Chinese semiconductor thread II

[tokenanalyst]

Beijing Huazhuo Precision Technology Co., Ltd.'s primary business is the research, development, and industrialization of integrated circuit manufacturing equipment and key components. Its current products include complete equipment and key semiconductor components, such as ultra-precision motion platforms, laser annealing equipment, wafer bonding equipment, wafer transfer systems, active and passive vibration isolators, electrostatic chucks, and precision measurement systems. These products are primarily used in production lines for integrated circuit chip manufacturing, advanced packaging, and power device manufacturing, and are widely employed in high-end technologies such as electronics manufacturing and laser processing.


Product Introduction: The D2W series fully automatic bonding system supports various possible chip architectures and is mainly aimed at high-end applications, including high-performance computing (HPC), artificial intelligence (AI), high-bandwidth memory (HBM), etc. It realizes high-performance chip-to-chip connections and promotes the development of 2.5D/3D and chiplet packaging processes.


Product Introduction: The UP-LSA series equipment is a key laser annealing equipment for advanced logic/storage processes, namely ultra-shallow junction USJ (Ultra Shallow Junction) and SD (Source/Drain) annealing in wafer front-end processes, to achieve implanted dopant ion activation and junction depth control.



Product Introduction: The dual-frequency laser interferometer is an ultra-high-precision displacement measurement system based on the principle of optical interference. It is widely used in scenarios such as semiconductor manufacturing and measurement equipment, nano-metrology standards, machine tool performance testing, and precision scientific research in cutting-edge scientific laboratories, achieving dynamic and static measurements with nanometer-level precision.

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[tokenanalyst]

Harbin Institute of Technology Shenzhen Campus successfully developed a high-efficiency magnesium bismuth-based micro thermoelectric cooling device​

A team led by Professors Zhang Qian and Mao Jun from the School of Materials Science and Engineering, Frontier Sciences Division, Harbin Institute of Technology Shenzhen Campus, achieved a major breakthrough in the field of magnesium bismuth-based thermoelectric devices. The team successfully developed a magnesium bismuth-based micro-thermoelectric cooler, achieving a cooling temperature difference of 59.0 Kelvin (K), a cooling power density of 5.7 watts per square centimeter (W cm⁻²), and a high cooling rate of 65 Kelvin per second (K s⁻¹) at room temperature.

Compared to previously reported magnesium bismuth-based thermoelectric coolers, this new device achieves a 3.5-fold increase in cooling power density at room temperature, reaching 5.7 watts per square centimeter (W cm⁻²). It also achieves a maximum cooling temperature difference of 59.0 Kelvin (K) and a peak cooling rate of 65 Kelvin per second (K s⁻¹). The device has been successfully applied to temperature management of microcontroller central processing units (CPUs), effectively reducing their operating temperatures. In stability testing, the device maintained 98% of its initial cooling performance after 270 hours and approximately 3,000 operating current cycles.

The research results, titled "Development of Micro-MgBi-Based Thermoelectric Cooling Devices for Electronic Device Thermal Management," were published in the internationally renowned journal Nature Communications. The Shenzhen campus is the primary author of the paper, with master's student Lin Chenhao as the first author, postdoctoral fellow Ma Xiaojing as the co-first author, and professors Zhang Qian and Mao Jun as co-corresponding authors. This research was supported by the National Natural Science Foundation of China, a key research and development project of Guangdong Province, and other grants.

This breakthrough not only provides a new solution for thermal management in electronic devices, but also opens up broad prospects for the application of bismuth-based magnesium materials in thermoelectric applications. With further optimization and promotion of the technology, it is expected to play an important role in even more fields.

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[gotodistance]

China's semiconductor self-sufficiency rate, as assessed in Korea

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[gelgoog]

It's messed up because it is not just replicating the US tech stack but the entire West's.
Still if anyone can do it this is China.

 

[tokenanalyst]

Shengmei Shanghai Leads with Differentiated Innovation in Semiconductor Cleaning Tech​

In an increasingly competitive global semiconductor industry, technological differentiation is no longer optional—it's essential. At the forefront of this innovation, Shengmei Shanghai (ACM Shanghai) has delivered significant breakthroughs in its SPM (Sulfuric Acid Peroxide Mixture) cleaning technology, reinforcing its position as a world leader in advanced semiconductor equipment.

With relentless focus on performance, cost-efficiency, and customer-specific needs, ACM Shanghai has launched a comprehensive SPM cleaning solution that covers the full spectrum of advanced node manufacturing—from high-temperature to medium-temperature processes—offering precise, scalable, and environmentally responsible solutions for logic, memory, and 3D-NAND chip production.

Wafer cleanliness is critical. Even microscopic contaminants can compromise yield, performance, and device reliability. As semiconductor process nodes shrink to 17nm, 15nm, and beyond, cleaning requirements have become more stringent—demanding ultra-precise particle control, stable process conditions, and efficient chemical usage.

ACM Shanghai has identified this trend early and positioned cleaning equipment as a strategic technological high ground, offering tailored solutions that meet both performance and economic demands.
​

Key Breakthroughs in SPM Technology​

Single-Wafer Medium/High-Temperature SPM Equipment​

Enhanced Particle Control: Achieves an average of 5 particles in a 26nm test, meeting the strictest industry standards for advanced nodes.
Exclusive SPM Nozzle Design:
Prevents liquid splashing and high-temperature gas diffusion outside the cavity.
Eliminates external cleaning/drying steps, boosting equipment uptime by up to 30%.
Hybrid Ultrasonic Technologies: Integrates patented SAPS (Spatial Alternating Phase Shift) and TEBO (Time-Induced Cavitation Oscillation) technologies for superior cleaning performance and uniformity.

Ideal for logic, DRAM, and 3D-NAND processes requiring high-temperature SPM (up to 170°C).

​

Ultra C Tahoe Medium-Temperature Cleaning System​

First-to-Market Integration: Pioneered the fusion of a tank cleaning module with single-wafer chambers in one tool—offering higher throughput, flexibility, and process control.
Up to 75% Reduction in Sulfuric Acid Usage:
Helps customers reduce costs and meet environmental regulations.
Performance Improvements:
Average particle count: under 5 particles (26nm test).
Throughput up to 180 wafers per hour with a 25-slot module + 9 single-wafer chambers.
Film thickness variation < 0.1 Å, ensuring consistent chip performance.
Applications include: High-density logic and memory chips, 3D DRAM, 28nm high-k metal gate processes

The Ultra C Tahoe has already been deployed in mass production lines at leading semiconductor fabs, with strong validation from major logic and memory manufacturers.
​

Full-Spectrum Cleaning Platform Built on Core Technologies​

Beyond these two flagship products, ACM Shanghai offers a full suite of cleaning solutions including:

SAPS megasonic cleaning
TEBO megasonic cleaning
Tahoe-based systems
Backside & brush cleaning
Tank wet cleaning

Through its three core technologies (SAPS, TEBO, Tahoe), the company now covers 90–95% of all semiconductor cleaning steps, creating a strong technological barrier and product differentiation.
Global Market Share: 8% in semiconductor cleaning equipment (ranked 4th globally) – per Gartner data.
China Market Leadership: Over 30% market share in single-wafer cleaning equipment, ranking second among domestic and international suppliers.
Sustained R&D Investment:
H1 2025 R&D investment: ¥544 million (up 39.47% YoY)
R&D accounts for 16.67% of operating income, reflecting long-term commitment to innovation.

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[tokenanalyst]

Hechen New Materials' G8.6 generation photomask substrate coating equipment officially moved in​

Recently, Hechen New Materials' G8.6 generation photomask substrate coating equipment was officially moved in and started debugging to accelerate the progress of the project.

The project, reportedly due to commence in January 2025, marks a significant step forward for Hechen New Materials in the field of high-generation blank mask substrates, filling a gap in the industry. In 2021, the company initiated R&D and investment in the G6-generation Blank Mask project, becoming one of the earliest domestic companies to engage in the R&D, manufacturing, and sales of blank mask substrates. The G6-generation product has been highly recognized and mass-produced by clients such as Qingyi Optoelectronics and Luwei Optoelectronics.

Anhui Hechen New Materials Co., Ltd., established in January 2016 with registered capital of 36 million yuan, is located in Building 1 of the High-Tech Industrial Park in the Hexian Economic Development Zone. The company specializes in the research and development of high-performance polymer polishing materials for electronic displays, and its products are widely used in display and touch-sensitive industries, including engineering electronic displays, home appliances, automotive instruments, and mobile smart devices.

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[tphuang]

This is a semiconductor thread. Not one about what is sputnik moment.

 

[tokenanalyst]

Jiangsu RISC-V Industry Alliance established in Suzhou​

Suzhou Daily, on August 22, the Jiangsu RISC-V Industry Alliance Establishment Conference and Innovation Development Exchange Conference was held at the Suzhou Integrated Circuit Innovation Center.

It is reported that after the Jiangsu RISC-V Industry Alliance is unveiled, it will be based in Suzhou and radiate across the province, fully connecting with innovative resources such as industry leaders, universities, research institutes, and industry associations. By conducting technical exchanges and organizing joint research, it will strengthen the collaborative cooperation between industry, academia, research, and application, drive technological innovation, accelerate the transformation of results, and create a RISC-V industry ecosystem with Jiangsu characteristics.

The event also awarded plaques to the Jiangsu RISC-V Industry Alliance governing units and issued letters of appointment to the first group of representatives of the expert technical committee. A number of RISC-V industry-university-research collaboration projects and IP licensing cooperation projects were signed.

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[tokenanalyst]

Designed specifically for AI PC applications, GalaxyCore launches high-performance image sensor GC5605​

GalaxyCore officially launched the high-performance 5-megapixel image sensor GC5605. Designed specifically for AI PC applications, this product features high resolution, high dynamic range, and ultra-low power consumption. It helps AI PCs improve image quality in scenarios like video conferencing and high-definition photography, while also enabling smarter human-computer interactions such as intelligent wake-up and gesture control.

The GC5605 features 1.116μm pixels based on the GalaxyCell® 2.0 process platform. This significantly enhances image detail and effectively reduces pixel dark current for a wide range of shooting environments, especially low-light scenes, resulting in a signal-to-noise ratio superior to comparable products in the industry. Combined with a 2888x1808 high-resolution resolution, the GC5605 delivers rich image detail even in low-light conditions. Supporting both DAG (Double Frame Aggregation) and Staggered HDR modes, the GC5605 delivers rich image detail, even in complex lighting conditions such as backlight and strong sunlight, meeting the stringent requirements of AI PCs for image clarity and stability.



The GC5605 supports Always On low-power mode, reducing power consumption to as low as 2mW when implementing Human Presence Detection. This mode is widely used in scenarios such as smart wake-up, automatic screen lock, and energy-saving control, improving the device's intelligent experience, responsiveness, and battery life.

With a compact 1/4.7-inch optical size, the GC5605 is easily integrated into narrow-frame laptops. Its native 16:10 aspect ratio also makes it compatible with mainstream monitors.

It is predicted that global shipments of AI PCs will exceed 167 million units by 2027, accounting for nearly 60% of the overall PC market. The GC5605 combines high performance, low power consumption, and compact size, helping terminal manufacturers accelerate product iteration and user experience upgrades. The product is expected to ship in the fourth quarter of 2025.

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