Chengdu High-tech Zone will introduce new policies to support the high-quality development of the integrated circuit industry
The "Chengdu High-tech Industrial Development Zone's Several Policies on Supporting the High-quality Development of the Integrated Circuit Industry (Draft for Comments)" drafted by the Electronic Information Industry Bureau of Chengdu High-tech Zone was publicly solicited for opinions. The time is December 22, 2023 to January 23, 2024.
Integrated Circuit Design Policy
Article 1:
Support enterprises to improve their R&D and design capabilities. Design companies that rent EDA tools provided by local R&D or national-level public service platforms will be given a subsidy of up to 1 million yuan based on 50% of the rental fee. For design companies that use multi-project wafers (MPW) for integrated circuit product development and tape-out, a subsidy of up to 5 million yuan will be provided based on 70% of the tape-out cost.
Article 2: Support enterprises to strengthen ecological cooperation. For companies that cooperate with local foundries to develop industrial software and IP cores, a subsidy of up to 2 million yuan will be provided based on 10% of the company's self-invested project research and development expenses.
For design companies that carry out the first round of full-mask tape-out projects that are conducive to promoting the application of local integrated circuit line widths less than 45nm (inclusive) process production lines, a subsidy of up to 20 million yuan will be provided based on 50% of the tape-out cost, and subsequent mass production tape-outs will be provided. A subsidy of up to 5 million yuan per year for three years will be provided based on 5% of the tape-out cost. Design companies that use local packaging and testing services will be given a subsidy of up to 1 million yuan based on 15% of the increase in packaging and testing costs compared to the previous year.
Wafer manufacturing, packaging and testing policies
Article 3: Support enterprises to increase project investment.
For newly introduced local integrated circuit companies with a total investment of less than 500 million yuan in integrated circuit wafer manufacturing, packaging and testing projects, and production line technology upgrades, and with fixed asset investments exceeding 10 million yuan, 8% of the actual investment in fixed assets will be granted The maximum subsidy is 20 million yuan, and the maximum subsidy amount for a single project shall not exceed 40 million yuan. For particularly major projects, support will be provided based on the principle of "one case, one discussion".
Article 4: Support enterprises to improve their manufacturing, packaging and testing service capabilities. For wafer manufacturing companies that provide tape-out foundry services for local design companies, a subsidy of up to 100 million yuan will be provided based on 8% of the foundry cost. For mass-produced packaging and testing companies that provide advanced packaging and high-reliability packaging and testing services to local design companies, a subsidy of up to 5 million yuan will be provided based on 5% of the packaging and testing costs; for newly put into production advanced packaging and high-reliability packaging products line, a subsidy of up to 5 million yuan will be provided based on 10% of the service order fee.
Equipment (parts), materials policy
Article 5: Accelerate the implementation of upstream and downstream supply chain projects. For new establishments or technological transformations in high-tech zones, as well as for the collaborative introduction and establishment of equipment (parts), materials and other supporting enterprises in cooperation parks in high-tech zones, and the investment in fixed assets exceeds 5 million yuan, a maximum of 1,000 yuan will be given based on 10% of the fixed asset investment amount. 10,000 yuan subsidy, and the maximum subsidy amount for a single project shall not exceed 20 million yuan. For particularly major projects, support will be provided based on the principle of "one case, one discussion".
Article 6:
Support equipment and material verification applications. For integrated circuit companies that assist local and cooperative park companies to carry out verification of independent safe and controllable equipment (components), materials and other supporting products, a subsidy of 50% of the verification cost will be provided. The maximum cost for single equipment verification shall not exceed 1 million yuan, and each The maximum amount for verification of batch materials shall not exceed 500,000 yuan, and the maximum amount for each enterprise shall not exceed 10 million yuan. If the products of integrated circuit equipment (components) and materials companies enter well-known domestic and foreign companies for verification, a subsidy of no more than 20% of the entry verification cost will be provided, with a maximum subsidy of 5 million yuan. For local and cooperative park enterprises that successfully develop the first set (first batch) and achieve sales, a reward of up to 30 million yuan will be given based on 30% of the actual total sales of the product.
Article 7 supports supply chain collaboration.
For integrated circuit companies that purchase equipment (parts), materials, industrial software and other products from local and cooperative park companies for the first time to form a supply chain, a subsidy of up to 5 million yuan will be provided based on 10% of the total purchase and sales contract (5% for both supply and demand parties); the amount For continued growth, a maximum subsidy of 5 million yuan will be provided based on 5% of the total purchase and sales contract (2.5% for both supply and demand sides), and the maximum subsidy amount for a single enterprise shall not exceed 20 million yuan per year.
Industrial Talent Introduction and Education Policy
Article 8: Support enterprises in hiring key talents. For IC design companies whose human resource costs exceed 500,000 yuan, and for manufacturing, packaging and testing, equipment (components), and materials companies whose human resource costs exceed 300,000 yuan, the company will be given the maximum annual maximum per person per year based on the efficiency of talent use. 500,000 yuan for talent performance rewards.
Article 9: Accelerate the cultivation of in-demand and applicable talents. For local enterprises that take the lead in building integrated circuit talent training bases with international and domestic universities and research institutes, a one-time subsidy of up to 5 million yuan will be given to the base based on 20% of the enterprise's construction investment cost. For local wafer manufacturing, packaging and testing companies that recruit fresh graduates and provide process technology instructional training for more than 6 months, a subsidy of 5,000 yuan per person and a maximum of 2 million yuan will be given to the company based on the actual number of employees retained after the training. Talent training; provide teaching subsidies of 10,000 yuan/year to tutors. For local enterprises that entrust professional training institutions to carry out training to improve the technical capabilities of engineers, a training subsidy of up to 500,000 yuan will be provided based on 20% of the actual training fees paid by the enterprise.
Industrial Ecological Leap Policy
Article 10: Support enterprises to become bigger and stronger. For IC design enterprises whose annual main business income exceeds RMB 100 million, RMB 300 million, RMB 500 million, or RMB 1 billion for the first time, one-time rewards of RMB 5 million, RMB 7 million, RMB 9 million, or RMB 11 million will be given in accordance with the principle of making up for the difference in promotion. ; For wafer manufacturing, packaging and testing enterprises whose annual main business income exceeds 300 million yuan, 500 million yuan, 1 billion yuan, or 2 billion yuan for the first time, they will be given 5 million yuan, 7 million yuan, or 9 million yuan in accordance with the principle of making up for the difference in the next grade. , a one-time reward of 11 million yuan; for equipment (parts) and materials companies whose annual integrated circuit-related main business income exceeds 50 million, 100 million, 300 million, or 500 million for the first time, 5 million yuan, One-time rewards of 7 million yuan, 9 million yuan and 11 million yuan. Enterprises are encouraged to use part of the above reward funds for personal rewards and subsidies for core managers, R&D personnel and other personnel who have made outstanding contributions.
