Darpa? Isnt that like the U S mil r&d?
Chinese semiconductor thread II
- Thread starter vincent
- Start date
Sometimes they do open source projects.
Tianyue Advanced Technology expands substrate production capacity
Shandong Tianyue Advanced Technology Co., Ltd. disclosed the "First Extraordinary General Meeting of Shareholders in 2025". The main content is to submit thirteen proposals regarding the company's listing in Hong Kong and other matters to the shareholders' meeting for deliberation. Among them, relevant content about the SiC substrate project was announced in the meeting materials.
As a third-generation semiconductor material, silicon carbide (SiC) has excellent properties such as high breakdown field strength, high saturated electron drift rate, high thermal conductivity, and strong chemical stability. It has significant application value in electric vehicles, rail transit, high-voltage transmission and transformation, photovoltaics, 5G communications and other fields. Driven by strong demand from the new energy industry, the global SiC industry has entered a period of rapid growth, increasing the demand for SiC substrate production capacity. In recent years, SiC substrate manufacturers have accelerated the research and development and mass production of 8-inch substrates to seize the 8-inch opportunity. Although the domestic start time is relatively late, the research on 8-inch SiC substrates has made significant progress in recent years. In 2022, many units announced the successful development of 8-inch conductive 4H-SiC products, including Tianyue Advanced.
Looks like some very compact gratings interferometer.
Beijing Jingyi Precision Technology Co., Ltd. has obtained a patent called "A Self-cooling Wafer Polishing Method" , which can achieve self-cooling in the polishing process .
Wafers, as the core carrier of semiconductor chips, have a surface quality that directly determines the performance and reliability of the chip. Wafer polishing is to achieve the ultimate smoothness of the wafer surface, remove tiny flaws and irregularities, and lay a solid foundation for subsequent chip manufacturing processes. Chemical mechanical polishing (CMP) combines the dual effects of mechanical friction and chemical corrosion and is currently the most commonly used polishing method in semiconductor manufacturing. CMP can not only effectively remove the rough layer and excess material on the surface of the wafer, but also reduce damage to the wafer surface while ensuring high flatness.
The performance of chemical mechanical polishing liquid is one of the key factors affecting the quality and efficiency of chemical mechanical polishing. The polishing liquid generally contains oxidants, complexing agents, surfactants, abrasives , pH regulators, corrosion inhibitors and other ingredients. The selection and content of various additives will have a great impact on the polishing effect. The polishing liquid has the characteristics of high technical content, strong confidentiality, and non-recyclability, which makes it the most expensive part of CMP technology.
Polishing pads also play an indispensable and important role in the CMP system, and have a great impact on the surface quality and material removal rate of the polished workpiece. During the polishing process, the polishing pad has the following two main functions: to form a mechanical grinding effect on the workpiece surface together with the abrasive particles; to transport and store the polishing liquid, so that the polishing liquid and the workpiece surface undergo an oxidation reaction, etc. The invention of Beijing Jingyi Precision Technology Co., Ltd. involves a self-cooling wafer polishing method.
The self-cooling wafer polishing method includes: providing a wafer, the Mohs hardness of the wafer is 8 to 10; using a polishing head to fix the wafer on a polishing pad, the material of the polishing pad is a thermoplastic material; introducing the polishing liquid into the side of the polishing pad that contacts the wafer through a polishing liquid pipeline; the polishing liquid does not contain abrasive particles; rotating the polishing disk and the polishing head to perform a polishing process on the wafer. The self-cooling wafer polishing method provided by the invention can achieve self-cooling during the polishing process, ensuring that the temperature of the polishing pad is within a relatively low range, which can effectively extend the service life of the polishing pad, avoid problems such as failure of the polishing head back film and debonding of the polishing pad, reduce the risk of wafer scratches, and improve the quality of wafer polishing.
Total amount of 1.054 billion! Shanghai Silicon Industry signed a contract to purchase electronic grade polysilicon
Shanghai Silicon Industry issued an announcement stating that Shanghai Xinsheng, a subsidiary of Shanghai Silicon Industry Group Co., Ltd., and its holding subsidiaries Xinsheng Jingrui and Jinke Silicon Materials plan to sign an electronic-grade polysilicon procurement framework contract with supplier Xinhua Semiconductor.
Shanghai Silicon Industry said that the validity period of this framework contract is 5 years, from January 1, 2025 to December 31, 2029; if the contract needs to be renewed upon expiration, the two parties shall re-sign the contract. From 2025 to 2029, the buyer will purchase electronic-grade polysilicon products from the seller at a price and the total contract amount is expected to be RMB 1.054 billion. It is understood that electronic-grade polysilicon is a high-purity polysilicon material with a purity requirement of 99.9999999~99.9999999999 (9N~11N).
It is the most important and basic functional material for the semiconductor industry and the electronic information industry, and is known as the "food" of the electronic information industry. Integrated circuits are the basic content of information development and a pillar industry for my country's strategic development. They play an important role in promoting the normal development of my country's new economy. As the upstream end of the integrated circuit industry, the development status of electronic-grade polysilicon and its product quality play a vital role in the downstream.
It is the most important and basic functional material for the semiconductor industry and the electronic information industry, and is known as the "food" of the electronic information industry. Integrated circuits are the basic content of information development and a pillar industry for my country's strategic development. They play an important role in promoting the normal development of my country's new economy. As the upstream end of the integrated circuit industry, the development status of electronic-grade polysilicon and its product quality play a vital role in the downstream.
thus is very interesting from SUMCO earnings
Chinese wafers producers are up to par on 200mm and 3D NAND wafers. Just need to fully catch up in 300mm and DRAM now
Why didn't he get a job in the industry like at HiSilicon, or any other Chinese IC design firm? Non-competition clause?
Maybe he is an American citizen or permanent resident. Biden banned “US Person” from working in the Chinese semiconductor industry.