Chinese semiconductor thread II

[tokenanalyst]

Advanced packaging equipment manufacturer Taiyan Semiconductor completes Series B financing​

Taiyan Semiconductor completed a round B financing of about 50 million yuan, and the investor in this round was Zijingang Capital. Taiyan Semiconductor is a semiconductor process and equipment service provider in the field of advanced packaging, which can provide customers with a complete set of Laser + Plasma + Sputter (coating) composite processes and process application equipment on advanced packaging production lines such as SiP, Fanout, Chiplet, and 3D.
It is reported that the funds raised this time will be mainly used for product batch shipment preparation, product research and development, and market operations. Previously, Taiyan Semiconductor has completed Pre-A and A rounds of financing.

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[tphuang]

https://twitter.com/i/web/status/1875294242886840517

2025 is Huawei and Hisilicon's year of comeback.

 

[huemens]

More info about the upcoming new US rules for AI chip restriction to China

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The US government may unveil new restrictions targeting China's black-market trade in advanced chips during the last week that President Joe Biden is in the White House, according to sources familiar with the matter.

President Biden is still expected to implement the rule before January 20, his last day in office, the sources said.

The measures include establishing a country cap and a "black and white" list to limit GPU shipments to specific locations, along with implementation of a worldwide licensing system that includes reporting requirements and exceptions.

To prevent circumvention through Chinese shell companies, the US may also establish new restrictions in the upcoming rule. These would prevent global chip foundries from using US technology to fabricate Chinese AI chip designs on 7-nanometer or more advanced nodes, or chips exceeding certain size dimensions, according to one of the sources.

 

[SanWenYu]

Has anyone picked up this?

On Jan 2, the national IC big fund made two investments of total 164 billion yuans out of its phase 3 funding pool. This is the first and second investment since phase 3 was established in May 2024. Phase 3 has gathered total funding of 344 billion yuans from institutional investors such as the Ministry of Finance, state owned investment and commercial banks. The focus of phase 3 is stated to be on the "whole supply chain of IC manufacturing".

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1月2日，国家集成电路产业投资基金三期（下称，国家大基金三期）发生两项对外投资，共计1640亿元（人民币，下同），这也是大基金三期的首次投资。

公开资料显示，大基金三期于2024年5月24日成立，超预期注资规模3440亿元，超过了大基金一期、二期募资总和（1387亿、2042亿），并且超过了当时美国《芯片法案》直接财政补助规模（390亿美元，约合2800亿元人民币）。

大基金三期由19位股东共同持股。其中最大股东为财政部，持股17.4419%。其次是国开金融有限责任公司、上海国盛（集团）有限公司，持股比例分别为10.4651%、8.7209%。另外，包括工商银行等国有六大行也首次参与了大基金，出资合计1140亿元。

从投资方向来看，国家大基金共分为三期，每一期都有其特定的投资重点和目标。大基金一期投资项目主要着力点是制造领域，二期则向设备材料端倾斜。而在此前工商银行、建设银行等提交给港交所的公告中显示，大基金三期将“重点投向集成电路全产业链”。对此，业内认为，三期除了延续对半导体设备和材料的支持外，更有可能推动尖端芯片制造技术的进步，比如先进的HBM高端存储芯片。

根据中航证券研报显示，大基金三期将重点投向以下三个方面：重资本开支的晶圆制造环节，先进晶圆厂扩产；重点卡脖子环节，侧重于国产化率低的半导体设备、材料、零部件，重点关注光刻机、光刻胶等细分环节；AI相关领域，AI算力将得到国家大基金三期更大支持力度，先进封装，高端存储（如HBM）值得重视。

 

[Legume7]

https://twitter.com/i/web/status/1875294242886840517

2025 is Huawei and Hisilicon's year of comeback.

厂长是关同学, who is a credible insider, claims that the Pura 80 series will feature the Kirin 9020+, while the the Kirin 9030 will have Antutu score between 1.4 and 1.5 million.

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定焦数码, another credible insider, claims the Mate XT will also be refreshed next year with the Kirin 9020 and better CMOS.

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京城数码爷, who is also credible, claims that the Mate 80 series will debut the first under-display 3D face unlock.

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[PopularScience]

远见智存 has successfully opened up the domestic and international industrial chains and achieved mass production of HBM2e chips. The research and development of the next generation HBM3/3e products has also been steadily advancing with remarkable achievements.

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[interestedseal]

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World class Oscilloscope with 60 GHz bandwidth and 160G sampling rate, which also means world class high speed high precision ADCs (the bridge chip between physical and digital world). Rumored to be HW ADC inside

 

[tokenanalyst]

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[huemens]

11 new Chinese entities including CIOMP added to the Entity List

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Chengdu RML Technology Co., Ltd.,
Chengdu Yaguang Electronics Co., Ltd.,
Chinese Academy of Sciences Changchun Institute of Optics, Fine Mechanics, and Physics,
Hefei Starwave Communication Technology Co., Ltd.,
Ji Hua Laboratory,
Nanjing Simite Optical Instruments Co., Ltd.,
Peng Cheng Laboratory,
Shanghai Institute of Optics and Fine Mechanics,
Suzhou Ultranano Precision Optoelectronics Technology Co., Ltd.,
Wuhu Kewei Zhaofu Electronics Co., Ltd.,and
Yaguang Technology Group Co., Ltd.

 

[tokenanalyst]

11 new Chinese entities including CIOMP added to the Entity List

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So? What else is new? The stooges in the US using basically the unenforceable export controls hammer in every nail. Meanwhile the Chip Act is a Biden failure and China semiconductor industry has made more advances in 5 years that in the last 3 to 4 decades thanks to the FUD created by these export controls.