Chinese semiconductor thread II

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tokenanalyst

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VeriSilicon and CellSilicon jointly launch 5G RedCap/4G LTE dual-mode modem solution​

VeriSilicon Announced today that it has entered into a partnership with New Base Technology Co., Ltd. ("New Base"), a provider of wireless communication technology and communication chips. Jointly launched the 5G RedCap/4G LTE dual-mode modem solution . New Foundation's chips based on this solution have completed tape-out and chip verification and have been put into mass production, and will soon be officially launched on the global market.

5G RedCap is a cellular IoT technology defined by the international standardization organization 3GPP in 5G Release 17 for medium- and high-speed IoT application scenarios. Together with 4G LTE, it builds a complete cellular IoT comprehensive ecosystem.

VeriSilicon and NewGen have officially reached a strategic cooperation. VeriSilicon will be able to provide customers with both 4G and 5G Modem IP solutions, further enriching its wireless communication IP product portfolio. The two parties will also provide customers with a series of complete end system reference designs, including key components such as RF transceivers and power management chips.

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tokenanalyst

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Hepalink completed hundreds of millions of yuan in strategic financing and became the leader in the semiconductor ultrapure pipe and valve industry​


Hepalink (Changzhou) Clean System Technology Co., Ltd. (referred to as Hepalink) completed hundreds of millions of yuan in strategic financing. This round of financing was strategically led by Gaoxin Capital, with participation from Shengmei Semiconductor, Leading Core, Wu Yuefeng Capital, Binfu Capital, Quandexue Capital, Xinchao Group, Chang Gaoxin Group and old shareholder Novartis Capital also participated in the investment.

Founded in April 2022, Hepalink is a domestic leader in semiconductor liquid circuit and ultra-pure pipeline control systems. It is located in the High-tech Industrial Development Zone in Changzhou City, Jiangsu Province. Relying on the more than 30 years of experience in pipeline control system R&D and manufacturing of its parent company Watson Pipeline Technology Co., Ltd., it has become the first domestic company to enter the field of ultra-high purity pipe valves for semiconductor liquid lines. Local businesses.

It is reported that Hepalink focuses on the R&D, design and manufacturing of ultra-pure pipeline control system products for pan-semiconductor liquid circuits such as integrated circuits and photovoltaics. Its main products include PVDF and PFA ultra-high purity valves, pipes, joints, instruments, etc., and its products are widely used It is used in ultrapure water main system and secondary distribution, wet equipment, wet electronic chemicals and other fields in semiconductor Fab factories.

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gelgoog

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european_guy said:
In China only SMIC and maybe later CXMT will use EUV, with YMTC eventually joining the group much later (like 4/5 years later), and nobody will ever buy a Chinese EUV machine outside China (for many reasons).
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YMTC does not need EUV lithography tools. They make VNAND. No one uses EUV for VNAND. What is more important is throughput and the etching tools. Remember that the Japanese are even considering basically going back to contact lithography for VNAND. With nanoimprint lithography.

Any fabs which make logic or DRAM will be interested in EUV. This would include SMIC and CXMT right now. These are the companies which actually tried to order EUV tools from ASML. But in the future you could see other companies like Hua Hong or Fujian Jinhua join in.

As for exports of tools. A lot of countries have the capital and inclination to operate leading edge semiconductor fabs. But they lack access to tools, process, plus operational know how. Examples include Middle Eastern countries like Saudi Arabia, UAE, or other major powers like Russia.

tacoburger said:
I already know that SMEE is separate from the EUV project. The problem is that SMEE has been a company since 2002, created for the sole purpose of developing lithography products, failed to develop any competitive products, and despite DUVi being a mature technology, still can't mass produce them despite the very real threat of ASML cutting China off of DUV exports, forcing China to stockpile tens of billions of ASML's DUVi machines.
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SMEE seems to be competitive at making lithography tools for packaging. i.e. back end. It is at making tools for the front end i.e. chips that they are uncompetitive.

tacoburger said:
This matters because it represents the state of the lithography development in China. It's a niche market and a large amount of the trained lithography experts and engineers in China would already be working in SMEE. Yeah, various different companies and institutions are working on EUV, but they're not magic. If they were, SMEE wouldn't be in this current state of limbo for the last 20 years. Don't forget that SMEE depends heavily on various suppliers, if the domestic chinese optics/mirrors/lasers suppliers are somehow good enough to suddenly make EUV systems, then SMEE won't be in such a wretched state for so many decades.
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The invested amounts in these companies were kind of small to begin with. They were operating with limited resources in what was perceived as a necessary project for long term strategic autonomy. But there was no rush to develop it because back then alternatives could be purchased. Even now these companies seem to have had minimal amounts of investment poured into them. SMEE even considered going public to raise money. But my guess is they were waiting for the 28nm DUV machine to be in production before an IPO. And given the current state of the Chinese stock market I don't know if an IPO would be a good idea right now.
 
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tacoburger

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horse said:
Sorry, but you're not making any sense.

To use an crude analogy, there are hypersonic missiles, and cruise missiles.

Obviously, EUV is the hypersonics, and DUVi are the most advanced cruise missles.

Just because that someone knows how to make a cruise missile, means squat for making a hypersonic one.

It may look linear on a chart or timeline, but it is most definitely not in terms of engineering. No. No. No.

DUV and EUV are two separate things, two different paths of research and development, which seems we cannot get our heads around that.
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Imagine a nation that has spent two decades trying to make an ordinary cruise missile but keeps failing, making a barely functional product.

Then imagine that that nation suddenly tries to develop a cutting edge state of the art hypersonic glide vehicle in half that amount of time. Not likely.

Yeah they are different, but share enough similarities that performance in one area gives you a general idea of what to expect in the other. If you struggle to make biplanes, you're not developing a jet aircraft. If you can't make a basic railroad, you're not gonna do well making a mag-lev high speed train. If you can't make a coal power plant, forget about nuclear reactors.
 
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