Chinese semiconductor thread II

[Wahid145]

but what will be more interesting is that if amat/lam has 30+ sales from china, and we know there are naura, amec also sells some of theirs in China , and rapidly inscresasing, so what means the FAB capacity added will be much more than 30% in China, in the coming years, the fab capacity will be like real over-capacity for the world.

That's a very important point. China's overall expansion in FAB is close to 50-60% of worlds total at this point.

usa through all the subsidies and shenanigans capturing around 10% of new WFE from AMAT/LAM, so almost no way Foundries are coming back to usa in the long run.

Now the main point is, in next 3-4 years China will flood the global market in sub 14nm Chips too but will there be a blanket Ban on Chinese chips among western countries?

As for WFE excluding Lithography, I think by this year China has fully fledged sub 7nm equipments for Deposition, Etch and everything else. But these tools require refinement which will take another 1 year or so.

Remember, IIRC, China wanted to have a full supply chain for 28nm by 2025 when the talk emerged around 2022 sanctions by Biden. So they put performed again by going all the way to even sub 7nm for these tools

 

[tokenanalyst]

MicroNano Core has completed a Series B financing round of over 100 million yuan, becoming a leading global in-memory computing AI chip company.​

MicroNano Core has completed a Series B financing round exceeding 100 million yuan, led by BlueRun Ventures, with participation from SMIC Capital, Jinqiu Fund, Junke Danmu, and Shaoheng Investment. This milestone underscores strong market confidence in its innovative 3D-CIM (3D near-memory + in-memory computing + RISC-V) chip technology for AI applications.

Founded in 2018 and incubated by Peking University’s Advanced Institute of Information Technology, MicroNano Core has pioneered a breakthrough 3D-CIM architecture that overcomes the traditional "impossible triangle" of high performance, low power consumption, and low cost. By integrating storage and computing units, its technology achieves over 4x higher computing power density and more than 10x lower power consumption compared to conventional von Neumann architectures—especially in tensor-intensive AI workloads (which dominate convolutional and large model networks).

Additionally, MicroNano Core’s RV-CIM full-stack solution (based on RISC-V) enables seamless software-hardware integration through an open ecosystem, addressing usability, computational completeness, and ecosystem barriers. This makes the chip not only high-performing but also practical for real-world deployment.

The funding marks a major leap in MicroNano Core's journey to become a global leader in mass-producible, high-performance edge AI chips.​

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[tphuang]

Jingsheng Mechanical & Electrical disclosed the latest progress on silicon carbide production capacity and semiconductor equipment orders.​

Recently, Jingsheng Mechanical & Electrical received research from multiple institutions, and disclosed information about the company's silicon carbide production capacity layout and semiconductor equipment orders.

Jingsheng Mechanical & Electrical pointed out that the company is actively expanding its silicon carbide production capacity, with a project in Shangyu to produce 300,000 silicon carbide substrates per year; and based on the good development prospects and broad market of the global silicon carbide industry, it is building an 8-inch silicon carbide substrate industrialization project in Penang, Malaysia, to further strengthen the company's supply capabilities in the global market; at the same time, it is building a supporting crystal project in Yinchuan with an annual production capacity of 600,000 8-inch silicon carbide substrates, continuously strengthening the company's technological and scale advantages in the field of silicon carbide substrate materials.

Meanwhile, Jingsheng Mechanical & Electrical introduced that its subsidiary, Zhejiang Jingrui SuperSiC, has established a 12-inch silicon carbide substrate pilot line that covers the entire process of crystal processing, cutting, thinning, chamfering, grinding, polishing, cleaning, and testing. All processes utilize domestically produced equipment and proprietary technologies. Core processing equipment such as high-precision thinning machines, chamfering machines, and double-sided precision grinding machines were developed and refined by the company over many years, achieving industry-leading performance. With the official copper wire connection of this pilot line, Jingsheng Mechanical & Electrical has formally formed a complete closed loop for 12-inch SiC substrates, from equipment to materials, completely resolving the "bottleneck" risk of key equipment and providing a new benchmark for cost and efficiency for downstream industries.

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yeah, they have been doing this for a while. They supply others but also created a lot of capacity themselves here. You can see the effect on the market by Wolfspeed's recent results.

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It's over for them.

It's even hurting SICC

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[tphuang]

according to united nova, their production can't meet the demand for power chip demand. so if you are good at what you are doing, there is plenty of local demand in China. Also their SiC product samples have been sent to Western AI firms

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CR Micro is reporting 8% growth in revenue so far this year. They even got their 2200V SiC platform validated. Now they have product from 650V to 2200V.

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Bestechnic reports their BES2800 chip (on 6nm process) is used on Alibaba's Quark AI glasses

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[GulfLander]

Google translated:

On October 30, according to the "Nikkei" report, Toshiba's subsidiary Toshiba Electronic Devices and Storage Equipment Co., Ltd. terminated its technical cooperation agreement with Chinese silicon carbide (SiC) wafer supplier SICC (Shandong Tianyue Advanced Technology Co., Ltd., referred to as "Tianyue Advanced"). Economic security concerns were the main reason.

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