Chinese semiconductor thread II

PopularScience

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Yin Zhiyao, Chairman of AMEC: Our etching machine has achieved the goal of processing one atom accurately every time (Core Things) Mr. Yin said that AMEC's laboratory technology can achieve an accuracy of 0.02nm, while a silicon atom is 0.25nm, which means it can process at the atomic scale. It is really amazing, and may surpass American companies!

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ZeEa5KPul

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Yin Zhiyao, Chairman of AMEC: Our etching machine has achieved the goal of processing one atom accurately every time (Core Things) Mr. Yin said that AMEC's laboratory technology can achieve an accuracy of 0.02nm, while a silicon atom is 0.25nm, which means it can process at the atomic scale. It is really amazing, and may surpass American companies!

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Etching tech tree complete.
 

ansy1968

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Looks like SMEE will be the final piece of the puzzle once they catch up to ASML. Everything else is coming into place.
They had already accomplished their objective with SSA800A and will stay focus on DUVL and its future iteration, on EUV front expect Huawei, SMIC and CAS to take the lead. Like what DARPA had done by forming the SEMATECH consortium to challenge Japan semiconductor dominance, we may see the same thing with technical loopback between the 3 like what we are seeing between Apple, TSMC and ASML.
 

tphuang

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a couple of more semi news:

华为nova13系列卖得很好,听闻下一代规划的量更大,而且畅享都上了麒麟8000A,希望nova14系列上一个麒麟9000系处理器

某国产大厂的自研CIS,已顺利产出,规格有50Mp 1/1.5"、50Mp 1/1.3",小批量新机验证中
[并不简单]
[并不简单]

so good chance more power 9000 series Kriin chips will appear on Nova 14 (especially after Nova 13's high sales)

A new domestically designed CIS is being produced. Maybe this is Huawei's CIS?
 

Wahid145

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Etching tech tree complete.
Still wonder if they have become a true LAM replacement yet or might take them another year or so.

Everybody is concerned about the DUVi and EUV (rightly so) but as far as I'm aware, the Deposition, Etching (only certain ones like the Cryogenic) and Ion implants, the domestic equivalents of AMAT and LAM are still trailing.

But the gap is closing in lightning speed because of constant validation and (feedback reenforcemen) by major IC companies towards the domestic equipment makers. By late 2020 we will definitely see these domestic SME out innovating the foreign ones.

But the main question right now is, at the start of 2025, where does the Domestic SME stands . i.e. the deposition tools from Naura or Piotec, can they cover full spectrum 6nm process? What about Ion Implants, Metrology, Coater and Developer, all the different kind of etching. So many questions!!

I think there has to be comprehensive detailed article on this at the mid point of one of the most important decade of 21st Century.
 

tokenanalyst

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Yaksenko Semiconductor Electronic Materials Project Starts Test​

the Yaksenko Electronic Materials Project Ignition Ceremony and the Global Cooperation Supply Chain Conference were launched at the Lichun Aviation Power Industrial Park in Pengzhou Economic Development Zone. The project is invested by Jiangsu Yak Science and Technology Co., Ltd., a global leader in electronic semiconductor materials production, covering an area of 75 acres, with a total investment of approximately 1.1 billion yuan and an annual output of 48,000 tons of semiconductor electronic powder materials. As a "strong chain" support for Chengdu's trillion-level electronic information industry, the project will improve Chengdu's semiconductor packaging industry chain from the core material end, further promote the agglomeration and coordinated development of the semiconductor industry in Chengdu, and is of great significance to the promotion of my country's semiconductor integrated circuits and devices.
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tokenanalyst

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Everybody is concerned about the DUVi and EUV (rightly so) but as far as I'm aware, the Deposition, Etching (only certain ones like the Cryogenic) and Ion implants, the domestic equivalents of AMAT and LAM are still trailing.
There already 3 companies offering high end Ion Implanters with high throughput and variety from High energy to High current. There are only few etching and depositions tools that are not domestically produced even AMEC is getting into and those are for next gen process 3nm like Ruthenium deposition tools.
But the main question right now is, at the start of 2025, where does the Domestic SME stands . i.e. the deposition tools from Naura or Piotec, can they cover full spectrum 6nm process? What about Ion Implants, Metrology, Coater and Developer, all the different kind of etching. So many questions!!
We have already two threads discussing this one with 3500+ pages and the other with 640+ pages, they have everything, in theory China should be able to make 7nm finfet transistors on their own already.

For Ion Implantation you have: Wanye, CETC and SRI-I
Metrology: SMEE, RainTree,DJEL, angstrom-e, Jingce... cover overlay, CDSEM, ADI, AEI,optical ,XRAY.....
Coating: KingSemi offers immersion lithography coat and developing tools

With the exception of lithography I don't really think not very much difference between tools for a 28nm process and a 7nm process except throughput and you can solve that with more tools. Ion Implanters in China can cover the next gen transistors
 
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