Chinese semiconductor thread II

tphuang

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AMEC revenue increased by 46.4% to ~ 8 billion yuan for first 3 quarters. Healthy R&D at~ 2 billion yuan.

Anyone know when Naura will release its quarterly results?

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comparing this to ACM Research (aka Shengmei). Who saw their revenue grew to 5.1B RMB for first 3 quarters, up 29.4% YoY. They've put in 868m RMB of R&D so far and have 9B in order. They have 2 factories in Lingang. The first one already entered production and the second one will start production in second half of next year and should dramatically increase their production of high end machineries.

So, I quoted AMEC to show that two of the largest publicly traded Chinese SMEs (maybe 2nd and 3rd largest?) are both still seeing huge YoY growth 30 to 50%. AMEC is already over $1B in revenue per year and looks like ACM will hit that mark this year.

China's SMEs are still more fragmented than global market. But if you add them all together, including NAURA, SiCarrier and everyone else, I wouldn't be surprised if they hit $10B per year soon. And growing quickly, because the higher end stuff makes more money.
 

Michael90

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comparing this to ACM Research (aka Shengmei). Who saw their revenue grew to 5.1B RMB for first 3 quarters, up 29.4% YoY. They've put in 868m RMB of R&D so far and have 9B in order. They have 2 factories in Lingang. The first one already entered production and the second one will start production in second half of next year and should dramatically increase their production of high end machineries.

So, I quoted AMEC to show that two of the largest publicly traded Chinese SMEs (maybe 2nd and 3rd largest?) are both still seeing huge YoY growth 30 to 50%. AMEC is already over $1B in revenue per year and looks like ACM will hit that mark this year.

China's SMEs are still more fragmented than global market. But if you add them all together, including NAURA, SiCarrier and everyone else, I wouldn't be surprised if they hit $10B per year soon. And growing quickly, because the higher end stuff makes more money.
Is there a chance that there will be consolidation between them a few years or a decade down the line?
 

tokenanalyst

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Guobo Company's silicon-based gallium nitride power amplifier chips have achieved mass production applications in smart mobile terminals.​

Recently, the silicon-based gallium nitride power amplifier chip jointly developed by Nanjing Guobo Electronics Co., Ltd. (hereinafter referred to as Guobo Company) and leading domestic smart mobile terminal manufacturers has been successfully mass-produced and applied in mobile phones and other terminals, with a cumulative delivery of more than 1 million units.

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To address the stringent requirements of smart mobile terminals for cost-effectiveness, reliability, and size in RF power amplifiers, Guobo Company, in collaboration with leading domestic smart mobile terminal manufacturers and related R&D departments, formed a joint research team. Through collaborative innovation, they overcame the material challenge of high lattice defect rates in gallium nitride (GaN) epitaxy on silicon. Leveraging the technological advantages of novel third-generation semiconductor materials, they achieved performance improvements over traditional gallium arsenide (GaAs) power amplifiers while maintaining power, efficiency, and bandwidth. They also achieved a breakthrough in mass production technology for GaN power amplifier chips on silicon, marking the industry's first mass production and delivery of GaN power amplifier chips in the terminal RF field. The new product features high power, high efficiency, and high bandwidth, enabling customers to further reduce energy consumption, simplify system link design, and help them improve data transmission speeds and reduce operating power consumption in mobile phones and other terminals.

Next, Guobo Company will continue to optimize and develop new products to adapt to multi-band, high-efficiency terminal application scenarios. Simultaneously, it will continue to invest in the silicon-based gallium nitride power amplifier chip industry chain, promoting the industrialization of new third-generation semiconductor materials.

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tokenanalyst

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High-precision temperature control methods and systems in industrial integrated circuit manufacturing.​

CN120803138A
Shenzhen Guoyixing

summary

This invention relates to the field of remote monitoring technology and discloses a high-precision temperature control method and system for industrial integrated circuit manufacturing. The method includes: configuring a temperature sensor array for a lithography machine in industrial integrated circuit manufacturing; collecting multi-source temperature data from the lithography machine; establishing a chamber digital twin model of the lithography machine; calculating the three-dimensional temperature gradient of the chamber digital twin model based on the multi-source temperature data; analyzing the heat flow evolution path of the lithography machine to determine local hot spots; analyzing the lithography machine's operating conditions to define multi-modal control commands; and decomposing the hybrid control commands into heater group control commands, cooling system control commands, and gas flow field modulation commands to execute high-precision temperature control in industrial integrated circuit manufacturing. This invention can improve the temperature control accuracy in industrial integrated circuit manufacturing.

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tokenanalyst

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Wanye Enterprises achieved operating revenue of 1.069 billion yuan in the first three quarters.​


On October 29, 2025, Shanghai Wanye Enterprises Co., Ltd. officially completed its corporate name change to "Shanghai Pioneer Electronic Technology Co., Ltd.", with the stock code and abbreviation now proposed as "Pioneer Electronics" subject to final approval by the Shanghai Stock Exchange. This strategic rebranding signals a comprehensive transformation from a traditional electronics manufacturer into a full-scale, vertically integrated platform enterprise in China’s semiconductor ecosystem.

In the first three quarters of 2025, the company achieved operating revenue of RMB 1.069 billion, marking an unprecedented year-on-year growth of 247.43%—a testament to its rapid expansion and market penetration across key high-growth domains. Third-quarter revenue alone reached RMB 370 million, driven by strong performance in both materials and equipment segments, continuing a robust upward trajectory observed since the first half of the year.

The Ion Implanter Business: A Strategic Milestone in Domestic Semiconductor Self-Reliance.


Among the company’s most significant achievements is the maturation and scaling of its ion implanter business, led by subsidiary KST (Key Semiconductor Technology). As one of China's leading domestic developers and suppliers of advanced ion implantation equipment, KST has solidified its position as a critical enabler for national semiconductor self-reliance.

Market Presence & Operational Scale
KST currently operates approximately 50 ion implanter units across more than 10 major 12-inch wafer fabrication facilities (fabs) nationwide.
The equipment spans key semiconductor manufacturing processes including:
-Logic chips
-Memory devices (DRAM, NVRAM)
-CIS sensors (image sensors)
-Power semiconductors​

Synergy with Bismuth Materials Business​


The success of the ion implanter business is deeply intertwined with the company’s broader material platform, particularly its bismuth-based materials division. This creates a powerful “1+1>2” synergy:​
  • Material compatibility: Bismuth compounds serve as key dopants and thermal interface materials in advanced chips—especially in solid-state batteries, cooling modules (MicroTEC), and high-efficiency power devices.​
  • Cost-sharing and R&D efficiency: Shared R&D infrastructure allows for joint innovation in material-processing technologies that benefit both equipment development and chip fabrication.​
  • Supply chain integration: Bismuth materials provide the raw inputs needed to produce high-performance semiconductor components, while ion implanters enable their precise functional integration—forming a closed-loop industrial ecosystem.​
This synergy has allowed Pioneer Electronics to achieve nearly 90% of its total revenue from combined materials and equipment segments, with bismuth materials alone contributing over RMB 525 million in the first half of 2025 (75.14% of total revenue).

This widespread deployment demonstrates strong trust and acceptance from domestic foundries especially in the context of China’s ongoing efforts to reduce reliance on foreign equipment suppliers amid global supply chain disruptions.

Future

-Expand ion implanter capacity into new process nodes "7nm"
-Strengthen partnerships with domestic foundries and R&D institutes.
-Scale production of bismuth-based materials for use in next-gen batteries and cooling technologies.
-Explore international expansion, particularly in Southeast Asia and emerging markets seeking semiconductor self-reliance.

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tokenanalyst

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JLCPCB releases ultra-high-density PCBs and HDIs.​


On October 28th, the 2025 Electronic Semiconductor Industry Innovation and Development Conference & International Electronic Circuits (Greater Bay Area) Exhibition (hereinafter referred to as CPCA Show Plus) opened at the Shenzhen World Exhibition & Convention Center (Bao'an). The event showcased the electronics and semiconductor industry chain ecosystem serving the AI era, including printed circuit boards, semiconductors, packaging substrates and ceramic substrates, electronic circuit supply chains, and intelligent manufacturing. Over 300 industry chain partners and more than 40,000 domestic and international professional visitors attended.

As a leading one-stop service provider for the electronics and machinery industry chain, JLCPCB showcased its full suite of hardware innovation services and rich practical achievements in robotics, AI hardware and other fields at the exhibition. At the event, it also launched two high-end technological achievements: a 64-layer ultra-high-rise PCB and an HDI (high-density interconnect) board, providing basic support for the innovative R&D of high-end hardware such as aerospace, servers, and 5G communication equipment.
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In addition, JLCPCB has launched its self-developed cloud ERP tool for individuals and organizations in the hardware innovation field. This tool encapsulates JLCPCB's management experience in delivering tens of millions of orders annually, accumulating industry know-how and rich experience in self-developed technologies for domestic industrial software matrix. It covers "out-of-the-box" end-to-end management units such as personnel, finance, R&D, production, supply, sales, and inventory, and is integrated into JLCPCB's one-stop service ecosystem for the electronics and machinery industry chain to accelerate the innovation efficiency of engineers, enterprises, especially SMEs.

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tokenanalyst

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Jingneng Xiuzhou base started production ahead of schedule, and the first SiC power module rolled off the production line successfully.

Recently, the Xiuzhou base (Phase I) of Zhejiang Jingneng Microelectronics Co., Ltd. (hereinafter referred to as "Jingneng") completed its main construction ahead of schedule and officially started production, with the first SiC power module successfully rolling off the production line at the same time.

Located in Jiaxing National High-tech Industrial Development Zone, the base covers an area of 95.4 acres and officially started construction on February 5, 2024. It is the third specialized production base of Jingneng after Yuhang and Wenling. The first phase of the production line is planned to have an annual production capacity of 600,000 sets of automotive-grade power modules.

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It is reported that the production line innovatively adopts an advanced "island-style automation" layout, which not only achieves efficient automated production but also has excellent flexible switching capabilities, enabling rapid response to the manufacturing needs of multiple product categories. During the construction of the base, Jingneng implemented a "construction and production simultaneously" strategy, effectively shortening the construction and production connection cycle through multi-regional collaborative advancement and phased production, providing a key guarantee for the project to start production ahead of schedule.

Currently, Jingneng has secured project contracts from multiple industry clients and continues to deliver on a large scale, gradually increasing its market share. The Xiuzhou base will continue to ramp up production capacity, striving to become a core manufacturing and R&D platform for high-performance automotive-grade power modules.​

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