its own funds and self-raised funds, and will not have a significant impact on the company's financial situation and operating results in the short term. It is expected that the impact on the operating results in 2025 will be limited.

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[tokenanalyst]

Tanwei Xinlian completes angel round financing​

​

Recently, Beijing Tanwei Xinlian Technology Co., Ltd. (Tanwei Xinlian), the first domestic provider of interconnection communication solutions that matches NVIDIA's " NVLink & NVSwitch", announced the completion of tens of millions of RMB in angel round financing. This round of financing was led by Linge Venture Capital, and co-invested by Shuimu Venture Capital, Shengjing Jiacheng, Sinovation Ventures, and Shuimu Tsinghua Alumni Seed Fund. This round of financing will be used for product development and team building.

Tanwei Xinlian originated from the Brain-Inspired Computing Research Center of Tsinghua University. It is committed to the research and development of communication protocols and switching chips between GPUs, providing overall high-speed communication solutions and breaking through the "bottleneck" technology in the domestic chip communication field.

The Brain-Inspired Computing Research Center (CBICR) of Tsinghua University was founded in September 2014. It is the earliest team in China to conduct all-round brain-inspired computing research. Brain-inspired computing is listed as one of the two important technical directions in the post-Moore era by the "International Semiconductor Technology Blueprint". Drawing on the basic principles of brain science, the team has carried out full-chain research from basic theory, chips, software to system integration and application. The relevant research results of the Brain-Inspired Computing Center were featured on the cover of Nature twice in 2019 and 2024.

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It is reported that the ACCLink protocol supports low-latency lossless communication between multiple points and multiple GPUs, and has scalability, cache consistency and pooling capabilities. The protocol can achieve a 50ns protocol delay, has Load/Store/Sync instruction semantics, and has complete self-developed CTX communication semantics, and supports byte-level alignment and arbitrary address data movement. The ACCSwitch switching chip supports up to 4,096 GPU interconnections, 256 GPU multicast optimization, 32 high-speed transmission ports, and supports duplex line speed and multi-level forwarding. ACCLink&ACCSwitch technology fully utilizes the computing power of independent chips by improving the data transmission performance between GPUs.

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[tokenanalyst]

Tongfu Microelectronics acquires 26% stake in Jinglong Technology for RMB 1.378 billion.​

Tongfu Microelectronics issued an announcement stating that the company has completed the acquisition of 26% of the equity of Jinglong Technology (Suzhou) Co., Ltd. (hereinafter referred to as "Jinglong Technology") held by King Yuan Electronics. The transaction amount was 1.378 billion yuan.

On the same day, Tongfu Microelectronics announced that the company's board of directors agreed to the company's decision to acquire 26% of Jinglong Technology held by KYEC Microelectronics in cash. After the completion of the transaction, Tongfu Microelectronics holds 26% of Jinglong Technology. Suzhou Industrial Park Industrial Investment Fund will hold 26% of Jinglong Technology, Suzhou Xinrui Equity Investment Partnership will hold 14.9811% of Jinglong Technology, and Shanghai State-owned Assets and State-owned Enterprises Comprehensive Reform Experimental Private Equity Fund Partnership will hold 2% of Jinglong Technology.

Tongfu Microelectronics said that according to the sales agreement signed by the buyer and seller, all the prerequisites for the transaction have been met, and the buyer and seller completed the transaction on February 13, 2025. Jinglong Technology has completed the industrial and commercial change registration and obtained a business license.

According to information, Jinglong Technology was established on September 30, 2002. It is mainly engaged in the business of analog or hybrid automatic data processing machine components, solid-state storage system components, heating oven processing, assembly and sales, as well as integrated circuit packaging and testing. Its service areas include wafer probe testing, IC finished product testing, wafer grinding, cutting, and die picking. This acquisition of Jinglong Technology by Tongfu Microelectronics can be regarded as a strong combination in the field of packaging and testing.



It is reported that before being sold, Jinglong Technology was the only testing subsidiary of Jingyuan Electronics, a well-known global semiconductor professional testing company, in mainland China. Its service areas include wafer probe testing, IC finished product testing, etc. According to Tongfu Microelectronics' 2024 announcement, Jinglong Technology will achieve revenue of 2.1 billion yuan and 2.15 billion yuan in 2022 and 2023, respectively, with corresponding net profits of 461 million yuan and 423 million yuan, respectively.


Regarding the performance changes, Tongfu Microelectronics pointed out that in 2024, the semiconductor industry will gradually enter the upward phase of the cycle. With the gradual destocking of the industry, the demand from industries such as data centers and automotive electronics, and the favorable policies for consumer electronics products, market demand will gradually pick up. At the same time, the vigorous development of artificial intelligence on the PC side is expected to drive further growth in the semiconductor industry.​

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[tokenanalyst]

Semiconductor Etching Plasma Endpoint detection components.

Shanghai Cheyitian Technology Co., Ltd. focuses on the research, development and manufacturing of optoelectronic control subsystems for semiconductor equipment. The company's team members have decades of experience in semiconductor product industrialization and are a strategic partner of optoelectronic suppliers for leading domestic semiconductor equipment companies.

The company provides online detection components and subsystems in the fields of plasma spectrum analysis, high-precision temperature measurement and control, gas and liquid concentration analysis, etc., which are applied to the core process of semiconductor equipment. The application fields cover almost all the process of semiconductor chip manufacturing, including etching and degumming process, thin film deposition epitaxial process, heat treatment process, cleaning process, etc.​