Chinese semiconductor thread II

supersnoop

Colonel
Registered Member
Amd ryzen 5 4500 is equivalent to intel i7 from 2018. If kx-7000 was released in 2023, that's a 5 year gap in performance when it comes to laptop/desktop cpu. This much worse than domestic mobile cpu and ascend gpu.

I wonder why laptop desktop cpu do not get the same attention as gpu or mobile soc are getting. People do need these to run pretty much any professional applications and run things like cad software. Or is it considered a given that US will never ban these to be exported to China.
Simple answer, PC demand is low relative to mobile.
A lot of people are fine with a 5+ year old PC, but not so with a phone.
 

tokenanalyst

Lieutenant General
Registered Member

Tianma Launches Mass-Produced 185Hz Ultra-Sensitive High Refresh Rate Screen​


Tianma has achieved a major milestone in display technology by launching the world’s first mass-produced 185Hz AMOLED ultra-high refresh rate screen, pushing mobile visual performance to new heights. Building on its prior success with 165Hz displays, this breakthrough delivers an unmatched blend of speed, precision, and efficiency — particularly for gaming and fast-motion content.
  • Dual-Track Pixel Architecture: Tianma’s proprietary discrete pixel circuit design decouples data writing from DTFT threshold compensation, solving the longstanding trade-off between speed and image accuracy. This improves first-frame brightness by 13.4% and reduces image retention by 61%.​
  • Ultra-Fast Response: With a 5.4ms per frame response time and intelligent touch latency optimization, the screen enables “point-and-shoot” precision in e-sports — eliminating ghosting and enhancing detail in fast-paced scenes like FPS games.​
  • Power Efficiency: Despite the high refresh rate, the screen uses low-power light-emitting tech (award-winning) and a smart power model to reduce energy consumption, extending battery life without sacrificing performance.​
  • Eye Comfort & Uniformity: Features full-scene flicker-free dimming and pixel-level calibration for consistent color/brightness, ensuring long-term visual comfort and image quality.​
Tianma leverages its Tiangong Screen platform, backed by world-class R&D facilities and four core research platforms (panels, optics, driving, materials). The company is already developing 240Hz technology and holds leadership in LTPO, foldable, and SLOD innovations.

Tianma aims to make cutting-edge displays accessible beyond labs — integrating them into everyday experiences from gaming to browsing. With the tagline “Good screen, illuminating the beauty of life,” the company positions its tech as enhancing not just performance, but overall visual well-being.​

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tokenanalyst

Lieutenant General
Registered Member

3D-PATH: A Hierarchy LUT Processing-in-memory Accelerator with Thermal-aware Hybrid Bonding Integration.​


LUT-based processing-in-memory (PIM) architectures enable general-purpose in-situ computing by retrieving precomputed results. However, they suffer from limited computing precision, redundancy, and high latency of off-table access. To address these challenges, we present 3D-PATH, a novel PIM architecture that employs 3D hybrid bonding to integrate a DRAM-LUT, enhancing system capacity and reducing access latency. To further optimize efficiency, 3D-PATH introduces a hierarchical fast-LUT design that reduces storage redundancy and accelerates computation. Additionally, 3D-PATH extends computing precision by efficiently supporting floating-point operations via representation transformation and parallel interleaving banks. While hybrid bonding offers significant benefits, it induces heat dissipation challenges. To address this, we implement thermal-aware hardware that ensures the DRAM Die temperature maintains below the threshold of 85°C. Evaluations on arithmetic and AI workloads demonstrate that 3D-PATH achieves up to 12.68 × higher throughput than GPUs and 2.27-7.54 × over prior LUT-PIMs, while delivering a 12.24 × improvement in floating-point energy efficiency over GPU and 2.13 × over a 3D baseline.

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