But its bad for Nvidia and other desktop chip providers including intel. GPUs will now be 2 times more expensive.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Like Intel doesn't have enough troubles. I don't wish bad to Intel but I have my doubts that this company will survive. Which will be ironic give that the US has been trying to kill Huawei for almost half a decade.
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I can imagine the hearing already.
Tom Cotton: Mr. Tan are you citizen of the P.R.C.?
Tan: No senator I am a born Malaysian US citizen.
Tom Cotton: Mr. Tan are you a member of the See See Pee?
Tan: No senator I think you have to be a Chinese citizen and I am...again... a Malaysian Born US citizen.
Tom Cotton:
Tom Cotton: Mr. Tan did you know that Malaysia is close to China?
Tan:
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He asked the tiktok ceo, a Singaporean, the same questions.
Intel shares drop after Trump calls for CEO to resign immediately
SMIC's sales revenue in the first half of 2025 increased by 22% year-on-year, and its capacity utilization rate was close to full capacity.
SMIC, the leading wafer foundry in mainland China, released its second quarter 2025 financial report, with sales revenue of US$2.209 billion, a year-on-year increase of 16.2%, and a gross profit margin of 20.4%. Both sales revenue and gross profit margin were higher than previous guidance expectations.
Financial report details capacity utilization rate close to full load
In the second quarter, SMIC's revenue share by application was as follows: smartphones (25.2%), computers and tablets (15%), consumer electronics (41%), connectivity and wearables (8.2%), and industrial and automotive (10.6%). Looking at the revenue contribution by region, China accounted for 84.1%, the United States (12.9%), and Eurasia (3%).
By wafer size, 12-inch wafer revenue accounted for 76.1% of revenue in the second quarter, while 8-inch wafer revenue accounted for 23.9%. In terms of production capacity, SMIC's monthly production capacity increased from 973,250 8-inch standard logic wafers in the first quarter of 2025 to 991,250 8-inch standard logic wafers in the second quarter of 2025. SMIC's capacity utilization rate in Q2 further increased to 92.5%, a year-on-year increase of 13.2%.
Capital expenditures were $1,885.1 million in the second quarter of 2025 and $1,415.5 million in the first quarter of 2025. R&D expenditures were $182 million in the second quarter of 2025 and $149 million in the first quarter of 2025.
Revenue in the first half of the year was US$4.46 billion, a year-on-year increase of 22.0%
In the second quarter, SMIC achieved overall sales revenue of US$2.209 billion, a decrease of 1.7% month-on-month; the gross profit margin was 20.4%, a decrease of 2.1 percentage points month-on-month; and the capacity utilization rate was 92.5%, an increase of 2.9 percentage points month-on-month.
Financial report details capacity utilization rate close to full load
In the second quarter, SMIC's revenue share by application was as follows: smartphones (25.2%), computers and tablets (15%), consumer electronics (41%), connectivity and wearables (8.2%), and industrial and automotive (10.6%). Looking at the revenue contribution by region, China accounted for 84.1%, the United States (12.9%), and Eurasia (3%).
By wafer size, 12-inch wafer revenue accounted for 76.1% of revenue in the second quarter, while 8-inch wafer revenue accounted for 23.9%. In terms of production capacity, SMIC's monthly production capacity increased from 973,250 8-inch standard logic wafers in the first quarter of 2025 to 991,250 8-inch standard logic wafers in the second quarter of 2025. SMIC's capacity utilization rate in Q2 further increased to 92.5%, a year-on-year increase of 13.2%.
Capital expenditures were $1,885.1 million in the second quarter of 2025 and $1,415.5 million in the first quarter of 2025. R&D expenditures were $182 million in the second quarter of 2025 and $149 million in the first quarter of 2025.
Revenue in the first half of the year was US$4.46 billion, a year-on-year increase of 22.0%
In the second quarter, SMIC achieved overall sales revenue of US$2.209 billion, a decrease of 1.7% month-on-month; the gross profit margin was 20.4%, a decrease of 2.1 percentage points month-on-month; and the capacity utilization rate was 92.5%, an increase of 2.9 percentage points month-on-month.
Wuhan Minsheng releases two new Wi-Fi 7 series products: Wi-Fi UNII 1-3/5-8 filters, covering 2.4GHz to 7.125GHz.
The Wi-Fi 7 technology standard will be commercialized in 2024. Wi-Fi 7 is reshaping the boundaries of wireless connectivity with blazing speeds of 30 Gbps, comprehensively enhancing Wi-Fi performance in the 2.4G/5G/6G bands and providing high-throughput, low-latency, and high-speed "digital channels" for home, enterprise, and industrial scenarios. According to IDC Research data cited by the Wi-Fi Alliance, global Wi-Fi 7 device shipments will exceed 625 million units in 2025, ushering in explosive growth.
Wuhan Minsheng, targeting Wi-Fi 7 multi-link technology, has launched the new Wi-Fi UNII 1-3 (5.17-5.835GHz) and Wi-Fi UNII 5-8 (5.945-7.125GHz) filters based on the Wi-Fi 256 solution (2.4GHz+5GHz+6GHz) and a proprietary high-end filter technology platform. These filters provide full frequency band coverage from 2.4GHz to 7.125GHz, building a comprehensive Wi-Fi filter product portfolio. By precisely controlling signal interference and achieving efficient coordination among the three frequency bands, Minsheng provides device manufacturers with complete solutions from consumer to enterprise levels, helping to fully unleash the performance of Wi-Fi 7.
Semiconductor packaging equipment service provider: Suzhou Jinyeyuan Automation Equipment Co., Ltd. settles in Fanxiangtong
Suzhou Jinyeyuan Automation Equipment Co., Ltd. (affiliated to Jinyuan Technology Holdings Co., Ltd.), established in August 2011, is a professional service provider specializing in semiconductor packaging, electronic ceramics (LTCC, HTCC) production and equipment agency. It is particularly good at providing micro-assembly and electronic ceramics complete line processes, production solutions and technical support.
Currently, the company's main partners are from Europe and Japan, working together to provide first-class products and solutions to customers in the industry, while also providing professional technical consultants and consulting services. Since its development, the company has cultivated a team of talents with core competitiveness. It has a number of professional pre-sales, after-sales and sales personnel who can actively and quickly respond to customer requirements and provide high-quality, efficient and satisfactory services, creating value for customers and gaining benefits.
Optimized SOI Stacked Si Nanosheet Gate-All-Around FET With Ni(Pt)Si Silicide-First and Load-Si Thinning Techniques
Abstract:
In this article, to optimize the performance of silicon-on-insulator (SOI) stacked Si nanosheet (NS) gate-all-around field-effect transistor (GAAFET) with long source/drain (S/D) regions, special process techniques of Ni(Pt)Si silicide-first and Load-Si thinning are successfully integrated in the experimental devices. Because of the introduced silicide-first process, the transistor performance merits of ON-current (Undefined control sequence \biosc) and transconductance (Gm) are also increased by 34.19% and 80.55% for the reduction of 68.66% in the S/D parasitic resistance. Meanwhile, compared to the Bulk-Si GAAFET, the gate-induced drain leakage (GIDL) current of the SOI GAAFET is also decreased by more than one order of magnitude. However, the subthreshold characteristics of SOI GAAFETs exhibit a rapid degradation as the gate length (Lg) scaling, which is mainly due to the effect of parasitic channel in the remaining Load-Si layer. To optimize the leakage and subthreshold characteristics, the electrical impacts of Load-Si thickness (TLoad-Si) are thoroughly investigated by the experiment and TCAD simulation. The experimental SOI GAAFET fabricated by thinning Load-Si to 19 nm has obtained better subthreshold characteristics, improved normalized Undefined control sequence \biosc, and caused an obvious decrease of OFF-current (Undefined control sequence \biosc) at Lg=30 nm. Meanwhile, the simulation results further show that the SOI GAAFET with shorter Lg needs to continuously decrease TLoad-Si to meet the requirements of a fully depleted channel and low Undefined control sequence \biosc.
Yield on Intel's 18A process is still only ~10%.
Xinping Semiconductor has completed tens of millions of yuan in financing, and its hybrid bonding technology is in the advancement stage.
Shenzhen Xinping Semiconductor Co., Ltd. (hereinafter referred to as "Xinping Semiconductor") recently completed a multi-million RMB Pre-A round of financing, led by Zhongxing Capital. Founded in August 2024, the company is an IDM specializing in the production of 8-inch silicon-based Micro LEDs.
Currently, Xinping Semiconductor is in the development phase of wafer-level hybrid bonding technology, which is expected to be applied in the future in areas such as head-mounted displays, automotive lighting, and projection. In addition, the company is also developing wafer reconstruction technology.
In addition to Xinping Semiconductor, several Micro LED and micro-display companies have recently secured funding rounds. On July 16th, Yanshan Technology announced the completion of nearly 100 million yuan in Pre-A funding, which will be used for the development and mass production of its vertically stacked, monolithic, full-color Micro LED products. In the same month, Micro LED AR glasses company Yingmu Technology secured 150 million yuan in funding to fund next-generation product development, AI capability development, supply chain expansion, and offline experience deployment.