Shanghai Institute of Optics and Mechanics has made progress in the manufacture of fused silica components with high resistance to ultraviolet laser damage
Recently, the team of Wei Chaoyang, a researcher at the Precision Optical Manufacturing and Testing Center of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, based on the defect characterization and removal process of CO 2 lasers, realized the manufacture of highly resistant to ultraviolet laser damage fused silica components. Relevant research results were published in Light: Advanced Manufacturing .
The problem of ultraviolet laser-induced damage in fused silica components seriously restricts the development of high-power laser systems. Due to the inevitable processing defects in the current contact polishing process, which are difficult to be completely removed by post-processing, the service performance and life of fused silica components are greatly reduced.
Based on the microsecond pulsed laser low-stress uniform ablation technology, the research team proposed a laser tomographic ablation method for characterizing subsurface defects, and coupled it to the rapid material removal process to achieve complete removal of subsurface defects during the grinding stage. Afterwards, the laser conformal cleaning method was used to clean the ablation surface to deposit pollutants, and the laser fusion polishing was used to smooth the ablation track, realizing the flexible processing of CO 2 laser full-link fused silica components. Compared with the traditional process, the CO 2 laser processing link can effectively suppress the introduction of processing defects and realize the preparation of higher damage threshold fused silica components. The laser-based defect characterization and removal method proposed in this study provides a new tool for subsurface defect research and suppression strategy formulation, and also provides a new idea for low-defect processing of fused silica components.
This work was supported by the National Key Research and Development Program, the Shanghai Sailing Plan, the National Natural Science Foundation of China, the Shanghai Natural Science Foundation, the Astronomical Joint Fund, and the Youth Innovation Promotion Association of the Chinese Academy of Sciences.
The problem of ultraviolet laser-induced damage in fused silica components seriously restricts the development of high-power laser systems. Due to the inevitable processing defects in the current contact polishing process, which are difficult to be completely removed by post-processing, the service performance and life of fused silica components are greatly reduced.
Based on the microsecond pulsed laser low-stress uniform ablation technology, the research team proposed a laser tomographic ablation method for characterizing subsurface defects, and coupled it to the rapid material removal process to achieve complete removal of subsurface defects during the grinding stage. Afterwards, the laser conformal cleaning method was used to clean the ablation surface to deposit pollutants, and the laser fusion polishing was used to smooth the ablation track, realizing the flexible processing of CO 2 laser full-link fused silica components. Compared with the traditional process, the CO 2 laser processing link can effectively suppress the introduction of processing defects and realize the preparation of higher damage threshold fused silica components. The laser-based defect characterization and removal method proposed in this study provides a new tool for subsurface defect research and suppression strategy formulation, and also provides a new idea for low-defect processing of fused silica components.
This work was supported by the National Key Research and Development Program, the Shanghai Sailing Plan, the National Natural Science Foundation of China, the Shanghai Natural Science Foundation, the Astronomical Joint Fund, and the Youth Innovation Promotion Association of the Chinese Academy of Sciences.