Chinese semiconductor thread II

tphuang

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These are RISC-V chips for the embedded market. Fastest chip is 200 MHz.
While it is a start I would like if they started pushing these upstream like to set top boxes, TVs, and high-end automotive.
nah, got to start somewhere. also, Hisilicon isn't the leaders in China for RISC-V, that's T-Head

New leaks regarding the
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suggest the upcoming flagship is testing a new Kirin chipset – 9010. According to the details, the P70 handset is reportedly testing an entirely fresh processor to bring enhanced performance on board.

Huawei P70 series continues to raise the excitement of users with its rumors. However, the latest leak is no less than a surprise in the
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topic. Notably, the company is working with a dynamic Kirin 9010 chipset for the Huawei P70 series.

The news is coming from the courtesy of Weibo tipster @SmartPikachu. Yet, a major confirmation on this subject is still awaited. If true, this would be a significant move by the company amid the growing tensions between the
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and China trade.

Huawei P70 series Kirin 9010 chipset


Meanwhile, some inputs revealed that Huawei even registered the trademark of the Kirin 9010 chip in April 2021. The production start of the processor was expected by the year 2022. Although the difficult business scenarios and U.S. restrictions caused the company to drop the development.

But it looks like Huawei is planning to restart the Kirin 9010 manufacturing and introduce it with the ultimate P70 smartphone lineup. Perhaps, the next-gen Kirin processor may bring more powerful capabilities to the approaching P-series with more efficient performance over its predecessors.

Huawei P70 series​

The premium smartphone lineup is said to launch in March this year. With tech-pack features and enhanced camera functionalities, these models will boost the sales revenue growth of the company. At the same time, the introduction of the Kirin 9010 will raise the standard of the smartphone business game in the market.

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@tphuang ..
I am suspicious of this. Pretty much everyone else have said 9000S for P70
 

tokenanalyst

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Guangzhou Daily: The rise of domestic silicon carbide “core aircraft carrier”​


The Xin Yueneng silicon carbide chip manufacturing project is a major project of Guangdong's "Strong Core Project" with a total investment of 7.5 billion yuan. It will build an annual production capacity of 240,000 6-inch and 240,000 8-inch silicon carbide wafer chips. .

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The picture shows a 6-inch silicon carbide planar MOSFET wafer; currently, semiconductors represented by silicon carbide have become the new focus of competition in global semiconductor technology and industry; however, the global silicon carbide power device market has long been monopolized by overseas giants. The localization rate of bandgap semiconductors is low and the market demand is large.

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Silicon carbide flat wafer.

At the beginning of the new year, the Xin Yue Energy factory in Nansha, Guangzhou, China's largest manufacturer of automotive-grade silicon carbide chips, is in full swing.

As a major project of Guangdong's "Strengthening Core Project", Core Yueneng is accelerating its first-phase production capacity ramp-up this year and will achieve a planned annual production capacity of 240,000 6-inch automotive-grade silicon carbide chips by the end of the year. After the Xin Yueneng project reaches production, it will greatly alleviate the current shortage of domestic automotive-grade silicon carbide chips and become one of the world's leading automotive-grade silicon carbide power semiconductor manufacturing companies. It will solve the "stuck neck" problem of silicon carbide chips and lay the foundation for China's Leadership in silicon carbide power devices.

With the strong support of Guangzhou City and Nansha District, Xinyue Energy was completed and put into operation in 15 months. The construction speed is rare in the industry. The dust-free workshop will be officially opened in November 2022, and currently has a monthly production capacity of 10,000 pieces. The automotive grade and industrial control grade chips have been successfully taped out and samples have been sent, and automotive grade certification is about to be completed. Up to now, Xinyueeng has signed tape-out contracts with more than 40 customers, covering most silicon carbide chip design companies in the country, and its yield and consistency are highly recognized.

In recent years, Nansha has introduced and cultivated a number of industry leading companies such as Xin Yue Energy, Xin Ju Energy, Jinko Electronics, Lianjing Intelligent, and Nansha Wafer, and has initially formed an industry covering semiconductor and integrated circuit design, manufacturing, packaging and testing, equipment and materials. industrial chain. Nansha is actively building a wide-bandgap semiconductor design, manufacturing and packaging and testing base, creating a wide-bandgap semiconductor industry ecosystem in the Guangdong-Hong Kong-Macao Greater Bay Area, and injecting strong "core" agents into future industrial development.

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tokenanalyst

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Wei Jian Intelligent Technology Co., Ltd., a manufacturer of semiconductor bonding equipment, completed the A++ round of financing.​


Weijian Intelligence on January 8, Weijian Intelligence recently completed the A++ round of financing, led by Qianhai CSSC, followed by Puhua Capital, and Shendu Capital continues to serve as the exclusive financial advisor. This round of financing will mainly be used to invest in the research and development of a broader product line and the development of strategic applications.

Weijian Intelligence has completed four rounds of financing so far, and this A++ financing is another round of financing completed by Weijian Intelligence within 3 months after announcing its A+ round of financing in October last year.

It is reported that Weijian Intelligent Packaging Technology (Shenzhen) Co., Ltd. was established in December 2019. It is a high-tech enterprise specializing in the research and development and production of high-precision complex process chip packaging equipment. At present, Weijian Intelligence has launched a series of general high-precision precision fixing machines, a series of special high-precision precision fixing machines and a series of flip-chip machines. Among them, the general high-precision die-bonding machine series is Weijian’s flagship product.

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tphuang

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Hunan Sanan has announced partnership with Luinus Devices as the sole distributor of Sanan's SiC and GaN power IC in Americas.

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SMEC has now filed its plan for its phase 3 12-inch fab. 22.2B RMB investment for 100k wpm of 12-inch wafers. Likely to start production in 2024

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BOE is signing deal to build China's first (world's 2nd) 8.6 Gen AMOLED display production line in Chengdu. 63B RMB total investment. To start production in Q4 2026
Aiming for laptop and flatscreen PC market
Will be China's largest AMOLED production base
 

tokenanalyst

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The electron beam lithography machine completely independently developed by Zeyou Technology has achieved initial results.​



The realization of independent controllability of domestic electron beam lithography machines is an important part of realizing the independent controllability of my country's integrated circuit industry chain. Recently, Zeyou Technology and Songshan Lake Materials Laboratory have made significant progress in the development and industrialization project of a fully autonomous electron beam lithography machine. They successfully developed an electron beam lithography system and realized the complete electron beam lithography machine. The independent controllability marks a key step in the research and development and industrialization of domestic electron beam lithography machines.

Electron beam lithography is a process that uses focused electron beams to expose certain polymers (electron beam photoresists) and develop patterns to obtain patterns. The instrument that generates a focused electron beam and scans the focused electron beam according to a set pattern is called an electron beam lithography machine. It is one of the important means to promote our current fields of new materials, cutting-edge physics research, semiconductors, microelectronics, photons, and quantum research. Previously, the global electron beam lithography machine market was highly concentrated and was mainly monopolized by American and Japanese companies. my country has not yet mastered the core technology in this field and has long relied on imported equipment.

In order to realize the independent controllability of electron beam lithography machines, Zeyou Technology has continued to accumulate multi-disciplinary core technologies such as electron optics, micro-nano technology, high-voltage source and electron source technology, vacuum systems, automatic control, and digital image processing over the years to build It has established a complete technical system and launched a variety of electron beam products such as desktop scanning electron microscopes. In March 2023, Zeyou Technology and Songshan Lake Materials Laboratory jointly invested 24 million yuan to establish a joint engineering center with the goal of creating an electron beam equipment technology innovation base integrating scientific research and industrialization. Through in-depth research and development of cutting-edge technologies in the intersection of electron beams and new materials, we can achieve independent control of key equipment and common technologies, and effectively enhance my country's overall innovation capabilities and industrial competitiveness in the field of electron beam processing and preparation.

At present, Zeyou Technology has completed the development of an engineering prototype of an electron beam lithography machine based on its independently developed scanning electron microscope host, and has carried out functional verification work. Through the exposure production of test samples, high-resolution complex graphics can be drawn, reaching the advanced level. This achievement marks a significant improvement in Zeyou Technology’s independent innovation capabilities in key technologies and complete machines of electron beam lithography machines. In the next step, Zeyou Technology will continue to improve the performance indicators of the electron beam lithography machine so that it can meet the requirements of batch application and industrialization.

It is believed that with the unremitting efforts of the company's technical team, the complete electron beam lithography machine independently developed by Zeyou Technology will accelerate its mass production and commercial application. This will not only significantly reduce the equipment cost of domestic chip manufacturing, but also break down the technical barriers of foreign companies, allowing our country to have independent and controllable electron beam lithography technology, promote domestic substitution, and effectively ensure national information security.

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xypher

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I am suspicious of this. Pretty much everyone else have said 9000S for P70
Indeed. Last time I talked with a guy who works in Huawei, he said that P70 will have the same chip as Mate 60 Pro, that was in the beginning of December. However, the overall performance should be slightly better across the board due to software improvements, especially in NN inference.
 

tokenanalyst

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40 units of SiC epitaxy equipment from the 48th Research Institute of China Electronics Technology Corporation were successfully moved in​

40 SiC epitaxial furnaces independently developed by the 48th Research Institute of China Electronics Technology Co., Ltd. were successfully moved in.
Semiconductor Industry Network learned: Recently, with the closure of the transportation channel at a customer's site, 40 SiC epitaxial furnaces independently developed by the 48th Research Institute of China Electronics Technology were successfully moved in.

SiC is an ideal electronic material for making high-temperature, high-frequency, and high-power electronic devices. There is an increasing demand for applications in new energy vehicles, photovoltaic industry, high-voltage transmission and distribution lines, and smart power stations. Unlike the silicon semiconductor industry, SiC devices must be processed on epitaxial films. Therefore, SiC epitaxial equipment, as one of the core equipment for the manufacturing of third-generation semiconductor SiC devices, plays an important role in the entire industry chain.
40 units of SiC epitaxy equipment were successfully moved in at the customer's site, which strongly demonstrated the mission of 48 Institute as a "national team" for semiconductor equipment. The after-sales service team of 48 Institute will maintain a spirit of forge ahead and never slack off, scientifically plan and make overall arrangements, and do a good job in subsequent installation and debugging of equipment to ensure early delivery and acceptance of equipment.
In the new year, 48 institutes will move forward resolutely with a running attitude, comprehensively and thoroughly implement the spirit of the 20th National Congress of the Communist Party of China, and coordinate high-quality development and high-level safety in accordance with the group company's "one consolidation and three strengthening" work requirements. Strive to achieve a “stable start” and “good start” in the first quarter.

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tokenanalyst

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Xinlian Integration: Plans to increase capital of subsidiary Xinlian Pioneer by RMB 3.85 billion in the first phase.​


Xinlian Integration announced on the evening of January 9 that according to the relevant contents of the "Settlement Agreement" signed by the company's subsidiary Xinlian Pioneer and the Shaoxing Binhai New Area Management Committee, it plans to implement a mass production project based on the third phase of the 12-inch pilot project. , it is expected to form the SMIC Shaoxing Phase III 12-inch digital-analog hybrid integrated circuit chip manufacturing project with a total investment of 22.2 billion yuan and a monthly production capacity of 100,000 pieces in the next two to three years.

According to the relevant contents of the "Settlement Agreement" signed by the company's subsidiary Xinlian Pioneer and the Shaoxing Binhai New Area Management Committee, it is planned to implement a mass production project based on the three-phase 12-inch pilot project, which is expected to be completed in the next two to three years. SMIC Shaoxing Phase III 12-inch digital-analog hybrid integrated circuit chip manufacturing project with an investment of RMB 22.2 billion and a monthly production capacity of 100,000 pieces.

In order to ensure the smooth implementation of the "Phase III 12-inch integrated circuit digital-analog hybrid chip manufacturing project", the company and Shaoxing Fuzhe Yuexin Integrated Circuit Industry Equity Investment Fund Partnership (Limited Partnership) plan to increase the capital of Xinlian Pioneer in the first phase by 38.5% billion, of which the company increased capital by 2.888 billion yuan, accounting for 75% of the total capital increase.

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liospopo

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New leaks regarding the
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suggest the upcoming flagship is testing a new Kirin chipset – 9010. According to the details, the P70 handset is reportedly testing an entirely fresh processor to bring enhanced performance on board.

Huawei P70 series continues to raise the excitement of users with its rumors. However, the latest leak is no less than a surprise in the
Please, Log in or Register to view URLs content!
topic. Notably, the company is working with a dynamic Kirin 9010 chipset for the Huawei P70 series.

The news is coming from the courtesy of Weibo tipster @SmartPikachu. Yet, a major confirmation on this subject is still awaited. If true, this would be a significant move by the company amid the growing tensions between the
Please, Log in or Register to view URLs content!
and China trade.

Huawei P70 series Kirin 9010 chipset


Meanwhile, some inputs revealed that Huawei even registered the trademark of the Kirin 9010 chip in April 2021. The production start of the processor was expected by the year 2022. Although the difficult business scenarios and U.S. restrictions caused the company to drop the development.

But it looks like Huawei is planning to restart the Kirin 9010 manufacturing and introduce it with the ultimate P70 smartphone lineup. Perhaps, the next-gen Kirin processor may bring more powerful capabilities to the approaching P-series with more efficient performance over its predecessors.

Huawei P70 series​

The premium smartphone lineup is said to launch in March this year. With tech-pack features and enhanced camera functionalities, these models will boost the sales revenue growth of the company. At the same time, the introduction of the Kirin 9010 will raise the standard of the smartphone business game in the market.

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@tphuang ..
I don't think Huawei will use new SoC on P70 series, maybe just engineer unit.
 
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