Chinese semiconductor thread II
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Xinzhoubang plans to invest in building a new fluorine material research center with a total investment of no more than 150 million yuan
Xinzhoubang issued an announcement stating that the company had reviewed and approved the "Proposal on the Holding Subsidiary to Invest in the Construction of the Sanming Haisifu Fluorine New Materials Research Center Project" yesterday.
Xinzhoubang plans to use its holding subsidiary Haisifu as the project implementation entity to invest in the construction of the Sanming Haisifu Fluorine New Materials Research Center project in Nanshan, Shangfang Village, Chengguan Township, Mingxi County, Sanming City, Fujian Province. The total planned investment of the project is no more than 150 million yuan, and the construction period is 20 months.
The announcement shows that according to the development plan of Xinzhoubang, the organic fluorine chemicals division will be responsible for the management and operation of two production bases, Sanming Haisifu Chemical Co., Ltd. and Fujian Haidefu New Materials Co., Ltd., as well as two subsidiaries, Haisifu Chemical (Shanghai) Co., Ltd. and Haisifu (Shenzhen) Technology Co., Ltd. Xinzhoubang's organic fluorine chemicals are widely used and the market demand continues to grow. The establishment of a research center can promote the company's development in a greener, low-carbon, and circular direction, promote technological innovation, improve product quality and performance, develop new products that adapt to the market, and better grasp and meet the market needs of emerging industries.
Xinzhoubang said that the investment of its holding subsidiary Haisifu in this project can meet the company's demand for high value-added product innovation for the rapid development of its organic fluorine chemicals division in the future, which will be beneficial to the company's optimization of resource allocation and promotion of the company's organic fluorine chemicals division's stable and sustainable development, and is in line with the interests of the company and all shareholders.
Xinzhoubang plans to use its holding subsidiary Haisifu as the project implementation entity to invest in the construction of the Sanming Haisifu Fluorine New Materials Research Center project in Nanshan, Shangfang Village, Chengguan Township, Mingxi County, Sanming City, Fujian Province. The total planned investment of the project is no more than 150 million yuan, and the construction period is 20 months.
The announcement shows that according to the development plan of Xinzhoubang, the organic fluorine chemicals division will be responsible for the management and operation of two production bases, Sanming Haisifu Chemical Co., Ltd. and Fujian Haidefu New Materials Co., Ltd., as well as two subsidiaries, Haisifu Chemical (Shanghai) Co., Ltd. and Haisifu (Shenzhen) Technology Co., Ltd. Xinzhoubang's organic fluorine chemicals are widely used and the market demand continues to grow. The establishment of a research center can promote the company's development in a greener, low-carbon, and circular direction, promote technological innovation, improve product quality and performance, develop new products that adapt to the market, and better grasp and meet the market needs of emerging industries.
Xinzhoubang said that the investment of its holding subsidiary Haisifu in this project can meet the company's demand for high value-added product innovation for the rapid development of its organic fluorine chemicals division in the future, which will be beneficial to the company's optimization of resource allocation and promotion of the company's organic fluorine chemicals division's stable and sustainable development, and is in line with the interests of the company and all shareholders.
SMIC's second phase semiconductor project is expected to be put into trial operation by the end of the year and put into production in June next year
The Guizhou Heding Intelligent Manufacturing Project is located in the Economic Development Zone of Qingzhen City and is organized and implemented by Guizhou Zhongxin Microelectronics Technology Co., Ltd. (hereinafter referred to as "Zhongxin Micro"). Zhongxin Micro is a high-tech company jointly funded by Heding Group (Shenzhen) Co., Ltd. and Qingzhen Industrial Investment Co., Ltd., which integrates integrated circuit chip research and development, packaging and testing, intelligent electronic product solution motherboard design, production, manufacturing and sales. The project will adopt advanced equipment and technology from home and abroad, adhering to the concept of fully embodying industrialization, high-end, intelligent and integrated, and is committed to building a green innovation factory with leading domestic level.
The project is divided into two phases. The first phase of the project has built 6 semiconductor electronic component packaging production lines, which will be put into production in July 2022, achieving a monthly production capacity of 400 million integrated circuit chips. The second phase of the project will start construction in July 2023, and will build 1 microprocessor MCU production line and 1 memory chip production line. At present, the factory upgrade and renovation has been completed, and the equipment procurement has been completed by 95%. Installation and debugging are underway. It is expected to be put into trial operation at the end of the year and officially put into production in June next year.
SMIC applies digital management technologies and methods to realize the digitization, informatization and intelligence of production lines, which not only reduces the workload of employees, but also realizes quality control throughout the entire process. Zhang Sheng said: "Our automation rate exceeds 85%. Workers only need to load and unload materials, troubleshoot, etc. The intermediate processes are all automatic operations, and one worker can manage 15 machines."
"Both the Phase I and Phase II projects are in this building. The Phase II project is mainly aimed at supplementing equipment and expanding production capacity, including automatic die bonding machines, automatic plastic sealing systems, fully automatic turret testing systems, automatic sorting testing systems, etc. It is currently being installed and tested, and will be able to be put into trial operation by the end of the month." Zhang Sheng introduced that the Phase I project has achieved a monthly production capacity of 400 million integrated circuit chips. After the Phase II project is completed, it will be able to increase production by 100 million microprocessors MCUs and 30 million memory chips each year.
Hesai Technology: Newly obtained orders for more than ten models from three of the top five domestic automakers in terms of sales volume, with the cumulative number of mass-produced designated models exceeding 100
On December 27, Hesai Technology, a world-leading LiDAR company, announced that it has been awarded orders for more than ten mass-produced models from three of the top five domestic automakers in terms of sales (the top five here refer to domestic brands, excluding joint ventures). Together with the recent orders for multiple new models from leading OEMs such as Great Wall and Changan, Hesai Technology has now accumulated more than 100 pre-installed mass-produced models from 21 automakers.
Hesai Technology said that the three newly designated domestic automakers include leading automakers with annual sales of millions, independent brand OEMs with leading sales in both domestic and overseas markets, and well-known automakers with rich product lines and global layout, covering multiple models and brands. Many of the cooperative models are planned to be released in 2025, equipped with Hesai's compact ultra-high-definition laser radar ATX.
According to reports, from the first mass production point in 2021 to more than 100 models today, Hesai LiDAR has widely enabled OEMs to implement urban NOA and active safety functions on a large scale, becoming an indispensable "invisible airbag" for high-end intelligent driving. With continuous technological innovation, stable and reliable delivery capabilities, strict quality control and accurate market insights, Hesai Technology has firmly established a leading position in the global LiDAR market.
Hesai Technology said that the three newly designated domestic automakers include leading automakers with annual sales of millions, independent brand OEMs with leading sales in both domestic and overseas markets, and well-known automakers with rich product lines and global layout, covering multiple models and brands. Many of the cooperative models are planned to be released in 2025, equipped with Hesai's compact ultra-high-definition laser radar ATX.
According to reports, from the first mass production point in 2021 to more than 100 models today, Hesai LiDAR has widely enabled OEMs to implement urban NOA and active safety functions on a large scale, becoming an indispensable "invisible airbag" for high-end intelligent driving. With continuous technological innovation, stable and reliable delivery capabilities, strict quality control and accurate market insights, Hesai Technology has firmly established a leading position in the global LiDAR market.
Looks like translation error. Not SMIC. English name is likely CCMIC
There is some technical explanation here from Garen semi explaining why their 010 GaO substrate is better than that of imports. It has breakdown voltage as high as 2429V
010 GaO substrate has the highest thermal conductivity, which is conducive to enhancing device heat dissipation and improving power device performance; secondly, the (010) substrate has a faster epitaxial growth rate and improves epitaxial efficiency.
Jeez, while I'm still checking online I asked my friend today to queue offline at an official store. The staff told him there are literally more than 100 thousand people in front of me for Mate 70 Pro and suggested I just give up and check online stores.
Normally when a third party wants to raise prices they tell you you can get one by paying a bit more, but this is an official store and the staff simply said I should give up, so I tend to believe it. The fact that there are more than 100k people waiting in one city (although it's a large city) indicates there's a absolutely enormous gap between demand and production now.
Normally when a third party wants to raise prices they tell you you can get one by paying a bit more, but this is an official store and the staff simply said I should give up, so I tend to believe it. The fact that there are more than 100k people waiting in one city (although it's a large city) indicates there's a absolutely enormous gap between demand and production now.
On Huawei online store some variants are still available (pro is not). But there's a countdown which shows new stock will be available in 11 hours from now for all out of stock variants including pro.
I've been waiting for that countdown for weeks now. That countdown refreshes every day but every day the moment I click it it immediately shows no stock, and that's why I asked my friend to try it offline. I'm now wondering if I should write a script to do that for me. I also have a huge timezone disadvantage which is sad.
But anyway, the thing I want to say is that production is still way behind demand right now.
Looks like they still have a huge supply problem even though the Chip is based on 7nm tech. Imagine how low the supply of the phone would be if they wanted to go for SAPD 5nm process node. Its imperative China does everything it can to get that EUVL.
Interesting insight from this guy on X about Memory makers not needing leading edge Lithography machine once they transition to 3D structure.
"Many experts and analysts say that EUV is a "bottleneck" for China's semiconductor development. They argue that since China doesn't have EUV, there will be limitations to its progress. However, what if Chinese companies don't simply replicate the technical hurdles that existing companies have overcome, but instead attempt a quantum jump with new standards and new technologies?
Let's take NAND flash as an example. In previous 2D NAND flash leading-edge processes, ArF lithography equipment was used, but with the transition to 3D, the level of lithography equipment actually regressed to KrF. YMTC preemptively adopted direct bonding technology and actively invested in 3D technology, reaching a level that threatens leading companies in terms of technical capabilities. This pattern may also be repeated in the DRAM market. As implementing finer line widths is no longer the sole source of competitiveness, the most advanced lithography equipment has become unnecessary.
The same is true for 3D DRAM. Depending on the structure being developed by the industry, word lines or bit lines will be vertically stacked. If word lines are vertical, the pitch is about 40nm, and if bit lines are vertical, the pitch is about 70nm. With a 40-70nm pitch, KrF, or at most ArF dry lithography equipment, is sufficient. This means that CXMT, which cannot purchase EUV equipment, can mass-produce 3D DRAM with the equipment it has already purchased. If CXMT has such a roadmap, it can quickly catch up with the 4-5 year technological gap currently maintained by the three major players through 3D technology. From what I've gathered, CXMT appears to be targeting the completion of 3D DRAM development potentially around the end of 2026.
Let's briefly examine CXMT's roadmap. CXMT's Hefei Fab 1 can increase production to 90,000 wafers per month, and Beijing Fab 1 can also increase production to 90,000 wafers per month. Hefei Fab 2 aims for mass production (Gen 4) next year and is equivalent to Korea's 1z node. Gen 5 is based on Micron's 1b (judged to be mimicking what Micron did without EUV) and is likely to be in production by the end of 2026. In conclusion, I argue that we should not underestimate China. They are churning out around 1 million PhD graduates every year and are catching up at a truly formidable pace. Seeing China's development as being blocked by US sanctions is too myopic."
When YMTC was put into sanction and was not able to expand/maintain its fab, people were talking about LAM equipment, not ASML Lithography machines.
I wonder, how long it will take for AMEC to develop that Cryogenic High Aspect Ratio Etching machine required for further development of the NAND layers by YMTC.
And CXMT should be utilizing all the limited time it has to procure every advanced tools it can from AMAT, LAM, KLA & TEL because you don't know what the Trump Administration will do once in power. The Koreans (including this guy i posted above) are having sleepless night since the debut of CXMT DDR5
Interesting insight from this guy on X about Memory makers not needing leading edge Lithography machine once they transition to 3D structure.
"Many experts and analysts say that EUV is a "bottleneck" for China's semiconductor development. They argue that since China doesn't have EUV, there will be limitations to its progress. However, what if Chinese companies don't simply replicate the technical hurdles that existing companies have overcome, but instead attempt a quantum jump with new standards and new technologies?
Let's take NAND flash as an example. In previous 2D NAND flash leading-edge processes, ArF lithography equipment was used, but with the transition to 3D, the level of lithography equipment actually regressed to KrF. YMTC preemptively adopted direct bonding technology and actively invested in 3D technology, reaching a level that threatens leading companies in terms of technical capabilities. This pattern may also be repeated in the DRAM market. As implementing finer line widths is no longer the sole source of competitiveness, the most advanced lithography equipment has become unnecessary.
The same is true for 3D DRAM. Depending on the structure being developed by the industry, word lines or bit lines will be vertically stacked. If word lines are vertical, the pitch is about 40nm, and if bit lines are vertical, the pitch is about 70nm. With a 40-70nm pitch, KrF, or at most ArF dry lithography equipment, is sufficient. This means that CXMT, which cannot purchase EUV equipment, can mass-produce 3D DRAM with the equipment it has already purchased. If CXMT has such a roadmap, it can quickly catch up with the 4-5 year technological gap currently maintained by the three major players through 3D technology. From what I've gathered, CXMT appears to be targeting the completion of 3D DRAM development potentially around the end of 2026.
Let's briefly examine CXMT's roadmap. CXMT's Hefei Fab 1 can increase production to 90,000 wafers per month, and Beijing Fab 1 can also increase production to 90,000 wafers per month. Hefei Fab 2 aims for mass production (Gen 4) next year and is equivalent to Korea's 1z node. Gen 5 is based on Micron's 1b (judged to be mimicking what Micron did without EUV) and is likely to be in production by the end of 2026. In conclusion, I argue that we should not underestimate China. They are churning out around 1 million PhD graduates every year and are catching up at a truly formidable pace. Seeing China's development as being blocked by US sanctions is too myopic."
When YMTC was put into sanction and was not able to expand/maintain its fab, people were talking about LAM equipment, not ASML Lithography machines.
I wonder, how long it will take for AMEC to develop that Cryogenic High Aspect Ratio Etching machine required for further development of the NAND layers by YMTC.
And CXMT should be utilizing all the limited time it has to procure every advanced tools it can from AMAT, LAM, KLA & TEL because you don't know what the Trump Administration will do once in power. The Koreans (including this guy i posted above) are having sleepless night since the debut of CXMT DDR5