Chinese semiconductor thread II
- Thread starter vincent
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antiterror13
Brigadier
@ansy1968 , can we say that roughly the improved SSA800A is equivalent to early 2000i ? and SSA900 will be equivalent to 2050i ?
Sir from what I know, both NXT 1980i and NXT 2000i share the same component except for a better optic overlay or MMO plus light source. (the report said it was 90w) and Wafer output.
This is a huge improvement and can support the 65-7nm process technology. Among them, the ArF light source with a maximum output power of 90W can realize the 5nm process technology. In addition, the NA value of the DUVi objective lens system needs to reach 1.35, which means that the aperture change trend of the objective lens must be guaranteed to be within the range of the high NA immersion optical system.
So sir SMEE can do the same with an improved ITERATION just like ASML had done with their DUVi series of machine. And about the SSA900A that designation is my own interpretation, (sorry if other members see it as inappropriate ) coming from @WTAN previous post about a 22nm DUVi in development, plus I had seen this mythical monster had been mention several times in the Chinese publication. And if there is a huge progress on an improve iteration from the standard SSA800A model , maybe SMEE will used that designation for marketing purposes.
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New leaks regarding the suggest the upcoming flagship is testing a new Kirin chipset – 9010. According to the details, the P70 handset is reportedly testing an entirely fresh processor to bring enhanced performance on board.
Huawei P70 series continues to raise the excitement of users with its rumors. However, the latest leak is no less than a surprise in the topic. Notably, the company is working with a dynamic Kirin 9010 chipset for the Huawei P70 series.
The news is coming from the courtesy of Weibo tipster @SmartPikachu. Yet, a major confirmation on this subject is still awaited. If true, this would be a significant move by the company amid the growing tensions between the and China trade.
Meanwhile, some inputs revealed that Huawei even registered the trademark of the Kirin 9010 chip in April 2021. The production start of the processor was expected by the year 2022. Although the difficult business scenarios and U.S. restrictions caused the company to drop the development.
But it looks like Huawei is planning to restart the Kirin 9010 manufacturing and introduce it with the ultimate P70 smartphone lineup. Perhaps, the next-gen Kirin processor may bring more powerful capabilities to the approaching P-series with more efficient performance over its predecessors.
@tphuang ..
Huawei P70 series continues to raise the excitement of users with its rumors. However, the latest leak is no less than a surprise in the topic. Notably, the company is working with a dynamic Kirin 9010 chipset for the Huawei P70 series.
The news is coming from the courtesy of Weibo tipster @SmartPikachu. Yet, a major confirmation on this subject is still awaited. If true, this would be a significant move by the company amid the growing tensions between the and China trade.
Meanwhile, some inputs revealed that Huawei even registered the trademark of the Kirin 9010 chip in April 2021. The production start of the processor was expected by the year 2022. Although the difficult business scenarios and U.S. restrictions caused the company to drop the development.
But it looks like Huawei is planning to restart the Kirin 9010 manufacturing and introduce it with the ultimate P70 smartphone lineup. Perhaps, the next-gen Kirin processor may bring more powerful capabilities to the approaching P-series with more efficient performance over its predecessors.
Huawei P70 series
The premium smartphone lineup is said to launch in March this year. With tech-pack features and enhanced camera functionalities, these models will boost the sales revenue growth of the company. At the same time, the introduction of the Kirin 9010 will raise the standard of the smartphone business game in the market.@tphuang ..
Actually "Raimondo P70" sounds pretty good. Powered by the Sullivan series 9010 processor, I'd buy.
Now cue Xiaomi with their "Supapowa 9xxx" series...
No!!! That's Vivo's cue just ask their interim CEO.
Yixing integrated circuit policy: build the largest integrated circuit materials industry cluster in East China
"Yixing City Integrated Circuit Industry Cluster Development Three-Year Action Plan (2023-2025)" was released to enhance the high-quality development level of Yixing's integrated circuit industry and promote the realization of materials and chip manufacturing The integrated development of packaging and testing, equipment and parts manufacturing will build Yixing into the largest integrated circuit materials industry cluster in East China.
(1) Special materials for integrated circuits
Focus on supporting the development of integrated circuit base materials such as large-size silicon wafers, third-generation semiconductor substrates and epitaxial materials, and fourth-generation semiconductor materials. Efforts will be made to improve the production level of integrated circuit materials such as high-precision masks, high-purity targets, photoresists for integrated circuits, electronic specialty gases, electronic bulk gases, and wet electronic chemicals. Accelerate the layout of integrated circuit packaging materials such as ceramic packaging materials, high-end plastic packaging materials, and high-density packaging substrates, promote the research and development and industrialization of key materials, and accelerate verification and application iteration.
(2) Wafer manufacturing
Focus on supporting key enterprises in the industry to build integrated circuit wafer manufacturing production lines, improve technology levels, and expand production capacity.
Promote the construction of 8-inch and 12-inch production lines with unique and mature processes such as analog and digital-analog hybrid, image sensing, micro-electromechanical systems, and power semiconductors to enhance the Internet of Things, automotive electronics, artificial intelligence, AR (augmented reality)/VR ( Virtual reality) and other fields of chip and module manufacturing and supply capabilities. Actively deploy 4-inch and above silicon carbide, gallium nitride and other compound semiconductor chip manufacturing lines to promote the establishment of related radio frequency front-end module manufacturing companies. Support chip manufacturing companies to cooperate with design companies, packaging and testing companies to develop vertical integration (IDM) models, cultivate IDM companies in fields such as analog chips, radio frequency chips, sensor chips, and third-generation semiconductors to improve process levels and production capacity.
(3) Packaging and testing
Develop silicon-based MOSFETs (metal-oxide semiconductor field-effect transistors) and modules, radio frequency devices, micro-electromechanical systems and other special process chip packaging, and promote the development of chip-scale packaging (CSP) and ceramic packaging. Vigorously introduce wafer level packaging (WLP), system level packaging (SiP), through silicon via (TSV), 2.5D/3D (2.5D/3D) packaging, bumping, and board-level fan-out packaging ( FOPLP) and other advanced packaging production lines, strengthen the research and industrialization of key technologies such as heterogeneous isomers and chiplets, and improve advanced packaging capabilities.
(4) Equipment manufacturing
Focus on the development of thin film growth equipment, etching equipment, wet equipment, chemical mechanical polishing (CMP) equipment, photolithography equipment and other process equipment, as well as packaging equipment such as thinning, dicing, loading, bonding, plastic packaging, and wafer testing, The technical level of testing equipment such as finished product testing and optical inspection.
(5) Chip design
Focusing on the key aspects of chip design, we will accelerate the "chain replenishment" of the integrated circuit industry and accurately attract integrated circuit design companies. Focusing on emerging application fields such as the Internet of Things, vehicle networks, industrial Internet, and new energy vehicles, we will support the development of chip design companies in various application scenarios.
(1) Special materials for integrated circuits
Focus on supporting the development of integrated circuit base materials such as large-size silicon wafers, third-generation semiconductor substrates and epitaxial materials, and fourth-generation semiconductor materials. Efforts will be made to improve the production level of integrated circuit materials such as high-precision masks, high-purity targets, photoresists for integrated circuits, electronic specialty gases, electronic bulk gases, and wet electronic chemicals. Accelerate the layout of integrated circuit packaging materials such as ceramic packaging materials, high-end plastic packaging materials, and high-density packaging substrates, promote the research and development and industrialization of key materials, and accelerate verification and application iteration.
(2) Wafer manufacturing
Focus on supporting key enterprises in the industry to build integrated circuit wafer manufacturing production lines, improve technology levels, and expand production capacity.
Promote the construction of 8-inch and 12-inch production lines with unique and mature processes such as analog and digital-analog hybrid, image sensing, micro-electromechanical systems, and power semiconductors to enhance the Internet of Things, automotive electronics, artificial intelligence, AR (augmented reality)/VR ( Virtual reality) and other fields of chip and module manufacturing and supply capabilities. Actively deploy 4-inch and above silicon carbide, gallium nitride and other compound semiconductor chip manufacturing lines to promote the establishment of related radio frequency front-end module manufacturing companies. Support chip manufacturing companies to cooperate with design companies, packaging and testing companies to develop vertical integration (IDM) models, cultivate IDM companies in fields such as analog chips, radio frequency chips, sensor chips, and third-generation semiconductors to improve process levels and production capacity.
(3) Packaging and testing
Develop silicon-based MOSFETs (metal-oxide semiconductor field-effect transistors) and modules, radio frequency devices, micro-electromechanical systems and other special process chip packaging, and promote the development of chip-scale packaging (CSP) and ceramic packaging. Vigorously introduce wafer level packaging (WLP), system level packaging (SiP), through silicon via (TSV), 2.5D/3D (2.5D/3D) packaging, bumping, and board-level fan-out packaging ( FOPLP) and other advanced packaging production lines, strengthen the research and industrialization of key technologies such as heterogeneous isomers and chiplets, and improve advanced packaging capabilities.
(4) Equipment manufacturing
Focus on the development of thin film growth equipment, etching equipment, wet equipment, chemical mechanical polishing (CMP) equipment, photolithography equipment and other process equipment, as well as packaging equipment such as thinning, dicing, loading, bonding, plastic packaging, and wafer testing, The technical level of testing equipment such as finished product testing and optical inspection.
(5) Chip design
Focusing on the key aspects of chip design, we will accelerate the "chain replenishment" of the integrated circuit industry and accurately attract integrated circuit design companies. Focusing on emerging application fields such as the Internet of Things, vehicle networks, industrial Internet, and new energy vehicles, we will support the development of chip design companies in various application scenarios.
