Chinese semiconductor thread II
- Thread starter vincent
- Start date
Domestic robot joint modules adopt GaN, with a target shipment of 20,000-30,000 units
Xinhua Finance reported that another domestic humanoid robot-related company adopted a gallium nitride solution in its servo drive .It is understood that Suzhou Zhuoyu Electric Technology Co., Ltd. and its subsidiary Beijing Zhuoyu Technology Co., Ltd. focus on embodied intelligent core drive components, and independently develop core components of humanoid robots such as planetary joint modules, harmonic joint modules, linear actuators, frameless torque motors, servo drives, and planetary reducers. Among them, the entire series of servo drives adopts gallium nitride solutions with high power density and low heat generation.
Zhuoyu Electric said that this servo drive adopts a large hollow design and high power density design to meet the requirements of the robotics industry. It is not only developed based on GaN power devices, but also highly integrates the driver chip and force control chip into one, with a maximum power of 17KW (100A/200V).
MatrixTime Robotics expanding its inspection equipment offerings for more semiconductor process and incorporating more AI based defect detection automation.
Jushi Technology offers the Juxin 6500 advanced process unpatterned wafer dark-field defect inspection system, suitable for advanced fab processes, large silicon wafers, and Gen3.5 substrates and epitaxial wafers . This dark-field nano-level defect inspection system covers advanced process inspection needs. For CMP/etching/development processes, Gen3.5 SiC/GaN, large silicon wafers, and MicroOLEDs, the Juxin 6300 high-sensitivity wafer process defect inspection system boasts extremely small defect recognition capabilities and strong process adaptability. The system features an embedded AI large-model ADC system, enabling high detection capabilities and complete system intelligence.
With the popularization of technologies such as chiplets and 3D packaging, advanced packaging has placed higher demands on AOI equipment. Jushi Technology's current main products, the Juxin 3000/3300, implement LeadScan 2D/3D defect detection and measurement for IC chips and components, covering 6S LeadScan full inspection of all types of chips such as BGA/QFP/QFN/SiP/Chiplet . For quality control in final inspection and process inspection, it is widely used in quality inspection and unmanned automated defect analysis after semiconductor packaging and electrical testing and before shipment. In addition, the Juxin 3700 product is designed for 2D/3D diebond/wirebond processes and automotive-grade chip process inspection . This equipment has a self-developed 3D inspection module solution, a self-developed large field of view and high-pixel optical and mechanical system, and multi-threaded data algorithms, resulting in industry-leading productivity. Currently, the entire Juxin 3000 product line has been introduced into mass production.
Jushi Technology offers the Juxin 6500 advanced process unpatterned wafer dark-field defect inspection system, suitable for advanced fab processes, large silicon wafers, and Gen3.5 substrates and epitaxial wafers . This dark-field nano-level defect inspection system covers advanced process inspection needs. For CMP/etching/development processes, Gen3.5 SiC/GaN, large silicon wafers, and MicroOLEDs, the Juxin 6300 high-sensitivity wafer process defect inspection system boasts extremely small defect recognition capabilities and strong process adaptability. The system features an embedded AI large-model ADC system, enabling high detection capabilities and complete system intelligence.
With the popularization of technologies such as chiplets and 3D packaging, advanced packaging has placed higher demands on AOI equipment. Jushi Technology's current main products, the Juxin 3000/3300, implement LeadScan 2D/3D defect detection and measurement for IC chips and components, covering 6S LeadScan full inspection of all types of chips such as BGA/QFP/QFN/SiP/Chiplet . For quality control in final inspection and process inspection, it is widely used in quality inspection and unmanned automated defect analysis after semiconductor packaging and electrical testing and before shipment. In addition, the Juxin 3700 product is designed for 2D/3D diebond/wirebond processes and automotive-grade chip process inspection . This equipment has a self-developed 3D inspection module solution, a self-developed large field of view and high-pixel optical and mechanical system, and multi-threaded data algorithms, resulting in industry-leading productivity. Currently, the entire Juxin 3000 product line has been introduced into mass production.
