Chinese semiconductor thread II
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Silicon Motion’s President Wallace C. Kou told the Economic Daily News that the memory demand will likely remain sluggish in the first half of 2025. In addition, the aggressive expansion of China’s memory leader, CXMT, would also cast a cloud over the market, posing challenges to Taiwanese companies like Nanya Technology and ADATA, as noted by the report.
Citing Kou, the report notes that CXMT has started mass production of DDR5 recently, which is expected to boost its market share from merely 2% to 10% by the end of 2024. As the company eyes to enter the mobile sector and aims to begin LPDDR5 mass production in 2025, its overall market share is likely to further increase to 15% by then, the report adds.
Citing Kou, the report notes that CXMT has started mass production of DDR5 recently, which is expected to boost its market share from merely 2% to 10% by the end of 2024. As the company eyes to enter the mobile sector and aims to begin LPDDR5 mass production in 2025, its overall market share is likely to further increase to 15% by then, the report adds.
I've seen numerous reports online recently about Mate 70 Pro/Pro+ 1TB version being 20-30% slower in disk performance than 512GB. This can't happen if there's only one NAND supplier, because higher capacity never brings worse I/O if the NAND chips are the same.
People are speculating from their benchmarks that there are at least 3 different NAND chips used in Mate 70 Pro/Pro+. Can one of them be YMTC? Maybe.
That doesn't necessarily mean they used a different supplier. They are different products and could have been from different generations or using different cell types from same supplier. Typically higher storage is achieved by using cell types of higher density. But lower density cell types from same generation would normally have better performance. For 512G it was mentioned in the report that it is a TLC chip. For 1TB if they used something like QLC, it could perform worse than the 512GB even if it is from same supplier, especially if it is from an older generation.
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Unisoc launches RTOS flagship smart wearable platform W337, doubling performance
Recently, UNISOC officially launched its flagship product W337 based on the RTOS system. It has rich features and ultra-low power consumption, further strengthening UNISOC's smart wearable product portfolio and providing advanced technical solutions for the mid-to-high-end and broad smart wearable market.
Excellent performance, making a powerful RTOS wearable chip
Dual-core CPU architecture
The Unisoc W337 is the first dual-core CPU architecture based on the RTOS system. It can dynamically adjust power consumption according to the system load. When the system load is low, the frequency and voltage of one or two cores are reduced. Since there are two cores to share the load, the heat generated by each core is relatively low, further reducing the overall heat dissipation requirements of the system. The dual-core architecture better achieves load balancing, flexibly distributes tasks to two cores, and significantly enhances the stability and reliability of the system.
Integrated independent 3D GPU
3D GPU has excellent parallel processing capabilities and specialized graphics rendering functions, and can render highly realistic three-dimensional images, greatly improving the speed and effect of image rendering, image special effects, texture processing, light and shadow effects, anti-aliasing and other image data, providing users with a more vivid and intuitive visual experience, and improving the performance and response speed of the overall system. 3D GPU also has a wealth of development tools and libraries, which makes it easy for developers to quickly build efficient and stable graphics and image applications.
Double the performance, faster response
The Unisoc W337 is equipped with dual-core A53, with a maximum frequency of 1.4GHz, which doubles the performance of the previous generation single-core CPU. The Unisoc W337 uses software multi-core scheduling optimization technology to significantly improve the efficiency of data exchange and coordination between cores, with higher processing power and faster response speed.
High scalability and high integration
The dual-core system of UNISOC W337 provides more computing resources, supports multi-tasking, and makes system expansion and upgrade easier and more convenient. With the dual-core scheduling support, W337 supports video calls and instant chats, and can run smoothly when communication and multimedia scene applications such as video recording and video playback are used concurrently. UNISOC W337 has a very high integration level, integrating dual-core CPU, GPU, ISP, Display, Video, Audio, WCN and security module, and Memory adopts SiP packaging.
Support HD dual camera
UNISOC W337 supports true dual cameras on the front and back, and the ISP algorithm has been upgraded to version 4.0, which makes color and exposure more accurate, and details, textures and noise more refined. It also supports 720P video recording and face recognition, making video recording clearer and more vivid.
Excellent performance, making a powerful RTOS wearable chip
Dual-core CPU architecture
The Unisoc W337 is the first dual-core CPU architecture based on the RTOS system. It can dynamically adjust power consumption according to the system load. When the system load is low, the frequency and voltage of one or two cores are reduced. Since there are two cores to share the load, the heat generated by each core is relatively low, further reducing the overall heat dissipation requirements of the system. The dual-core architecture better achieves load balancing, flexibly distributes tasks to two cores, and significantly enhances the stability and reliability of the system.
Integrated independent 3D GPU
3D GPU has excellent parallel processing capabilities and specialized graphics rendering functions, and can render highly realistic three-dimensional images, greatly improving the speed and effect of image rendering, image special effects, texture processing, light and shadow effects, anti-aliasing and other image data, providing users with a more vivid and intuitive visual experience, and improving the performance and response speed of the overall system. 3D GPU also has a wealth of development tools and libraries, which makes it easy for developers to quickly build efficient and stable graphics and image applications.
Double the performance, faster response
The Unisoc W337 is equipped with dual-core A53, with a maximum frequency of 1.4GHz, which doubles the performance of the previous generation single-core CPU. The Unisoc W337 uses software multi-core scheduling optimization technology to significantly improve the efficiency of data exchange and coordination between cores, with higher processing power and faster response speed.
High scalability and high integration
The dual-core system of UNISOC W337 provides more computing resources, supports multi-tasking, and makes system expansion and upgrade easier and more convenient. With the dual-core scheduling support, W337 supports video calls and instant chats, and can run smoothly when communication and multimedia scene applications such as video recording and video playback are used concurrently. UNISOC W337 has a very high integration level, integrating dual-core CPU, GPU, ISP, Display, Video, Audio, WCN and security module, and Memory adopts SiP packaging.
Support HD dual camera
UNISOC W337 supports true dual cameras on the front and back, and the ISP algorithm has been upgraded to version 4.0, which makes color and exposure more accurate, and details, textures and noise more refined. It also supports 720P video recording and face recognition, making video recording clearer and more vivid.
Another interesting wet etching technique is Q-ALE GAAFET 3nm nodes. With the biggest advantage that this process can be done in batches increasing throughput.
Xiamen University-Hengkun Technology Advanced Semiconductor Materials Joint Innovation Center Signed and Unveiled
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The Xiamen University-Hengkun Technology Advanced Semiconductor Materials Joint Innovation Center (hereinafter referred to as the "Joint Innovation Center") was recently signed and unveiled at Xiamen University Siming Campus. The center is a high-level school-enterprise cooperation center jointly built by Xiamen University and Xiamen Hengkun New Materials Technology Co., Ltd. (hereinafter referred to as "Hengkun Technology") based on the unique advantages of Xiamen University's semiconductor and chemistry and chemical engineering research and development and Hengkun Technology's market advantages in the field of integrated circuit photoresists.
The organizer introduced that the center uses the engineering center as an important supporting unit and the research and development of advanced semiconductor materials as its main research direction. It aims to promote the realization of products from electronic chemical development, concept verification, pilot equipment operation optimization, engineering simulation to industrial application, and provide overall solutions for key materials in advanced processes for integrated circuit chip manufacturing.
The Xiamen University-Hengkun Technology Advanced Semiconductor Materials Joint Innovation Center (hereinafter referred to as the "Joint Innovation Center") was recently signed and unveiled at Xiamen University Siming Campus. The center is a high-level school-enterprise cooperation center jointly built by Xiamen University and Xiamen Hengkun New Materials Technology Co., Ltd. (hereinafter referred to as "Hengkun Technology") based on the unique advantages of Xiamen University's semiconductor and chemistry and chemical engineering research and development and Hengkun Technology's market advantages in the field of integrated circuit photoresists.
The organizer introduced that the center uses the engineering center as an important supporting unit and the research and development of advanced semiconductor materials as its main research direction. It aims to promote the realization of products from electronic chemical development, concept verification, pilot equipment operation optimization, engineering simulation to industrial application, and provide overall solutions for key materials in advanced processes for integrated circuit chip manufacturing.
Yuheng Optics' grating rulers have been verified in multiple semiconductor production links
Taking wafer handling as an example, the grating ruler can monitor the movement status of the wafer in real time to ensure its accurate positioning during the production process. This not only improves production efficiency, but also minimizes the losses caused by human errors. In addition, in the cutting and packaging and testing links, the application of grating rulers also performed well, optimizing the production process and improving production consistency.
Of course, technological innovation lies not only in the improvement of equipment, but also in the enhancement of user experience. With the continuous advancement of semiconductor technology, more intelligent and automated features have become an industry trend. By integrating AI and high-precision equipment, Optoelectronics can achieve more intelligent data analysis and processing, transforming traditional production lines into smart factories. In this wave, AI's deep learning and natural language processing capabilities have become a new engine for improving manufacturing efficiency, further promoting revolutionary changes in the industry.
