Hunan Sanan has announced partnership with Luinus Devices as the sole distributor of Sanan's SiC and GaN power IC in Americas.
SMEC has now filed its plan for its phase 3 12-inch fab. 22.2B RMB investment for 100k wpm of 12-inch wafers. Likely to start production in 2024
BOE is signing deal to build China's first (world's 2nd) 8.6 Gen AMOLED display production line in Chengdu. 63B RMB total investment. To start production in Q4 2026
Aiming for laptop and flatscreen PC market
Will be China's largest AMOLED production base
DAMN, I did not expect this.
Any particulars about this that make it stand out?DAMN, I did not expect this.
This is far outside Huawei's typical areas of business like networking hardware, chip design and enterprise software.Any particulars about this that make it stand out?
Well, Huawei didn't want to do this. It was forced to by US sanctions...This is far outside Huawei's typical areas of business like networking hardware, chip design and enterprise software.
Typically you need to hire people with background in chemistry and materials science for developments like this, and they are typically in companies like ACM Research which are themselves ~billion dollar companies.
It is rare for companies to have vertical integration to such a degree spanning multiple levels of the supply chain. For example, Intel as an IDM handles driver software and design for its own chips, they have their own fabs, their own packaging, but they aren't making lithography tools and they also aren't writing consumer level apps.
This news means that Huawei could potentially become the most vertically integrated electronics company, spanning semiconductor equipment, to fab, to design, to driver software, to consumer software.
Well, Huawei didn't want to do this. It was forced to by US sanctions...