To be honest, with the abject failure of mmwave 5G, terahertz 6G is a pipe dream. 5G mmwave is a complete failure at this point. Vendors have trialed mmwave equipment but hardly any commercial deployment. Very few deployments.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
I have notice that Naura has quietly been adding semiconductor tools to their catalog.
The Landscape: A plasma etching-doping system that implant Ions into junctions and trenches of ICs, different from Ion implanters that accelerate particles using magnets this looks likes use energy of the plasma field to implant the atoms. The equivalent would be AMAT VIISta
The ACCURA Family: already discuss here, for deep hole-trench, dielectric etching and 3D-NAND
The Surefill W Family: For Tungsten thin film Chemical Deposition for the interconnects in ICs, my guess is to compete with AMAT Endura, especially with AMEC Preforma Uniflex.
They Also entered the Ion Implantation business, the Sirius family and the Rapid Thermal Processing business with the Sitara family probably to complement their Ion Implanters, RPT tools are used after Ion Implantation basically recrystallize the atoms after doping.
The Landscape: A plasma etching-doping system that implant Ions into junctions and trenches of ICs, different from Ion implanters that accelerate particles using magnets this looks likes use energy of the plasma field to implant the atoms. The equivalent would be AMAT VIISta
The ACCURA Family: already discuss here, for deep hole-trench, dielectric etching and 3D-NAND
The Surefill W Family: For Tungsten thin film Chemical Deposition for the interconnects in ICs, my guess is to compete with AMAT Endura, especially with AMEC Preforma Uniflex.
They Also entered the Ion Implantation business, the Sirius family and the Rapid Thermal Processing business with the Sitara family probably to complement their Ion Implanters, RPT tools are used after Ion Implantation basically recrystallize the atoms after doping.
Shanghai Xinyang's annual production of 50,000 tons of key integrated circuit process materials project started
On October 28, Shanghai Xinyang Semiconductor Materials Co., Ltd. officially broke ground on its 50,000-ton annual production capacity of key integrated circuit process materials, headquarters, and R&D center. The project, committed to building a world-class integrated circuit materials base centered on independent innovation, plans to invest 1.85 billion yuan and occupy 128 mu (approximately 66 acres). Production is expected to begin in November 2027 and reach full capacity in 2032.
It is reported that after the completion and full production of the first phase of the project, it will have an annual production capacity of 50,000 tons of key process materials for integrated circuits, including 5,000 tons/year of ultra-pure chip cleaning solutions, 6,500 tons/year of ultra-pure chip electroplating solutions, 33,500 tons/year of ultra-pure chip etching solutions, and 5,000 tons/year of chemical mechanical polishing solutions. The headquarters will integrate the functions of a research and development center, an operations center, a settlement center, a logistics center, and a training center. The research and development center will be built into a world-class platform for the research and innovation of integrated circuit materials.
It is reported that after the completion and full production of the first phase of the project, it will have an annual production capacity of 50,000 tons of key process materials for integrated circuits, including 5,000 tons/year of ultra-pure chip cleaning solutions, 6,500 tons/year of ultra-pure chip electroplating solutions, 33,500 tons/year of ultra-pure chip etching solutions, and 5,000 tons/year of chemical mechanical polishing solutions. The headquarters will integrate the functions of a research and development center, an operations center, a settlement center, a logistics center, and a training center. The research and development center will be built into a world-class platform for the research and innovation of integrated circuit materials.
Yangjie Technology's Advanced Packaging Project (Phase I) Commences Construction!
The groundbreaking ceremony for the Yangjie Technology Advanced Packaging Project (Phase I) was held in Plant No. 5. Qiu Zhen, Deputy Secretary of the Party Working Committee and Director of the Management Committee of Yangzhou Weiyang Economic Development Zone, Pan Jiannian, Deputy Director of the Management Committee, Liang Qin, Chairman of Yangjie Technology, and other leaders, as well as representatives from participating construction units and company employees, attended the ceremony to witness this important moment.
The commencement of this advanced packaging project marks a significant step for Yangjie Technology in its commitment to the semiconductor industry and its core belief of "wanting to win, daring to win, and being able to win." The project covers 23 acres and plans to construct a three-story reinforced concrete frame production plant with a building area of nearly 37,000 square meters. Its core objective is to introduce and build an internationally advanced packaging production line. This strategic move aligns with the semiconductor industry's trend towards "lighter, thinner, shorter, and smaller" technologies and signifies a crucial step for Yangjie Technology in overcoming key technological bottlenecks and perfecting its IDM (Integrated Device Manufacturer) industry chain layout encompassing chip design, manufacturing, and packaging.
if you do not understand the importance of satellite communication and the need for chips like this, then complain about it in a different thread. This is a thread about semiconductors.
Ruiyunwei Technology secures Pre-A round investment
Ruiyunwei Technology (Shanghai) Co., Ltd. (hereinafter referred to as "Ruiyunwei Technology"), a provider of precision measurement and control system solutions, announced the completion of its Pre-A round of financing. This round of financing was jointly invested by Shanghai Xingxu Private Equity Fund, Linxin Investment, and Junzhuo Venture Capital. The specific amount raised was not disclosed.
Founded on September 11, 2023, Raytron Technology is a company specializing in precision measurement and control system solutions. Serving the broader semiconductor industry, the company provides high-precision measurement and control systems and digital twin solutions. Leveraging its technological advantages and innovation capabilities, Raytron Technology has rapidly distinguished itself in the industry, committed to driving the intelligent and digital transformation of the semiconductor industry.
This financing will help Raytron Technology further increase its R&D investment, accelerate product iteration, and expand its market. The company stated that it will continue to focus on precision measurement and control technology, providing more efficient and accurate solutions for the broader semiconductor industry and contributing to its high-quality development.
SubNanometer Grating Interferometer Module
Dual Interferometers Modules.
Looks like the not only sell components but also solution nanometer scale lithography equipment. Multiple of this modules in a single lithography machine.
SEC720A Control System Development Platform
System Overview
This system has been applied in nanoscale motion control systems (stepping lithography, electron beam detection) and can be widely used in projection stepping scanning lithography, electron beam lithography, electron beam detection, nanoimprinting and other applications.
so this seems like same product line as 领聚科技's product from earlier this thread.
Any idea if there are other Chinese companies in this field? And also how competitive this is to the Lingju product?