Chinese semiconductor thread II
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Domestic robot joint modules adopt GaN, with a target shipment of 20,000-30,000 units
Xinhua Finance reported that another domestic humanoid robot-related company adopted a gallium nitride solution in its servo drive .It is understood that Suzhou Zhuoyu Electric Technology Co., Ltd. and its subsidiary Beijing Zhuoyu Technology Co., Ltd. focus on embodied intelligent core drive components, and independently develop core components of humanoid robots such as planetary joint modules, harmonic joint modules, linear actuators, frameless torque motors, servo drives, and planetary reducers. Among them, the entire series of servo drives adopts gallium nitride solutions with high power density and low heat generation.
Zhuoyu Electric said that this servo drive adopts a large hollow design and high power density design to meet the requirements of the robotics industry. It is not only developed based on GaN power devices, but also highly integrates the driver chip and force control chip into one, with a maximum power of 17KW (100A/200V).
MatrixTime Robotics expanding its inspection equipment offerings for more semiconductor process and incorporating more AI based defect detection automation.
Jushi Technology offers the Juxin 6500 advanced process unpatterned wafer dark-field defect inspection system, suitable for advanced fab processes, large silicon wafers, and Gen3.5 substrates and epitaxial wafers . This dark-field nano-level defect inspection system covers advanced process inspection needs. For CMP/etching/development processes, Gen3.5 SiC/GaN, large silicon wafers, and MicroOLEDs, the Juxin 6300 high-sensitivity wafer process defect inspection system boasts extremely small defect recognition capabilities and strong process adaptability. The system features an embedded AI large-model ADC system, enabling high detection capabilities and complete system intelligence.
With the popularization of technologies such as chiplets and 3D packaging, advanced packaging has placed higher demands on AOI equipment. Jushi Technology's current main products, the Juxin 3000/3300, implement LeadScan 2D/3D defect detection and measurement for IC chips and components, covering 6S LeadScan full inspection of all types of chips such as BGA/QFP/QFN/SiP/Chiplet . For quality control in final inspection and process inspection, it is widely used in quality inspection and unmanned automated defect analysis after semiconductor packaging and electrical testing and before shipment. In addition, the Juxin 3700 product is designed for 2D/3D diebond/wirebond processes and automotive-grade chip process inspection . This equipment has a self-developed 3D inspection module solution, a self-developed large field of view and high-pixel optical and mechanical system, and multi-threaded data algorithms, resulting in industry-leading productivity. Currently, the entire Juxin 3000 product line has been introduced into mass production.
Jushi Technology offers the Juxin 6500 advanced process unpatterned wafer dark-field defect inspection system, suitable for advanced fab processes, large silicon wafers, and Gen3.5 substrates and epitaxial wafers . This dark-field nano-level defect inspection system covers advanced process inspection needs. For CMP/etching/development processes, Gen3.5 SiC/GaN, large silicon wafers, and MicroOLEDs, the Juxin 6300 high-sensitivity wafer process defect inspection system boasts extremely small defect recognition capabilities and strong process adaptability. The system features an embedded AI large-model ADC system, enabling high detection capabilities and complete system intelligence.
With the popularization of technologies such as chiplets and 3D packaging, advanced packaging has placed higher demands on AOI equipment. Jushi Technology's current main products, the Juxin 3000/3300, implement LeadScan 2D/3D defect detection and measurement for IC chips and components, covering 6S LeadScan full inspection of all types of chips such as BGA/QFP/QFN/SiP/Chiplet . For quality control in final inspection and process inspection, it is widely used in quality inspection and unmanned automated defect analysis after semiconductor packaging and electrical testing and before shipment. In addition, the Juxin 3700 product is designed for 2D/3D diebond/wirebond processes and automotive-grade chip process inspection . This equipment has a self-developed 3D inspection module solution, a self-developed large field of view and high-pixel optical and mechanical system, and multi-threaded data algorithms, resulting in industry-leading productivity. Currently, the entire Juxin 3000 product line has been introduced into mass production.
Defect density and overlay are complete showstoppers.
GalaxyCore: The company's 0.61-micron 50-megapixel image sensor product has achieved mass production and shipment
GalaxyCore announced the recent mass production and shipment of its 0.61-micron, 50-megapixel image sensor. This product, the world's first single-chip 0.61-micron pixel image sensor, is based on the company's proprietary Galaxy Cell® 2.0 process platform and manufactured in its own wafer fab, significantly improving small-pixel performance.
The product utilizes a 1/2.88 optical aperture, reducing the thickness of camera modules and making it widely applicable to smartphone rear-mounted main cameras, ultra-wide-angle cameras, and front-facing cameras. It also integrates single-frame high dynamic range (DAGHDR) technology, achieving a wider dynamic range in a single exposure, effectively addressing over- and underexposure issues in backlit scenes. It also supports PDAF (phase autofocus), ensuring a fast and accurate shooting experience.
GalaxyCore stated that the company's 0.61-micron 50-megapixel image sensor has entered mass production and shipment, successfully entering the rear-mounted main camera market for branded mobile phones. This marks further market recognition of the company's innovative high-pixel single-chip integration technology and fully demonstrates the efficiency of its Fab-Lite model. To date, the company has achieved mass production of 0.7-micron 50-megapixel, 1.0-micron 50-megapixel, and 0.61-micron 50-megapixel image sensors based on single-chip integration technology.
Subsequently, the company will further iterate the performance of high-pixel products such as 32 million and 50 million based on this technology platform, and at the same time launch higher-specification products with more than 100 million pixels, continuously enhancing the company's core competitiveness, increasing market share and expanding its leading edge.
The product utilizes a 1/2.88 optical aperture, reducing the thickness of camera modules and making it widely applicable to smartphone rear-mounted main cameras, ultra-wide-angle cameras, and front-facing cameras. It also integrates single-frame high dynamic range (DAGHDR) technology, achieving a wider dynamic range in a single exposure, effectively addressing over- and underexposure issues in backlit scenes. It also supports PDAF (phase autofocus), ensuring a fast and accurate shooting experience.
GalaxyCore stated that the company's 0.61-micron 50-megapixel image sensor has entered mass production and shipment, successfully entering the rear-mounted main camera market for branded mobile phones. This marks further market recognition of the company's innovative high-pixel single-chip integration technology and fully demonstrates the efficiency of its Fab-Lite model. To date, the company has achieved mass production of 0.7-micron 50-megapixel, 1.0-micron 50-megapixel, and 0.61-micron 50-megapixel image sensors based on single-chip integration technology.
Subsequently, the company will further iterate the performance of high-pixel products such as 32 million and 50 million based on this technology platform, and at the same time launch higher-specification products with more than 100 million pixels, continuously enhancing the company's core competitiveness, increasing market share and expanding its leading edge.
Maybe a showstopper for logic node manufacturers, it will take them some time to adopt NIL. But memory makers in Japan had been in the NIL train for quite some time.
Prinano has been trying to make their tools for semiconductor manufacturing along Tianren Nano who has been trying to get their tools into MRAM manufacturing.
Saiwei Microelectronics starts trial production of the first batch of MEMS silicon crystal oscillator 8-inch wafers
Saiwei Semiconductor issued an announcement stating that recently, a MEMS (abbreviation of Micro-Electro-Mechanical Systems) silicon crystal oscillator manufactured by the company's controlling subsidiary Saiwei Microsystems Technology (Beijing) Co., Ltd. (hereinafter referred to as "Saiwei Beijing") has passed customer verification. Saiwei Beijing has received a purchase order from the customer and started small-batch trial production of the first batch of MEMS silicon crystal oscillator 8-inch wafers.
Founded in 2008, Saiwei Microelectronics' main products and businesses include process development and wafer manufacturing for MEMS chips, as well as GaN epitaxial material growth and device design. The company manufactures a variety of MEMS chips, including silicon photonics, micro-vibration mirrors, and silicon microphones, as well as RF passive components and modules manufactured using MEMS integration processes. These products are widely used in a variety of fields, including communications, biomedical, industrial automotive, and consumer electronics.
The MEMS silicon oscillator is a new type of frequency control device manufactured based on microelectromechanical systems (MEMS) technology. It generates stable frequency signals through micro-mechanical vibrations of silicon-based materials. It has widely replaced traditional quartz crystal oscillators and has become a core component of the "time reference" in electronic devices. Unlike traditional quartz crystal oscillators, which rely on the piezoelectric effect of the quartz crystal, the vibration source of MEMS silicon oscillators is the silicon material itself, making them more compatible with CMOS integrated circuits and enabling "chip-level" integration
Founded in 2008, Saiwei Microelectronics' main products and businesses include process development and wafer manufacturing for MEMS chips, as well as GaN epitaxial material growth and device design. The company manufactures a variety of MEMS chips, including silicon photonics, micro-vibration mirrors, and silicon microphones, as well as RF passive components and modules manufactured using MEMS integration processes. These products are widely used in a variety of fields, including communications, biomedical, industrial automotive, and consumer electronics.
The MEMS silicon oscillator is a new type of frequency control device manufactured based on microelectromechanical systems (MEMS) technology. It generates stable frequency signals through micro-mechanical vibrations of silicon-based materials. It has widely replaced traditional quartz crystal oscillators and has become a core component of the "time reference" in electronic devices. Unlike traditional quartz crystal oscillators, which rely on the piezoelectric effect of the quartz crystal, the vibration source of MEMS silicon oscillators is the silicon material itself, making them more compatible with CMOS integrated circuits and enabling "chip-level" integration