Chinese semiconductor thread II

[tokenanalyst]

Wanying Microelectronics completed its A round of financing and is a domestic advanced packaging and testing company​

Chengdu Wanying Microelectronics Co., Ltd. ("Wanying Microelectronics") recently completed its Series A financing round, led by Chengdu High-Tech Investment. This investment aims to support Wanying Microelectronics' continued innovation and development in advanced microelectronics packaging and testing technologies.

Public information indicates that Wanying Microelectronics, established in August 2021, is a provider of advanced microelectronics packaging and testing technologies. The company is committed to building an advanced packaging pilot platform and production line integrating wire bonding, flip-chip bonding, reliability, and failure analysis. The company provides customers with one-stop packaging services, including packaging solutions and design, simulation, prototyping/mass production, supplier coordination, and reliability testing/failure analysis.

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[tokenanalyst]

Zhengzhou Hejing's 12-inch large silicon wafer phase II project has made new progress​

According to relevant officials, the cleanroom construction for the Zhengzhou Hejing Phase II project is currently underway, with completion scheduled for the end of September. Once operational, the project aims to produce 100,000 12-inch silicon wafers per month. This will fill a technological gap in my country's high-end, large-size silicon wafer manufacturing, significantly increase the localization rate of key semiconductor materials, and have strategic significance for improving the domestic integrated circuit industry chain.

It is reported that Zhengzhou Hi-Tech launched a 12-inch large silicon wafer crystal growth and epitaxial research and development project at the end of 2023, which can further consolidate Zhengzhou Hi-Tech's leading position in the field of large-size semiconductor silicon epitaxy, and at the same time introduce unmanned automatic production processes in the semiconductor industry into Henan, laying the foundation for the future development of the chip industry in Henan.

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[LanceD23]

most have domestic alternative..

Best Analog domestic chips coming from Hisilicon. range from MCUs to ADCs.

Black Sesame & Horizon have great ADAS and edge-related products.

then comes Novosense and BYD.

DJI is using TI range sensing chip with GPS support for drones.

No domestic supplier yet.
TI also supply alot of analog switch, level shifter,

 

[tokenanalyst]

better DUV excimer lasers​

Fujing Technology's (CASTECH) "Highly Laser-Damage-Resistant UV Crystal" project stood out among many participating projects and won the gold award.​

High-power, high-repetition-rate UV lasers, due to their advantages such as short wavelength and high peak power, can avoid the formation of thermally induced ablation melts when used in laser processing, truly realizing laser "cold processing". There is a huge market demand for UV lasers for manufacturing in the industrial processing fields at home and abroad, showing a "blowout" development trend, especially for high-end solid-state UV lasers. One of the core materials of solid-state UV lasers is the frequency-doubling crystal used for frequency conversion. At present, the frequency-doubling crystals used in most solid-state UV lasers on the market are LBO crystals and BBO crystals. The control of their growth defects and the quality of subsequent processing coatings will affect the performance of the entire laser. Therefore, low-defect crystal growth and high-quality surface coatings are the key research contents of this project .





Fujing Technology's "High Laser Damage-Resistant UV Crystal" project has completed temperature field design and flux selection for large-scale, high-quality LBO and BBO crystals. The project also conducted research on raw material control methods for growing low-absorption LBO crystals. The project also conducted theoretical and experimental research on the laser damage mechanism, surface coating materials, and plating processes. The project also completed the coating of high-damage-threshold films on the crystal surfaces, achieving all expected performance targets. The project also established a production line for large-diameter, high-quality LBO and BBO crystals, resulting in a comprehensive product line of crystal devices.

This project provides China with advanced crystal components for high-performance ultraviolet lasers in the field of high-end precision manufacturing, and has made a certain contribution to improving China's overall technological level in the industrialization of ultraviolet lasers .

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[tokenanalyst]

DJI is using TI range sensing chip with GPS support for drones.

No domestic supplier yet.

That is DJI own choice to use TI but definitely there domestic suppliers of mmWave radars in China and GNSS chips. Also is not impossible to them to make their own sensors and chips given the abundance of manufacturing capacity currently in China.

 

[LanceD23]

That is DJI own choice to use TI but definitely there domestic suppliers of mmWave radars in China and GNSS chips. Also is not impossible to them to make their own sensors and chips given the abundance of manufacturing capacity currently in China.

I think TI chip using infrared for distance measurement also it's output has i2C , a common interface protocol. Low cost and user friendly to develope.
DJI got banned in US yet still clinging to TI solution means it doesn't have much choice. DJI knows using US chip is a liability.

 

[vincent]

I think TI chip using infrared for distance measurement also it's output has i2C , a common interface protocol. Low cost and user friendly to develope.
DJI got banned in US yet still clinging to TI solution means it doesn't have much choice. DJI knows using US chip is a liability.

Banned in the US?

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[tokenanalyst]

I think TI chip using infrared for distance measurement also it's output has i2C , a common interface protocol. Low cost and user friendly to develope.
DJI got banned in US yet still clinging to TI solution means it doesn't have much choice. DJI knows using US chip is a liability.

The only information that I have found about DJI and TI chips is for battery management. I think of raging and sensing they may have their own custom solution

 

[LanceD23]

The only information that I have found about DJI and TI chips is for battery management. I think of raging and sensing they may have their own custom solution

China mostly good at digital chips like CPU and MCU but specialty analog chips, it has a way to catch up

Texas Instruments OPT3101 ToF Sensor
The Texas Instruments OPT3101 Time of Flight (ToF) sensors are high-speed, high-resolution analog front ends (AFEs) for ToF-based continuous wave proximity and ranging sensors

 

[latenlazy]

Jukan is just a kid. Hasn’t even gotten his first job yet and is clearly going into financial research rather than engineering. Always read his takes with a healthy helping of salt.