Chinese semiconductor thread II

[snake070]

看起来什么都没变

• 消息人士称，获批的中国企业包括阿里巴巴、腾讯、字节跳动
• 消息人士称，联想和富士康获得美国批准成为H200经销商
• 尽管美国批准中国买家，但没有交付氢200
• 北京的新供应链规则加强了对外国科技依赖的监管
• 美国强硬派认为，英伟达对中国的销售可能会削弱美国人工智能的领导地位

还没有销售​

尽管美国批准，但交易陷入停滞，一位消息人士称，中国企业在北京指导下撤回了谈判。
该人士补充说，中国的转变部分是由美方的变化引发的，但具体变化的内容尚不清楚。
另一位第四位消息人士称，北京方面正面临阻挠或严格审查这些命令的压力。
商务部长霍华德·卢特尼克上月在参议院听证会上表示，“中国中央政府尚未允许他们购买芯片，因为他们试图将投资集中在国内产业上。”
北京的犹豫反映了一种战略考量，担心进口会削弱开发国产人工智能芯片的努力。虽然中国的人工智能芯片仍落后于英伟达，但像DeepSeek

Please, Log in or Register to view URLs content!

越来越强调依赖包括华为开发的国产

Please, Log in or Register to view URLs content!

。
他们转向华为凸显了英伟达在中国的脆弱地位。黄明明警告称，美国的出口管制正在削弱公司在市场的立足点，称其在中国AI加速器的市场份额实际上已降至零。

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Security and Reliability Evaluation Work Guide (V3.0)

The security and reliability evaluation is primarily targeted at central processing units (CPUs) used in computer terminals and servers, AI training and inference chips, operating systems, databases, and the main control chips used in laser or inkjet printers. By evaluating the core technologies, security assurance, and sustainability of the products and their R&D organizations, the evaluation assesses the security and sustainability of the products, thereby achieving a comprehensive measurement and objective assessment of the full-lifecycle security and reliability covering product R&D and design, manufacturing, supply assurance, and after-sales maintenance.

The security and reliability evaluation adheres to the principles of "voluntariness, equality, objectivity, and impartiality." Enterprises voluntarily apply to the China Information Security Evaluation Center and the National Secrecy Science and Technology Evaluation Center for product testing, and the evaluation results are independently selected and used by enterprises and users.


============================================

If you do not pass this security and reliability evaluation, then national-level data centers may not purchase your chips. This is all controlled at the government's discretion.

 

[tokenanalyst]

The Shenyang Tuojing High-end Semiconductor Equipment Industrialization Base project, with an investment of 2 billion yuan, is expected to be topped out in July.​

According to Innovation Hunnan , the Shenyang Tuojing High-end Semiconductor Equipment Industrialization Base project has recently entered a critical final stage of construction, with all efforts focused on completing the electromechanical installation milestones. The project has a total investment of 2 billion yuan and a total construction area of 156,000 square meters, encompassing two core functional areas: a research and development center and a cleanroom. It is a benchmark project for the localization of key national semiconductor equipment.

According to the plan, the project will be fully capped by mid-July, and the curtain wall will be closed by the end of the year, laying the foundation for interior decoration and landscape construction next year. The project will be fully completed and delivered by the end of 2027.

As a platform for the research and development and production of core and key equipment for chip manufacturing, this project, once completed and put into operation, will focus on the research and development and industrialization of globally leading thin film deposition equipment, make every effort to make up for the shortage of domestic semiconductor equipment production capacity, significantly enhance my country's independent supply capacity of high-end chip manufacturing equipment, and inject strong momentum into the independent and controllable semiconductor industry chain and supply chain.

It is understood that in terms of capacity upgrade, after the project is operational, the capacity in the Shenyang area will increase to four times the current level, fully supporting the industrialization of high-end thin film products such as PECVD, SACVD, and HDPCVD, and promoting the continuous growth of the company's business scale.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

SMIC released its Q1 2026 financial report, with quarterly revenue exceeding US$2.5 billion.​

On the evening of May 14, 2026, SMIC, the leading semiconductor foundry in mainland China, released its financial report for the first quarter of 2026. The quarterly sales revenue reached a new high of US$2.505 billion, an increase of 11.5% year-on-year, with a gross margin of 20.1%.

Financial Report Details: Capacity Utilization Remains High
SMIC's revenue breakdown by application in the first quarter was as follows: smartphones 18.9%, computers and tablets 13.6%, consumer electronics 46.2%, connectivity and wearables 7.3%, and industrial and automotive, with the latter continuing to rise to 14.0%. Looking at revenue contribution from different regions, China accounted for 88.9% of total revenue; the US accounted for 9.3%, and the Eurasia region accounted for 1.8%.

By wafer size, 12-inch wafers accounted for 76.4% of revenue in the first quarter, while 8-inch wafers accounted for 23.6%. In terms of capacity, SMIC's monthly capacity is expected to increase from 1,022,750 wafers (equivalent to 8-inch standard logic) in the fourth quarter of 2025 to 1,078,250 wafers (equivalent to 8-inch standard logic) in the first quarter of 2026. First-quarter wafer sales reached 2,509,000 wafers (equivalent to 8-inch standard logic), with capacity utilization remaining high at 93.1%, representing a year-on-year increase of 9.5%.

SMIC's capital expenditure in the first quarter of 2026 was US$1.5628 billion, of which R&D expenditure was US$187 million.

Q2 revenue increased by 14% to 16% sequentially; overall operations are more optimistic for the year.
SMIC's management stated that in the first quarter, the company achieved sales revenue of US$2.505 billion, a 0.7% increase compared to the previous quarter; the gross profit margin was 20.1%, an increase of 0.9 percentage points compared to the previous quarter.
Looking ahead to the second quarter, SMIC has given revenue guidance of 14% to 16% quarter-on-quarter growth and gross margin guidance of 20% to 22%, an increase of 2 percentage points compared to the previous quarter's guidance.
Based on customer demand and order backlog, management is more optimistic about the overall operating situation this year compared to the previous quarter. SMIC will closely monitor customer needs, flexibly allocate resources, accelerate product response speed, and ensure high-quality delivery even in complex environments.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Tencent executive: More domestically produced chips will be put into use in the second half of the year.​

On May 13, during a conference call following the release of its first-quarter financial report, Tencent Holdings executives made important statements regarding AI chip supply, capital expenditure, and long-term investment strategies. Tencent executives revealed that the company will increase capital expenditure going forward, and more domestically produced chips will be put into use in the second half of this year.
Tencent executives admitted that Tencent Cloud has long lacked sufficient GPU resources, making it difficult to fully meet all the needs of external customers, which has had an adverse impact on the company's ability to generate more revenue and increase market share.
With the rapid development of generative artificial intelligence, the demand for computing power has exploded, making GPUs and other AI chips a core resource that tech giants are vying to procure. Tencent's public acknowledgment of GPU supply shortages reflects the computing power crunch faced by the entire industry.
In response to the chip supply bottleneck, Tencent executives have given a clear timeline for improvement: more domestically produced chips will be put into use in the second half of this year.
This statement indicates that Tencent is actively introducing domestically produced AI chip alternatives to alleviate its reliance on high-end overseas GPUs. Industry insiders point out that with the continuous improvement in the performance of domestically produced AI chips such as Huawei Ascend, Cambricon, and Hygon, and the gradual improvement of their ecosystems, domestically produced chips have the ability to replace imported products in certain scenarios. Tencent's large-scale adoption of domestically produced chips will strongly promote the development of the domestic AI computing power industry chain.
Tencent executives stated that the company's capital expenditures will increase going forward. Investments in AI will encompass both short- and long-term investments; the company will not manage each related product on a quarterly basis, but rather review them based on the asset portfolio and lifecycle.
This statement reflects Tencent's long-term approach to its AI business. Unlike the traditional practice of assessing short-term returns on a quarterly basis, Tencent prefers to view its AI investments as an asset portfolio that requires continuous nurturing, allowing some projects to realize their value over a longer period.
As a leading cloud service provider and internet giant in China, Tencent has been continuously increasing its investment in AI infrastructure in recent years. This statement sends two clear signals: first, in the short term, Tencent will address the computing power bottleneck as soon as possible by increasing capital expenditure and introducing domestically produced chips; second, in the long term, Tencent will maintain its continuous investment in AI and demonstrate sufficient strategic patience in resource allocation.

Please, Log in or Register to view URLs content!

 

[tokenanalyst]

Huakang Clean wins bid for Yuerun high-end packaging and testing base project​

Recently, Huakang Cleanroom successfully won the EPC (Engineering, Procurement, and Construction) contract for the "Next-Generation Heterogeneous Integrated Advanced Packaging Technology and DDIC (Display Driver Chip) Project" of Yuerun Integrated Circuit (Shaoxing) Co., Ltd., with a winning bid amount of 105.9 million yuan, marking a new breakthrough in the field of high-end cleanroom engineering for integrated circuits. This project is positioned as a wafer-level advanced packaging production line and is a key capacity-building project for Yuerun Integrated Circuit to expand its advanced packaging and DDIC businesses. Huakang Cleanroom is responsible for the cleanroom decoration and installation of supporting power facilities, covering the entire process construction including fresh air treatment, FFU system, process exhaust, pure wastewater system, gas pipelines, and automatic control system.

Please, Log in or Register to view URLs content!

 

[tphuang]

Please, Log in or Register to view URLs content!

Q1 power chip sales in China's auto sector. Overall down -19% YoY but SiC modules up 34.94%

BYD led the way in power modules w/ 21% share followed by CRRC, Silan, United Nova & StarPower. Infineon was all the way down in 6th

For SiC specifically, ST led the way w/ UNT, BYD, Geener/Geely, Li Auto & UAES following. Infineon is all the way in 7th place.

So aside from ST Micro, which supplies Tesla & makes their chips in China, basically it's all domestic chipmakers at this point

 

[tphuang]

Please, Log in or Register to view URLs content!

Novosense is out with its new NSI7117 solid state relay for BMS in NEVs. It achieves system-level enhancements in both Electromagnetic Interference (EMI) suppression and Electromagnetic Susceptibility (EMS) immunity, fully meeting the increasingly stringent EMC requirements of new energy vehicle

 

[tokenanalyst]

Application of NMPC in the processing of Wolter-I grazing incident mirrors​

​

Abstract​

Wolter-I structures based on X-ray grazing incidence optics are often used in extreme ultraviolet (EUV) collection optical systems, especially in the application of discharge plasma (DPP) sources. With the development of computer technology, the computerized surface forming (CCOS) method can significantly improve the surface accuracy and meet the optical requirements of high precision when processing Wolter-I grazing incident mirrors. In this paper, the nonlinear model predictive control (NMPC) system is innovatively introduced into the traditional CCOS method instead of the PID control system, and the application of NMPC in the rough grinding and fine grinding stages of Wolter-I grazing incident mirrors is studied, and it is found that the processing process and processing efficiency are effectively optimized through the system. Firstly, a detailed geometric model of the mirror was established for the special geometry of the inner surface of the cylindrical surface of the Wolter-I grazing incident mirror. Secondly, in view of the complex and nonlinear characteristics of the Wolter-I grazing incident mirror, a nonlinear model of the machining process is established, and the influence of spindle feed rate, removal pressure, abrasive particle size and other factors on the machining accuracy is considered, and the simulation results show that when the spindle feed rate is 25mm/s, the removal pressure is 9 N, and the abrasive particle size is 10, the removal efficiency is the highest and the removal effect is the best. The experimental results show that the CCOS method combined with NMPC significantly improves the surface accuracy and effectively improves the processing efficiency and reduces the production cost when processing the Wolter-I grazing incident mirror.

Please, Log in or Register to view URLs content!

 

[GulfLander]

Netherlands protests US proposal to further bar chip giant ASML from China market​

While the chipmaking-gear giant is already banned from selling advanced kit to China, new rule would make low-end products off-limits too

Please, Log in or Register to view URLs content!

 

[Michael90]

Please, Log in or Register to view URLs content!

This was posted already I believe ?