Chinese semiconductor thread II

tokenanalyst

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Nanda Optoelectronics: Its subsidiary, Ningbo Nanda Optoelectronics, has an ArF photoresist production capacity of 50 tons/year.​

Nanda Optoelectronics stated on its interactive platform that its subsidiary, Ningbo Nanda Optoelectronics, has an ArF photoresist production capacity of 50 tons/year. Currently, the company is actively promoting photoresist product verification, and testing of multiple products is progressing smoothly. Simultaneously, it is focusing on process stability, maintaining a continuous and stable supply of products for which orders were previously secured.​

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tokenanalyst

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Accelerating Breakthroughs in 3-7nm Process Technology in Wafer Manufacturing, Developing Ion Implanters, Coating and Developing Machines, Advanced Lithography Machines, and Etching Machines.​

 
The Zhejiang Provincial Department of Economy and Information Technology has drafted the "Zhejiang Province's 15th Five-Year Plan for New Industrialization (Draft for Public Comment)," and is now soliciting public opinions on its content and fair competition. The draft outlines the following: In the chip design and manufacturing field, breakthroughs will be made in low-power chip design, developing high-end general-purpose chips, application-specific chips, and smart chips, as well as developing fifth-generation reduced instruction set architecture chips. In the wafer manufacturing field, breakthroughs in the 3-7nm process will be accelerated. In the key materials field, the development of compound semiconductor materials, electronic gases, high-purity targets, and photoresists will be promoted. In the key equipment field, the development of ion implanters, coating and developing machines, advanced lithography machines, and etching machines will be promoted. In the packaging and testing field, breakthroughs in chip packaging, 3D heterogeneous integrated packaging, heterogeneous packaging, and pulse sequence testing technologies will be accelerated. In the next-generation semiconductor field, the development of gallium oxide, diamond, silicon carbide, and gallium nitride will be promoted.
 

tokenanalyst

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Tiancheng Technology: Assembled a top-tier domestic R&D team; products cover advanced glass substrates, chip manufacturing processes, and advanced packaging.​


The Shanghai Securities News learned from Tiancheng Technology that since the company established its semiconductor business unit in the third quarter of 2024, it has assembled a top-tier domestic R&D and technology team and independently developed a full range of products. The products cover all categories from advanced chip manufacturing processes, advanced packaging (2.5D and 3D packaging) to glass substrates. The technology team has the capability to develop electroplating solution additives from scratch and achieve complete independent control.​

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It is understood that Tiancheng Technology's product line includes electroplating solution additives for damascus steel, TSV, RDL, bumping, TGV, etc. These materials are widely used in various chip manufacturing processes, including various memory and logic chips such as HBM, and metal interconnects between chips.

Tiancheng Technology stated that in cutting-edge fields such as advanced processes and advanced packaging, Tiancheng Technology strives to become a brand with a domestic market share of over 20% within 2-3 years.

Meanwhile, Tiancheng Technology provides innovative solutions for TGV metallization of through-holes in glass substrates. Its efficiency and yield in TGV through-hole electroplating with AR=10~15 surpass those of a certain international brand, achieving a leapfrog development.

Currently, Tiancheng Technology is also working with leading domestic semiconductor equipment companies to promote a comprehensive solution for the localization of electroplating processes.

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tokenanalyst

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With an annual production capacity of 300,000 units, Xinjia Electronics' automotive-grade silicon carbide power modules are operating at full capacity.​


Xinjia Electronics, based in Weihai High-tech Zone, has achieved full capacity operation for its automotive-grade silicon carbide (SiC) power module production line, which began official production in Q2 2024. With an annual output of 300,000 units, the facility supports major domestic automakers like BYD and Geely in their new energy vehicle electronic control systems.

The company prioritized local supply chain development, achieving over 60% equipment localization especially in core packaging and testing which enhances cost efficiency and self-sufficiency. Beyond automotive applications, Xinjia is collaborating with universities to expand SiC technology into wind/solar energy storage and industrial frequency conversion, broadening its market reach.

In early 2025, the company's third-generation power semiconductor R&D and industrialization project entered equipment installation; the first phase is now fully operational. Upon full completion, it will have an annual production capacity of 12 million modules with an expected output value of 2 billion yuan. Over ten high-end SiC products are currently undergoing customer testing.

Xinjia Electronics’ core expertise lies in IGBT module production, and since 2019, it has focused on advancing SiC technology through integrated R&D in chip design, packaging, and applications—driving localization in new energy and industrial control sectors.

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tokenanalyst

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Contributing to the localization of semiconductor testing equipment, the No. 1 production plant of the Zhongke Feice (Skyverse) project has been successfully capped.​


On January 8, 2026, the topping-out ceremony for the No. 1 production plant of the Zhongke Feice Integrated Circuit Testing Equipment Shanghai Zhangjiang R&D Center and Production Base project, undertaken by China Construction Eighth Engineering Bureau Co., Ltd., was held. Representatives from the project construction party, general contractor, supervision party, and other participating units attended the ceremony.

The Shanghai Zhongke Feice project is a key project serving the national semiconductor industry strategy and promoting the localization of testing equipment. It is of great significance and carries a glorious mission. Since its commencement, the project team has consistently upheld the iron-willed spirit of "strict discipline and unwavering commitment," taking "creating a high-quality project and contributing to industrial upgrading" as its mission. Working closely with all participating units, they overcame numerous challenges, including tight deadlines and complex construction, effectively ensuring the high-quality progress of the project and jointly achieving the phased victory of successfully capping the No. 1 production plant.

The project team stated that in the upcoming construction tasks, they will always uphold the spirit of craftsmanship and strive for excellence, work hard, be pragmatic and diligent, ensure quality and quantity, and make every effort to advance the subsequent construction phases to ensure the timely delivery of a high-quality project.

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tokenanalyst

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Zhongke Feice releases its first electron beam measurement device (CD-SEM), marking a key breakthrough in domestic high-end measurement technology!​

CAS-based Fly Measurement officially released its first electron beam critical dimension measurement device (CD-SEM), MAGNOLIAEBM-600. The launch of this product marks another key addition to China's domestically produced high-end measurement equipment, which will strongly promote technological independence and security control in key links of the industrial chain.
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The newly released electron beam critical dimension measurement equipment is mainly aimed at key process technologies in the manufacturing of 1Xnm advanced logic and memory chips. It is suitable for critical dimension monitoring in core processes such as photolithography and etching. In many performance indicators, it has reached or even surpassed the international level of similar products, demonstrating significant potential for domestic substitution.

As a core piece of equipment determining chip yield and performance, high-end electron beam equipment has long relied on imports. To overcome this key technology, CAS-based Feice assembled a team of elite personnel to tackle the challenges of high measurement accuracy, high consistency, photoresist damage control, and 3D structure characterization in 1Xnm advanced processes. After several years, they completed independent research and development. This equipment not only precisely meets customers' stringent requirements for high-resolution, high-speed imaging, error control, stability, and measurement accuracy in advanced processes, but also offers significant value in improving production line efficiency and reducing overall costs.​

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FriedButter

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China limits Nvidia chip purchases to special circumstances, Information reports​

The Chinese government this week told some tech companies it would only approve their purchases of Nvidia's opens new tab H200 AI chips under special circumstances, such as for university research, the Information reported on Tuesday, citing two people with direct knowledge of the situation.

The move signals Beijing is remaining cautious about fully reopening the Chinese market to Nvidia, whose semiconductors are pivotal in operating the most advanced artificial intelligence applications and data centers.

China's government issued a "deliberately vague" directive, the report said, telling some technology firms to buy chips only when "necessary" but was unclear as to what that means.

The Information reported last week that China had asked some companies to halt their orders for the H200 chips, as it looked to prioritize domestic firms in their race to dominate AI.

Nvidia is caught between Washington and Beijing, as the U.S. weighs tighter export controls on its most advanced technology while China pushes to strengthen domestic AI capabilities and urges local firms to curb reliance on foreign tech.

Nvidia and the Chinese embassy in the U.S. did not immediately respond to Reuters' requests for comment.

The Chinese government plans to convene additional meetings with more companies to deliver the purchase directive, though it is unclear whether those sessions will include any new guidance, the report said.
 

tokenanalyst

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TCL CSOT's net profit exceeded 8 billion yuan last year!​


TCL CSOT achieved remarkable financial results in 2025, with net profit exceeding 8 billion yuan and operating revenue surpassing 100 billion yuan. Net operating cash flow also exceeded 40 billion yuan, reflecting strong operational efficiency and sustainable high-quality growth. The company’s performance is driven by its strategic focus on three core businesses: semiconductor display, new energy photovoltaics, and semiconductor materials.

In the display sector, TCL CSOT consolidated its leadership in large-size products like TVs and commercial displays while accelerating growth in small- and medium-sized segments. Key developments include completing the acquisition of former LG Display China (t11), enhancing LCD production capacity; acquiring a minority stake in Shenzhen Huaxing Optoelectronics (t6t7) to boost profitability; and expanding its G5.5 generation printed OLED line, including launching the world’s first high-generation printed OLED production line (t8) laying groundwork for future technological advancement.

TCL Zhonghuan maintained its position as China’s top domestic player in semiconductor materials, with annual revenue exceeding 5.7 billion yuan. Despite challenges from overcapacity and market volatility in the photovoltaic industry, the company remains committed to innovation, product diversification, and global expansion, supported by organizational reforms to improve profitability.

Moja Technology strengthened its industry leadership through solid performance in TV and monitor OEM markets and expanded into high-value segments such as commercial displays and gaming monitors. Other business units also operated steadily, contributing meaningfully to overall revenue. As a whole, TCL reaffirmed its vision of "global leadership" with a focus on innovation, advanced manufacturing, and resilience, aiming for long-term sustainable development in a complex global landscape.

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