Chinese semiconductor thread II
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Peking University team makes important progress in organic semiconductor single crystal research
The team of He Ming, a researcher at the School of Integrated Circuits/Integrated Circuit High-tech Innovation Center of Peking University, proposed a general strategy of nano-confined polarization induction (nano-CMDO) and successfully prepared a series of different types of organic conjugated polymer single crystal films, including: polythiophene P3HT, thiophene homopolymer PBTTT, p-type electron donor-acceptor copolymer DPPT-TT and n-type electron donor-acceptor copolymer N2200, solving the problem of lack of general preparation method for organic conjugated polymer single crystal films.
The team of He Ming, a researcher at the School of Integrated Circuits/Integrated Circuit High-tech Innovation Center of Peking University, proposed a general strategy of nano-confined polarization induction (nano-CMDO) and successfully prepared a series of different types of organic conjugated polymer single crystal films, including: polythiophene P3HT, thiophene homopolymer PBTTT, p-type electron donor-acceptor copolymer DPPT-TT and n-type electron donor-acceptor copolymer N2200, solving the problem of lack of general preparation method for organic conjugated polymer single crystal films.
Interesting, the US making a bold move against TSMC.
More details from Digitimes.
More details from Digitimes.
Replace Intel with Apple or Nvidia, then TSMC might play ball. Though AMD and Nvidia are only ones who can bear higher costs because they are market leaders in a pretty high margin sectors. Intel probably does not even want this deal.
I 100% see TSMC bypassing this and going straight to Apple, AMD and Nvidia since these are their largest customers.
Misi Technology received tens of millions of yuan in Series A financing, a MEMS sensor chip company
According to Pudong Venture Capital, Shanghai Misi Technology Co., Ltd. (Misi Technology) has recently completed a round A financing of tens of millions of yuan, with investors including Pudong Technology Investment Angel Fund under Pudong Venture Capital. This financing will help Misi Technology continue to expand in the automotive electronics, smart watches, and smart phone markets and introduce more production capacity.
Misi Technology is a high-tech enterprise focusing on the research and development of MEMS sensor chips. Its independently developed "minimally invasive surgery" process (MIS) gives the sensor many competitive advantages from the bottom up, such as high yield rate, good consistency, small size, strong performance, and low cost. The company's current main product is pressure sensors, and it has completed the core patents and technology reserves for flow sensors and infrared sensors. The company has shipped millions of units since mass production, reflecting strong market competitiveness.
RISC-V AI SoC successfully adapted to DeepSeek model.
Eswi Computing successfully adapted the DeepSeek model on the EVB development board equipped with its self-developed RISC-V AI SoC EIC77 series chips - EIC7700X and EIC7702X.
EVB board equipped with Eswin Computing EIC77 series chips
EIC7700X/7702X has built-in NPU, GPU, DSP and other hardware acceleration modules, and is equipped with large-capacity, high-bandwidth LPDDR5 memory, ensuring that hardware resources can be fully utilized when processing DeepSeek large-scale models and large model parameters can be quickly transferred, thereby significantly improving reasoning efficiency.
The test results show (see the figure below) that when running the DeepSeek-distill-qwen model with a parameter scale of 7b, the EVB development board equipped with the Eswin Computing EIC7700X chip can reach an inference speed of 7 tokens/s, and the EVB development board equipped with the Eswin Computing EIC7702X chip can reach an inference speed of 14 tokens/s, demonstrating a high energy efficiency ratio that far exceeds similar architectures.
Hua Hong Semiconductor's Q4 performance met expectations; new 12-inch production line is expected to provide incremental growth for emerging industries
On February 13, Hua Hong Semiconductor (A-share code: 688347, Hong Kong stock code: 01347) released its fourth-quarter results. According to the announcement, the company's performance in the fourth quarter of 2024 was in line with guidance, with sales revenue of US$539.2 million, a year-on-year increase of 18.4% and a month-on-month increase of 2.4%; the single-quarter gross profit margin was 11.4%, an increase of 7.4 percentage points year-on-year; the full-year sales revenue in 2024 was US$2.004 billion, and the full-year gross profit margin was 10.2%.
Mr. Bai Peng, the new president and executive director of the company, participated in the performance release on behalf of Hua Hong Semiconductor for the first time. He said that the market demand in 2024 was complex and changeable, the recovery of the consumer sector and the rapid growth of some emerging application markets drove the company's image sensors, power management and other platforms to perform well. In the face of fierce market competition, the company still maintained stable revenue and production capacity, and the overall performance showed a trend of increasing quarter by quarter. The average annual capacity utilization rate was close to 100%, which is at the leading level among global wafer foundry companies.
In the fourth quarter, the company's sales revenue of analog and power management and logic and RF platforms continued to grow rapidly, the embedded/stand-alone non-volatile memory platform remained stable, and consumer electronics continued to be Hua Hong Semiconductor's largest terminal business segment, contributing sales revenue of US$344.6 million, accounting for as high as 63.9%. On this basis, the company is expected to fully benefit from the edge AI industry trend and usher in a new stage of growth. It is reported that the company's utilization rate has been close to or reached full production for several consecutive quarters. With the full deployment of various process platforms of the new 12-inch production line in Wuxi and the gradual release of production capacity, it is expected to drive the company's revenue scale to a higher level.
Mr. Bai Peng, the new president and executive director of the company, participated in the performance release on behalf of Hua Hong Semiconductor for the first time. He said that the market demand in 2024 was complex and changeable, the recovery of the consumer sector and the rapid growth of some emerging application markets drove the company's image sensors, power management and other platforms to perform well. In the face of fierce market competition, the company still maintained stable revenue and production capacity, and the overall performance showed a trend of increasing quarter by quarter. The average annual capacity utilization rate was close to 100%, which is at the leading level among global wafer foundry companies.
In the fourth quarter, the company's sales revenue of analog and power management and logic and RF platforms continued to grow rapidly, the embedded/stand-alone non-volatile memory platform remained stable, and consumer electronics continued to be Hua Hong Semiconductor's largest terminal business segment, contributing sales revenue of US$344.6 million, accounting for as high as 63.9%. On this basis, the company is expected to fully benefit from the edge AI industry trend and usher in a new stage of growth. It is reported that the company's utilization rate has been close to or reached full production for several consecutive quarters. With the full deployment of various process platforms of the new 12-inch production line in Wuxi and the gradual release of production capacity, it is expected to drive the company's revenue scale to a higher level.
Olai New Materials: Subsidiary plans to invest 108 million yuan to build Olai Mingyue Lake semiconductor high-purity materials project
Oulai New Materials issued an announcement stating that recently, the company's subsidiary Oulai High-purity planned to sign a project investment agreement with the Management Committee of Shaoguan High-tech Industrial Development Zone to invest in the construction of the "Oulai Mingyue Lake Semiconductor High-purity Materials Project". The total investment in the project is 108.2579 million yuan, and the project land area is 46.73 acres. The project construction content includes a high-purity oxygen-free copper ingot production base and a high-purity cobalt ingot production base. It is a key project for the company to extend the upstream high-purity materials industry chain.
The announcement shows that on September 19, 2024, Oulai New and the Management Committee of Shaoguan High-tech Industrial Development Zone signed a strategic cooperation framework agreement, with a planned total investment of no less than 2.59 billion yuan. The site is located in the Gantang East area of Shaoguan High-tech Zone to create a science and technology innovation industrial park integrating Oulai Talent Valley, headquarters base, scientific and technological achievement incubation base and industrialization base (named "Oulai Mingyue Lake Semiconductor Materials Industrial Park Project").
The announcement shows that on September 19, 2024, Oulai New and the Management Committee of Shaoguan High-tech Industrial Development Zone signed a strategic cooperation framework agreement, with a planned total investment of no less than 2.59 billion yuan. The site is located in the Gantang East area of Shaoguan High-tech Zone to create a science and technology innovation industrial park integrating Oulai Talent Valley, headquarters base, scientific and technological achievement incubation base and industrialization base (named "Oulai Mingyue Lake Semiconductor Materials Industrial Park Project").