Chinese semiconductor thread II
- Thread starter vincent
- Start date
@FairAndUnbiased Good stuff.
Back-end lithography applications in the semiconductor, MEMS, LED chip, power device and microfluidics industries will use a variety of mask alignment systems . Manual, semi-automatic and fully automatic mask aligner systems are available to meet the requirements of any production environment.
Hongke UVLED ultraviolet light source solutions (ALE/1, ALE/1C and ALE/2) have been successfully integrated into various mask alignment systems and can produce excellent results in contact exposure and projection exposure applications. Excellent uniformity , excellent collimation characteristics (<2°), high resolution down to 0.7μm and high surface radiated power have been seen on 4, 6, 8 and 12-inch substrates .
Broadband stepper systems play a vital role in advanced packaging applications such as fan-out wafer-level packaging (FOWLP), wafer-level chip-scale packaging (WLCSP) or through-silicon vias (TSV). Complex microstructures such as MEMS or LEDs are important examples of those fabricated on highly specialized stepper devices.
Hongke Broadband ALE/1 and ALE/1C light sources combine individual LED modules around the i-line, h-line, and g-line into a single light path, allowing complete control of the spectral composition of broadband exposure in the 350-450 nm range, enabling implementations as low as Resolution in the 1μm or even submicron range provides higher radiation output . By using Hongke light source solutions, you can have complete flexibility in selecting photosensitive advanced packaging materials that may need to be applied in the process, replacing or replacing any traditional high-power mercury arc lamps up to 1kW or higher, providing excellent system throughput.
Hongke Light Source Solutions In Semiconductor Manufacturing Process
The semiconductor industry relies on ultraviolet high-power radiation (i-line: 365 nm, h-line: 405 nm, and g-line: 436 nm) to produce complex microscopic circuits such as ICs, LCDs, PCBs, and MEMS in various photolithography, exposure, and development processes structure. Thanks to the technical and cost advantages of LED, the semiconductor manufacturing field is moving away from the long-standing traditional discharge mercury lamp technology and choosing UVLED technology as an ideal solution.Hongke UVLED ultraviolet light source provides stable and ultra-high power UV radiation output, with a maximum output power of up to 80W . It has long life and cost advantages. It does not require additional cooling time and is ready to use. It replaces the traditional light box structure and is no longer needed. Main beam folding mirror and heat sink to absorb radiation above 450nm below the shutter and filter components.
Many lithography applications rely on broadband exposure to radiation including the i, h, and g lines (365/405/435 nm). Hongke UVLED ultraviolet light sources provide very similar broadband spectral output , so upgrading existing photolithography processes to UVLED exposure systems no longer requires too much adjustment and operation. In addition to the broadband UVLED exposure units, output configurations with single peak (365 nm) or double peak wavelengths (365/405 nm and 405/435 nm) are also available.
Many lithography applications rely on broadband exposure to radiation including the i, h, and g lines (365/405/435 nm). Hongke UVLED ultraviolet light sources provide very similar broadband spectral output , so upgrading existing photolithography processes to UVLED exposure systems no longer requires too much adjustment and operation. In addition to the broadband UVLED exposure units, output configurations with single peak (365 nm) or double peak wavelengths (365/405 nm and 405/435 nm) are also available.
Mask Alignment System
Back-end lithography applications in the semiconductor, MEMS, LED chip, power device and microfluidics industries will use a variety of mask alignment systems . Manual, semi-automatic and fully automatic mask aligner systems are available to meet the requirements of any production environment.
Hongke UVLED ultraviolet light source solutions (ALE/1, ALE/1C and ALE/2) have been successfully integrated into various mask alignment systems and can produce excellent results in contact exposure and projection exposure applications. Excellent uniformity , excellent collimation characteristics (<2°), high resolution down to 0.7μm and high surface radiated power have been seen on 4, 6, 8 and 12-inch substrates .
(2.3) Ultra-High Power Output Exposure
Broadband Stepper System
Broadband stepper systems play a vital role in advanced packaging applications such as fan-out wafer-level packaging (FOWLP), wafer-level chip-scale packaging (WLCSP) or through-silicon vias (TSV). Complex microstructures such as MEMS or LEDs are important examples of those fabricated on highly specialized stepper devices.
Hongke Broadband ALE/1 and ALE/1C light sources combine individual LED modules around the i-line, h-line, and g-line into a single light path, allowing complete control of the spectral composition of broadband exposure in the 350-450 nm range, enabling implementations as low as Resolution in the 1μm or even submicron range provides higher radiation output . By using Hongke light source solutions, you can have complete flexibility in selecting photosensitive advanced packaging materials that may need to be applied in the process, replacing or replacing any traditional high-power mercury arc lamps up to 1kW or higher, providing excellent system throughput.
(3.2) Medium Power Output Exposure
It is way more complicated than that. Miniaturization has inherent speed and power efficiency benefits. The changes of HBM3 is not limited to I/O either. It adds new commercial functions and changes the clocking architecture.
China, sooner or later, has to match the foreigners in efficiency. Both to export and for its own productivity. It is not about CXMT earning money.
Those are not the same. Though stacking for HBM is not harder either.
80W photon output is monstrous.
Mercury lamp is <10% efficient with isotropic emission, ends up something like 0.6% efficiency on wafer.
UV LED is 27% power efficiency for near monochromatic light and already nearly collimated.
At least electricity cost are going down, no heat waste for better cooling and more compact tools.
But contrast that with NVidia who are planning on 2 Million H100 chips for 2024.
0.5-1 Million Ascend 920 chips (which are supposed to be higher or comparable in performance) doesn't sound excessive.
Given that these chips are being sold for $40K, the profit margins should be tremendous.
The H100 is estimated to cost $3300. An Ascend at 50% more would be $5000.
No other chips match this level of profitability
And you can see the Ascend chips require very little overall wafer capacity compared to the smartphone chips.
Confirmation of micro mirror array MEMS design similar to FlexRay developed by Raewang, Guowang’s Shanghai subsidiary. Critical for SMO part of computational litho. These optical techs, along with planar grating and maglev stage, enable duv below 28nm.
SMEC or SAI manufacture the micromirror arrays and looks like Guowang is assembling the whole thing.
