Chinese semiconductor thread II
- Thread starter vincent
- Start date
1 billion yuan semiconductor headquarters project settled in the West Coast
1 billion yuan semiconductor headquarters project settled in the West Coast
The semiconductor equipment R&D and production headquarters project with a total investment of 1 billion yuan by Haichuang Intelligent Equipment (Yantai) Co., Ltd. settled in Qingdao West Coast New Area.
This project is the second high-end semiconductor equipment project to be implemented in the New District this year. The project will select a location in the New District to build a semiconductor equipment R&D and production headquarters, develop and manufacture wafer-level permanent bonding, temporary bonding, debonding equipment and other products, and plans to combine domestic industry needs and its own technological advantages to develop into a well-known domestic semiconductor equipment company.
It is reported that Haichuang Intelligent Equipment (Yantai) Co., Ltd. was established in 2017. It has layout in international and domestic markets and is committed to the research and development, manufacturing and sales of high-end semiconductor equipment. It has more than 60 related patents.
The new generation of information technology industry is one of the leading industries of Qingdao's "10+1" innovative industrial system. It is listed in a priority development position and leads the "10+1" key industrial direction. In the main track of new generation information technology, the integrated circuit industry is the top priority. The wafer-level bonding equipment and other products independently developed and produced by Haichuang Intelligent Equipment are of great significance to improving the localization rate of equipment of my country's semiconductor enterprises and breaking the international monopoly. The implementation of this project will further strengthen the integrated circuit industry chain of the new district, inject new vitality into the development of the city's high-end integrated circuit equipment industry, and help the industry move to new heights.
Electronic ceramics and silicon dioxide manufacturer ACEINNA Technology restarts IPO
Electronic ceramic products: mainly focusing on alumina ceramic substrates, ceramic structural parts and electrostatic chucks The company's electronic ceramic products mainly include alumina ceramic substrates, ceramic structural parts and electrostatic chucks. Alumina ceramic substrates have the main advantages of high temperature resistance, high electrical insulation performance, small dielectric constant, low dielectric loss, high thermal conductivity, good chemical stability, and thermal expansion coefficient close to that of components. The company's ceramic substrates are manufactured by the cast film method, which has the characteristics of high production efficiency, good surface finish of the produced film strips, and stable performance. The main applications are ceramic substrates for chip resistors, photovoltaics, electric vehicles, LEDs, etc.
The electrostatic chuck is an ultra-clean wafer adsorption device suitable for use in a vacuum environment. It uses the principle of electrostatic adsorption to evenly clamp ultra-thin wafers. In integrated circuit manufacturing, it is a core component of high-end equipment such as etcher, chemical vapor deposition (CVD) equipment, physical vapor deposition (PVD) equipment, and ion implantation machines. The electrostatic chuck products developed by the company are designed and processed in accordance with relevant standards of the semiconductor industry. The performance indicators meet market demand and have passed the certification of downstream domestic semiconductor industry leaders such as Yangtze Memory, Silan Microelectronics, and North Huachuang and achieved sales.
12-inch silicon wafer final polishing equipment was approved
In order to meet the high quality requirements of IC chip circuit processes with line widths less than 0.13μm to 28nm for 300mm diameter silicon polished wafers, further reduce the contamination of impurities such as metal ions on the surface of the silicon wafer, and ensure that the surface of the silicon wafer has extremely high surface nano-morphology characteristics, final polishing (fine polishing) becomes an indispensable key step .
The 12-inch silicon wafer final polishing equipment selected by Changsheng Electromechanical this time has successfully broken through a number of key technologies such as flexible and uniform pressurization of the polishing head, effectively improved the uniformity of the wafer surface, fully guaranteed the stability and reliability of the product, and the overall technology has reached the international advanced level. While meeting the polishing needs of large-size single-crystal silicon wafers, it has achieved independent research and development and domestic substitution of key core components and consumables, providing strong technical support for the research and development of large-size silicon wafer manufacturing and equipment for high-end integrated circuits in China.