Chinese semiconductor thread II
- Thread starter vincent
- Start date
you are comparing 2021 products with 2025.
with current geopolitical situation and advancements in domestic chips. most probably all these chips would already have been replaced.
CXMT not only producing LPDD4 now but producing in large volume, that causing other competitors to reduce prices. and this is last year news.
for MMC memory cards, there are many Chinese companies like China chip star Semi Co., Ltd , Shenzhen Changfengqi Technology Co., Ltd..
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China have caught up in Analog chips. its all about capture the market share. Chinese firms recently break the deadlock in many Analog chips and rapidly gaining customers.
some of the best local MCUs to ADCs coming from from Hisilicon.
Black Sesame & Horizon have great ADAS and edge-related products.
HiSilicon Unveils AC9610 ADC Challenging TI and ADI in High-Performance Market
After the launch of AC9610 in March, great expectations have been generated for ultra-high precision ADCs and HiSilicon is already developing AC963X and AC962X will be launched in August, 16-bit, 125Msps (2,4,8,16 channels)
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Suzhou Xunxinwei's latest ADC analog-to-digital converter
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100%. He's looking for a job at a hedge fund
Even assuming that this is not their previous 2019 designs, is not that DJI lacks options, they have options, the issue is that the Chinese government is not this all encompassing entity that Western think tanks stooges made it to be. Chinese companies can make their own procurements and design choices, maybe that is the reason China ended in that horrible predicament with export controls.
But either way is not the lack options.
One of the most interesting aspect of China current Logic, Memory, 3rd Gen semis, MEMS, RF, Photonics and advance packaging capabilities, that I don't think is present in a lot of countries, and correct me if I am wrong, that outside of the very cutting edge logic nodes like 3nm, is that there are SO many options in China, so much capacity in China, that a lot of Chinese electronics companies can make costum advanced solutions at a relative decent cost.
For example a drone producer can get Mems sensors wafers from Saiwei, Logic wafers from SMIC/HLMC, DRAM wafers from CXMT and 2D-NAND wafers. And then go to JCET or any other advance packaging integrator in China and make solutions that wouldn't be possible using traditional methods.
That problem that will make Chinese companies become more propetary with their designs, pretty much like Apple.
For example a drone producer can get Mems sensors wafers from Saiwei, Logic wafers from SMIC/HLMC, DRAM wafers from CXMT and 2D-NAND wafers. And then go to JCET or any other advance packaging integrator in China and make solutions that wouldn't be possible using traditional methods.
That problem that will make Chinese companies become more propetary with their designs, pretty much like Apple.
Do you know any domestic supplier offer range sensing chip in 2025? ADC is only a subset of the functions required.
Guess we have to wait and see if they can be adopted by DJI for the drone solution.
Or those only good enough for robots.
These chips are widely used in a variety of consumer electronics applications, including sweepers, drones, and mobile phones, as well as in applications such as AR/VR, smart homes, and autonomous driving lidar. The company's management team comprises senior technical experts from both China and abroad with over 15 years of industry experience.
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He is forcing Apple to invest $600b. Some of the investment may go to micron.
Intel and Samsung has EUV since the beginning, even with input to ASML specs.
Samsung has <30% yield. Intel has 10%.