Chinese semiconductor thread II

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Beijing Huazhuo Precision Technology Co., Ltd.'s primary business is the research, development, and industrialization of integrated circuit manufacturing equipment and key components. Its current products include complete equipment and key semiconductor components, such as ultra-precision motion platforms, laser annealing equipment, wafer bonding equipment, wafer transfer systems, active and passive vibration isolators, electrostatic chucks, and precision measurement systems. These products are primarily used in production lines for integrated circuit chip manufacturing, advanced packaging, and power device manufacturing, and are widely employed in high-end technologies such as electronics manufacturing and laser processing.


Product Introduction: The D2W series fully automatic bonding system supports various possible chip architectures and is mainly aimed at high-end applications, including high-performance computing (HPC), artificial intelligence (AI), high-bandwidth memory (HBM), etc. It realizes high-performance chip-to-chip connections and promotes the development of 2.5D/3D and chiplet packaging processes.


Product Introduction: The UP-LSA series equipment is a key laser annealing equipment for advanced logic/storage processes, namely ultra-shallow junction USJ (Ultra Shallow Junction) and SD (Source/Drain) annealing in wafer front-end processes, to achieve implanted dopant ion activation and junction depth control.



Product Introduction: The dual-frequency laser interferometer is an ultra-high-precision displacement measurement system based on the principle of optical interference. It is widely used in scenarios such as semiconductor manufacturing and measurement equipment, nano-metrology standards, machine tool performance testing, and precision scientific research in cutting-edge scientific laboratories, achieving dynamic and static measurements with nanometer-level precision.

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Harbin Institute of Technology Shenzhen Campus successfully developed a high-efficiency magnesium bismuth-based micro thermoelectric cooling device​

A team led by Professors Zhang Qian and Mao Jun from the School of Materials Science and Engineering, Frontier Sciences Division, Harbin Institute of Technology Shenzhen Campus, achieved a major breakthrough in the field of magnesium bismuth-based thermoelectric devices. The team successfully developed a magnesium bismuth-based micro-thermoelectric cooler, achieving a cooling temperature difference of 59.0 Kelvin (K), a cooling power density of 5.7 watts per square centimeter (W cm⁻²), and a high cooling rate of 65 Kelvin per second (K s⁻¹) at room temperature.

Compared to previously reported magnesium bismuth-based thermoelectric coolers, this new device achieves a 3.5-fold increase in cooling power density at room temperature, reaching 5.7 watts per square centimeter (W cm⁻²). It also achieves a maximum cooling temperature difference of 59.0 Kelvin (K) and a peak cooling rate of 65 Kelvin per second (K s⁻¹). The device has been successfully applied to temperature management of microcontroller central processing units (CPUs), effectively reducing their operating temperatures. In stability testing, the device maintained 98% of its initial cooling performance after 270 hours and approximately 3,000 operating current cycles.

The research results, titled "Development of Micro-MgBi-Based Thermoelectric Cooling Devices for Electronic Device Thermal Management," were published in the internationally renowned journal Nature Communications. The Shenzhen campus is the primary author of the paper, with master's student Lin Chenhao as the first author, postdoctoral fellow Ma Xiaojing as the co-first author, and professors Zhang Qian and Mao Jun as co-corresponding authors. This research was supported by the National Natural Science Foundation of China, a key research and development project of Guangdong Province, and other grants.

This breakthrough not only provides a new solution for thermal management in electronic devices, but also opens up broad prospects for the application of bismuth-based magnesium materials in thermoelectric applications. With further optimization and promotion of the technology, it is expected to play an important role in even more fields.

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