Love?
Can guarantee that Chinese big tech hate Huawei more than NVIDIA. Huawei has it's fingers on the entire China's tech space and is a big competitor.
They would prefer to diversify their orders
Chinese semiconductor thread II
- Thread starter vincent
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Can guarantee that Chinese big tech hate Huawei more than NVIDIA. Huawei has it's fingers on the entire China's tech space and is a big competitor.
They would prefer to diversify their orders
They are not direct competitor though. Huawei more on the hardware side while Ali or Bytedance are more software. Agree that Huawei is very aggressive but I think the main reason is still Huawei chip is not as advanced as NVIDIA yet.
They probably want to have nvidia chips made in China using local machines and equipment.
I think we should just stop here with this discussion because I can tell you for sure that a huge part of reluctance for ascend sales is that other big domestic tech companies are suspicious of huawei.
Xinde Semiconductor has completed another round of financing of nearly 400 million yuan and is a domestic advanced packaging and testing R&D company.
Jiangsu Xinde Semiconductor Technology Co., Ltd. ("Xinde Semiconductor") recently secured nearly 400 million yuan in funding, following its latest round of financing. This round will further consolidate its technological advantages in mobile products and heterogeneous packaging modules. This round of financing was jointly led by Nanjing municipal and district-level institutions, with participation from the Jiangsu Nanjing Advanced Manufacturing Industry Special Fund, Oriza Puhua, and Yushan Capital. The funds will be primarily used to further accelerate the development and production of high-end packaging and testing technologies such as SiP (System-in-Package), FOWLP (Fan-Out Wafer-Level Packaging), chiplet 2.5D/3D, and heterogeneous packaging modules. This will further help the company break through the barriers to high-end packaging technology and inject strong momentum into the independent and controllable development of the industry chain.
According to public information, Xinde Semiconductor, founded in September 2020, is a high-tech enterprise specializing in semiconductor packaging and testing. After nearly five years of development, Xinde Semiconductor has become one of the leading domestic semiconductor back-end process companies. It is the first domestic company to simultaneously provide services in cutting-edge high-end technology fields such as 2.5/3D integration, through-glass vias (TGV), through-silicon vias (TMV), LPDDR memory packaging, and optical sensing (CPO) packaging. It provides customers with packaging product design and services for bumping, WLCSP, flip chip PKG, QFN, BGA, SIP, SIP-LGA, and 2.5D. Its products are widely used in a variety of products, including multimedia smart terminal SoC chips, RF front-end chips, and artificial intelligence (AI) chips.
Xinde Semiconductor possesses the independent packaging and testing capabilities of chiplet packaging technology, one of the few in China. It has successfully launched the CAPiC chip and advanced packaging technology platform. Through heterogeneous integration of chips from different process nodes, it breaks through the bottlenecks of traditional SoC in integration, power consumption and heat dissipation, achieves efficient resource utilization and improves design flexibility, and can meet the high bandwidth, low latency and high reliability needs of high-performance computing (HPC), artificial intelligence (AI), data centers and other fields.
In June of this year, Xinde Semiconductor officially commenced construction on its AI Advanced Packaging and Testing Base project, with a total investment of 5.5 billion yuan. The first phase of the project, with a 1 billion yuan investment, plans to build 153,000 square meters of modern factory space, equipped with advanced production equipment, and establish two world-leading high-end packaging production lines. The project aims to overcome the packaging challenges of AI computing chips and precisely meet the high-performance packaging needs of 5G communications and automotive-grade chips. Upon completion and full production, the first phase will be able to produce 18,000 2.5D packaged products and 300 million wafer-level high-density chip packages annually.
Guangli Micro acquires 100% equity interest in LUCEDA NV, expanding into PDA and planning four areas of collaboration.
Guangli Microelectronics acquired 100% equity in LUCEDA a global leader in silicon photonics design automation (PDA) software, providing tools for optoelectronic chip design, simulation, and PDK development.
Traditional EDA tools are inadequate for silicon photonics due to challenges in optoelectronic device coordination. The PDA market remains nascent (vs. mature EDA), offering a window for new players to address design efficiency, accuracy, and automation gaps.
Guangli’s goal is to expand from traditional EDA/wafer testing into PDA to build end-to-end solutions for silicon photonics (design → manufacturing → testing → yield improvement).
Four collaboration areas:
- Complete the PDA toolchain (e.g., unified optoelectronic design platform, AI-enhanced simulation, photonic IP libraries).
- Develop yield-improvement solutions (combining Guangli’s semiconductor EDA expertise with LUCEDA’s photonics design).
- Advance wafer-level photodetection equipment (focusing on optical-electrical coupling and automated testing).
- Joint global market expansion (Guangli enters Europe/U.S.; LUCEDA targets Chinese manufacturers).
The move positions Guangli to address critical bottlenecks in silicon photonics commercialization—especially yield challenges—as demand for photonic chips grows in AI/data centers. LUCEDA’s expertise anchors Guangli’s transition into the emerging $1B+ PDA market.
Isn't this spoofed easily. And anyways they might just shift training to SEA.
Qingshen Meisi's annual production of 20,000 tons of semiconductor packaging materials project is sprinting to a key milestone and is expected to be delivered and put into use by the end of August
Recently, Sichuan Province's key industrial project, the Meisi semiconductor packaging material project with an annual output of 20,000 tons (hereinafter referred to as the Qingshen Meisi project) located in the Qingshen Development Zone, has made new progress.
The main factory building has been topped off, the parking lot has been completed, and customized equipment installation is about to begin. It is expected to be delivered and put into use at the end of August and put into production in November.
After the project reaches full production, it is expected to produce 20,000 tons of semiconductor epoxy molding materials annually , directly creating more than 400 jobs and attracting upstream and downstream supporting enterprises to gather. It is expected to drive the regional semiconductor industry output value to grow by more than 1 billion yuan , which will greatly enhance the production capacity of the Sichuan-Chongqing region in the field of semiconductor packaging materials and achieve regional leadership.
The Qingshen Meisi project is funded and constructed by Shenzhen Xinchuangyuan Precision Intelligent Manufacturing Co., Ltd. and Qingshen Industrial Investment Fund.
The launch of the Qingshen Meisi project marks the Sichuan-Chongqing region's leap from "following" to "running side by side" in the field of packaging materials. The mass production of its semiconductor packaging materials will effectively alleviate the domestic dependence on imports of high-end packaging materials and provide key support for strategic emerging industries such as new energy vehicles and 5G communications.
Dinglong Semiconductor Packaging PI and Temporary Bonding Adhesive Products Achieve Mass Production and Sales with Revenue of RMB 8.6 Million in the First Half of the Year
Semiconductor Materials and Integrated Circuit Chip Design and Applications Business: Operating revenue reached approximately RMB 945 million, a year-on-year increase of approximately 49%. Net profit attributable to shareholders of this segment surged significantly by 104% year-on-year.
-CMP polishing pad sales revenue increased by 59% year-on-year. In the second quarter of this year, this saw a 16% quarter-on-quarter increase and a 57% year-on-year increase. With the continued ramp-up of polishing pad production capacity and ongoing cost optimization, scale profitability is expected to further improve.
-Combined sales revenue of CMP polishing and cleaning fluid products increased by 56% year-on-year. In the second quarter of this year, sales revenue increased by 16% quarter-on-quarter and 58% year-on-year. Copper process polishing fluids achieved their first order breakthrough. Alumina polishing fluids and polysilicon polishing fluids, which passed preliminary verification in the first two quarters, are gradually increasing in volume with clients and are expected to see growth in the third quarter. The rapid penetration of multiple polishing and cleaning fluids into mainstream wafer fabs will provide new growth drivers for the company.
-Semiconductor display materials business sales revenue increased by 62% year-on-year. The company's business in this area continues to grow through the expansion and iterative upgrades of its product portfolio, customer acquisition, and continued revenue growth. This, coupled with improved capacity utilization among downstream display customers and increased market share for the company's products, will drive continued profitability and support steady demand growth in the second half of the year.
-Advanced semiconductor packaging materials achieved sales revenue of approximately RMB 8.6 million, with the accelerated market introduction of KrF/ArF wafer photoresist. Client validation of the company's semiconductor advanced packaging materials and other new materials businesses, including wafer photoresist, is ongoing and progressing in line with the company's expectations.
