Chinese semiconductor thread II

[OptimusLion]

Self-developed chip 3D stacking packaging technology! Another semiconductor project signed and settled in Optics Valley

On February 27, Wuhan Xinli Technology Co., Ltd. (hereinafter referred to as "Xinli") signed a contract with the East Lake High-tech Zone to build a heterogeneous integrated high-precision bonding equipment research and development and application project in Optics Valley.

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[OptimusLion]

ST and Sanan Optoelectronics' 8-inch SiC wafer joint venture plant is online today and is expected to start production in Q4


On February 27, STMicroelectronics China announced that the 8-inch silicon carbide wafer joint venture manufacturing plant established with Sanan Optoelectronics in Chongqing (i.e. "STMicroelectronics Co., Ltd.", hereinafter referred to as STMicroelectronics) is now officially online. This milestone marks that STMicroelectronics and Sanan are steadily moving towards the goal of local production of 8-inch silicon carbide in China by the end of 2025, which will better meet the growing demand for silicon carbide in China's new energy vehicles, industrial power supplies and energy markets.

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[def333]

China 2024 IC imports is 549 billions units at a value of 385 billion dollars.

China 2024 IC exports is around 298 billion units at a value of 160 billion dollars

While domestic 2024 IC production is 451 billions units.

Self-sufficiency rate
451/（549+298）= 53.3% ？

 

[OptimusLion]

Breaking the limit! Graphene and diamond team up to create a king bomb!

Recently, Professor Shen Bin's research group at Shanghai Jiao Tong University has made important progress in the field of high-performance abrasives. The research group published a research paper titled "Covalently armoring graphene on diamond abrasives with unprecedented wear resistance and abrasive performance" in the top mechanical journal "International Journal of Machine Tools and Manufacture". Through the use of graphene to armor diamond abrasives with covalent bonds, the physical performance limit of traditional abrasives has been broken through for the first time. This research not only improves the wear resistance and polishing performance of traditional abrasives, but also provides a new technical solution for in-situ modification of micro/nanoparticle surfaces based on liquid metal catalysis.

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[tokenanalyst]

Self-sufficiency rate
451/（549+298）= 53.3% ？

298 is what the article say was exported. I guess most of those exports are in complete electronic products.
451/(549+451) = 45%

 

[tokenanalyst]

Sanan STMicroelectronics' Chongqing 8-inch silicon carbide project is officially put into production and will achieve mass production in Q4​

The STMicroelectronics silicon carbide wafer plant jointly established by Sanan Optoelectronics and STMicroelectronics in Chongqing was officially put into production. The project is expected to achieve mass production in the fourth quarter of 2025. This will become the first large-scale mass production line of 8-inch automotive-grade silicon carbide power chips in China. After the project is fully put into production, it can produce about 10,000 automotive-grade wafers per week.

According to reports, STMicroelectronics Co., Ltd. was established in August 2023, jointly funded by Sanan Optoelectronics (51% equity) and STMicroelectronics (China) Investment Co., Ltd. (49% equity). The project plans a total investment of about 23 billion yuan , and will build an 8-inch silicon carbide wafer production line with an annual output of about 480,000 pieces. The main product is automotive-grade electronic control chips. To support this project, Sanan Optoelectronics established Chongqing Sanan Semiconductor Co., Ltd. in July 2023, and planned to invest 7 billion yuan in the same park to build an 8-inch silicon carbide substrate production line with an annual output of 480,000 pieces, which was put into production in September 2024.

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[Hyper]

Nvidia is a monster.

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Jensen's management style is inspiring. That's all I can say.

 

[tokenanalyst]

Eagle Semiconductor completes round B financing of over 300 million yuan and will build an intelligent photonic chip R&D center in Hangzhou​

Eagle Semiconductor has successfully completed its Series B financing in December 2024, with a financing amount of more than 300 million yuan. Investors include SAIC Group, Nova Nebula, Hillhouse Capital, Caitong Capital, Excellence Capital and Tangxing Capital. The funds will be used to further increase R&D investment, product iteration and upgrading, as well as the construction of talent echelons and the expansion of market channels, to help the continuous innovation and breakthrough of optical interconnection technology in the AI intelligent computing center, enable intelligent perception in the era of artificial intelligence +, and thus enhance China's competitiveness in the global industrial chain. After this round of financing, Eagle Semiconductor will build a high-performance intelligent photonic chip R&D center in Hangzhou to further promote the research and development of downstream applications such as optical interconnection, intelligent driving, and machine perception.
It is reported that the founding team of Eagle Semiconductor is composed of some founding members of the former optoelectronics leader Huacan Optoelectronics and elites in the global vertical cavity surface emitting laser (VCSEL) technology and industrialization. The R&D team brings together R&D, engineering and mass production experts from UT-Austin, Tsinghua University, Peking University, Chinese Academy of Sciences and global leading optoelectronics companies to jointly form a team with efficient integration from technology to market. Since its establishment in 2018, the team has clarified its original technology-driven and vertically integrated manufacturing model, and will achieve full IDM from design to manufacturing in 2023.
According to Hengxu Capital, in 2024, Eagle Semiconductor released the first domestic single-wavelength 100G VCSEL chip that is independently controllable from design to production, becoming the first company in China and the second in the world to achieve mass production of 100G VCSEL, truly breaking through the "bottleneck" problem of high-speed data communication chips. So far, Eagle Semiconductor's cumulative mass production shipments of single-wavelength 100G chips and 50G chips have exceeded one million channels.

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[OptimusLion]

Eswi Computing actively promotes the implementation of RISC-V applications


On February 27, the 2025 China RISC-V Ecosystem Conference was held in Beijing. With the theme of "Building an Ecosystem and Sharing the Future", this conference brought together experts, scholars, business leaders and developers from all over the world, aiming to strengthen exchanges and cooperation, promote the development of China's RISC-V ecosystem, and promote the global integrated circuit industry to accelerate innovation in the RISC-V track.


At the meeting, as co-chairman of the 2025 China RISC-V Ecosystem Conference, Wang Dongsheng, chairman of Eswei, delivered a speech. He said, "We must build a green, efficient, flexible and innovative computing base to achieve deep integration and coordinated optimization of computing power and algorithms, so as to continuously improve computing performance and efficiency and meet the needs of flexible model deployment in different scenarios. The RISC-V computing architecture, with its simplicity, openness, flexibility, low power consumption, modularity and scalability, just meets this demand and becomes the first choice for the computing base of digital infrastructure in the AI era."

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[tokenanalyst]

Jinghe Integrated Circuit and SmartSens signed a strategic cooperation agreement to deepen the cooperation, focusing on overcoming the bottleneck of CIS Stacked process​

On February 24, Cai Guozhi, Chairman of Jinghe Integrated Circuit, and his delegation visited SmartSens and had in-depth exchanges with Xu Chen, Chairman of SmartSens, on new cooperation goals, and signed a
According to Jinghe Integrated Circuit, on February 24, Cai Guozhi, Chairman of Jinghe Integrated Circuit, and his delegation visited SmartSens, and had in-depth exchanges with Xu Chen, Chairman of SmartSens, on new cooperation goals, and signed a long-term strategic cooperation agreement on the spot. The two parties will increase cooperation in process development, product innovation, and production capacity supply.
The two parties signed a strategic cooperation agreement this time with the aim of fully overcoming the key technical bottlenecks of the domestic CIS Stacked process, accelerating the technological progress of domestic high-end CIS chips, and promoting the popularization of high-end CIS Stacked technology to a wider range of smartphone applications.
SmartSens is a leading domestic CIS chip manufacturer. According to the TSR report, in 2023, SmartSens ranked first in the world in CIS shipments in the smart security field, fourth in the automotive field, and fifth in the world in the mobile phone field.
Jinghe Integrated is the first 12-inch wafer foundry in Anhui Province. It is committed to contributing to the improvement of China's independent and controllable integrated circuit manufacturing capabilities. In May 2023, the company was officially listed on the Science and Technology Innovation Board of the Shanghai Stock Exchange, becoming the first pure wafer foundry in Anhui Province to successfully enter the capital market.

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