Chinese semiconductor thread II

leibowitz

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WASHINGTON (Reuters) -The Biden administration announced on Monday a last-minute trade investigation into older Chinese-made "legacy" semiconductors that could heap more U.S. tariffs on chips from China that power everyday goods from autos to washing machines to telecoms gear.

U.S. Commerce Secretary Gina Raimondo said on Monday her department's research showed that two-thirds of U.S. products using chips had Chinese legacy chips in them, and half of U.S. companies did not know the origin of their chips including some in the defense industry, findings that were "fairly alarming."

Tai told reporters the trade agency has found evidence that China is targeting the semiconductor industry for global domination, adding: "This is enabling its companies to rapidly expand capacity and to offer artificially lower-priced chips that threaten to significantly harm and potentially eliminate their market-oriented competition."

A Biden administration official said that in addition to examining the impact of the imported chips themselves, the probe would look at their incorporation into downstream components and end-use goods for critical industries including defense, automotive products and medical devices.

It also will target China's production of silicon carbide substrates and wafers for semiconductor fabrication.
I wonder what kind of post-2024 consulting gig UMC offered Raimondo in exchange for this investigation
 

tokenanalyst

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Tianma launches group standard for rigid-flexible hybrid structure OLED display​


Recently, the group standard T/CVIA 143-2024 T/DTIA 006-2024 "Technical Specifications for Rigid-Flexible Hybrid Structure OLED Displays" developed by Tianma was approved by the China Electronic Video Industry Association and the National New Display Technology Innovation Center and officially released. The release of this standard is an important milestone in the standardized development of the rigid-flexible hybrid structure OLED display industry.

The standard specifies in detail the classification, technical requirements, test methods, inspection rules, marking, labeling, accompanying documents, packaging, transportation, storage and application environment of rigid-flexible hybrid structure OLED displays, and includes core display performance requirements. As the first rigid-flexible hybrid structure OLED standard, the release of this specification fills the gap in the industry and further improves the standard system in the OLED field. The formulation and implementation of the standard provides a basis for the evaluation method of rigid-flexible hybrid structure OLED displays, which is conducive to improving product quality and promoting the healthy and rapid development of the rigid-flexible hybrid structure OLED display industry.

The rigid-flexible hybrid structure OLED display, also known as "Hybrid AMOLED technology", is a new technology that combines a glass substrate and a thin-film package. Compared with rigid OLED panels, it is thinner and lighter, and can be nearly as thin and light as a flexible OLED panel. Compared with flexible OLED panels, it has a lower cost. At the same time, it can also solve the problems of wrinkled and uneven edges, low strength and reliability when the screen becomes larger. It can make the product have lower power consumption, longer life and better picture quality, and can be widely used in display fields such as wearables, mobile phones, cars, and laptops.

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tokenanalyst

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NN in wafer motion stages.

Dynamic Separation Model-Based Sliding Mode Control with Adaptive Neural Network Compensators for a Reluctance Actuator Motion System​

  • School of Mechanical and Electrical Engineering, Central South University.
  • State Key Laboratory of High Performance and Complex Manufacturing.

Abstract​

The maglev technology has been recently used for advanced semiconductor equipment. The stringent accuracy requirement of the semiconductor manufacturing processes has posed new challenges about modeling and control of maglev systems (MLSs). This paper presents a new sliding mode control (SMC) scheme, named as SMCLFF, to tackle the impacts of inherent non-linearities caused by leakage and fringing fluxes (LFF), and external disturbances caused by the gap measurement mismatch (GMM) and non-orthogonal force (NOF) on the control of the MLS. A dynamic separation model (DSM) is designed to model the LFF effects in both the current–flux density (IB) relationship and the flux density–force (BF) relationship. The system is linearized by the DSM firstly, and the residual LFF effects and the external disturbances are suppressed by adaptive RBF neural networks (NNs) in SMCLFF respectively. The stability of the closed-loop control system was analyzed. Experiments were performed on a one-dimensional MLS plant. Results show that the DSM can effectively compensate for the LFF effects, and SMCLFF can enable the MLS to obtain high performance in a closed-loop control system.

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vincent

Grumpy Old Man
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Do we really need to post random Reddit takes on these things?
The source of dropout003’s quote
SICC is now delivering 8" SiC substrates with lower defect density than Wolfspeed for $700. Wolfspeed charges $1270 for the same product. My source is a former Wolfspeed customer, Warwick University. They report the SICC substrates have substantially fewer defects than those WS was supplying. It is likely WS was supplying a small customer like Warwick with lower quality at higher prices, but a $570 delta is huge and does not bode well for WS going forward. SICC now has about 17% market share and is growing as WS share is declining.
 

tphuang

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TySic is looking to go public. I think they are the top SiC epitaxy producer in China.

They have 8-inch epitaxy product
根据弗若斯特沙利文的资料,天域半导体是中国首批实现4英吋及6英吋碳化硅外延片量产的公司之一,及中国首批拥有量产8英吋碳化硅外延片能力的公司之一。截至2024年10月31日,天域半导体6英吋及8英吋外延片的年度产能约为420000片,这使公司成为中国具备6英吋及8英吋外延片产能的最大公司之一。

通过自主研发,天域半导体已掌握生产600–30000V单极型及双极型功率器件所需整个碳化硅外延片生产周期的必要核心技术及工艺。公司的产品范围全面,以行业领先的性能指标为特征。天域半导体目前提供4英吋及6英吋碳化硅外延片,并已开始量产8英吋外延片。
They have raised their 6/8 inch wafer production to 420k per year. Support 600-3000V power modules.
 
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