Everybody is concerned about the DUVi and EUV (rightly so) but as far as I'm aware, the Deposition, Etching (only certain ones like the Cryogenic) and Ion implants, the domestic equivalents of AMAT and LAM are still trailing.
There already 3 companies offering high end Ion Implanters with high throughput and variety from High energy to High current. There are only few etching and depositions tools that are not domestically produced even AMEC is getting into and those are for next gen process 3nm like Ruthenium deposition tools.
But the main question right now is, at the start of 2025, where does the Domestic SME stands . i.e. the deposition tools from Naura or Piotec, can they cover full spectrum 6nm process? What about Ion Implants, Metrology, Coater and Developer, all the different kind of etching. So many questions!!
We have already two threads discussing this one with 3500+ pages and the other with 640+ pages,
they have everything,
in theory China should be able to make 7nm finfet transistors on their own already.
For Ion Implantation you have: Wanye, CETC and SRI-I
Metrology: SMEE, RainTree,DJEL, angstrom-e, Jingce... cover overlay, CDSEM, ADI, AEI,optical ,XRAY.....
Coating: KingSemi offers immersion lithography coat and developing tools
With the exception of lithography I don't really think not very much difference between tools for a 28nm process and a 7nm process except throughput and you can solve that with more tools. Ion Implanters in China can cover the next gen transistors