Chinese semiconductor thread II

iewgnem

Senior Member
Registered Member
US export controls incentivize U.S. firms to move production offshore, costing the United States manufacturing jobs; U.S. and international semiconductor equipment companies are being required by their Chinese customers to remove all U.S. citizens from their supply chain and ship from outside the United States when selling to China.
Please, Log in or Register to view URLs content!
The article can be summed up as: export controls didn't achieve anything, but now we made them angry, we can't back out anymore, so we should focus on trying to delay our demise.
 

tokenanalyst

Brigadier
Registered Member

CFMEE: Liquid-cooled vapor chamber is expected to bring new application space.​


  Liquid-cooled heat spreaders bring incremental demand for direct write lithography. As AIGC spreads to the end side, end-side chips have higher requirements for heat dissipation performance, which has led to an increase in demand for liquid-cooled heat spreader VC (Vapor Chamber) solutions. Heat sinks are traditionally made in the form of stamping, but because of the requirements for alignment and flatness, they are changed to etching, which requires two exposures. The first one is completed with a traditional exposure machine, and the second exposure uses LDI equipment. We believe that Xingji Micro-Equipment, as a leading domestic direct write lithography manufacturer, is expected to usher in new industry demand and business expansion.
1732751931377.png

  Compared with traditional lithography equipment, direct write lithography equipment is not limited by the size of the mask, has a better correction mechanism, and can help improve the overall yield of advanced packaging processes such as 2.5D. According to the company's management, related products have been tested in mass production at many leading clients, and the verification is progressing smoothly. In 2024, under the overall weak recovery trend of the PCB industry, we see that the development of terminals such as AI servers and smartphones will bring about structural growth in high-end products such as HDI and FPCB. The company's management mentioned that the demand for high-end boards from downstream customers is growing rapidly, and coupled with the transfer of production capacity of downstream customers in Southeast Asia, the growth trend of overseas orders is obvious.
1732751972266.png


Please, Log in or Register to view URLs content!
 

Koron

Just Hatched
Registered Member
US export controls incentivize U.S. firms to move production offshore, costing the United States manufacturing jobs; U.S. and international semiconductor equipment companies are being required by their Chinese customers to remove all U.S. citizens from their supply chain and ship from outside the United States when selling to China.
Please, Log in or Register to view URLs content!

Wow, didn't know that under MIC 2025, goal explicitly is domestic EUV before 2030. :cool:
 

HighGround

Senior Member
Registered Member
US export controls incentivize U.S. firms to move production offshore, costing the United States manufacturing jobs; U.S. and international semiconductor equipment companies are being required by their Chinese customers to remove all U.S. citizens from their supply chain and ship from outside the United States when selling to China.
Please, Log in or Register to view URLs content!
Just saw this as well, interesting report.

@RobertC Any commentary you wanna add?
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
Please, Log in or Register to view URLs content!

SmartSens unveils its own fully domestically produced CIS SC585XS using 28nm+ process (I can only assume this is SMIC, since they don't call things 22nm, but rather 28nm cutout 1, cutout 2)

Target is Omnivision's OV50H CIS, which IIRC is also at least partially fabb'd at SMIC.

Claims its Sparse PDAF mode is 50% less power consumption than competition.
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
Please, Log in or Register to view URLs content!

We will see if this rumor turns out to be true

事实上,这次的华为麒麟9020自研小核更具备看点。

大核依然是TSV-130(9010同款 提升到2.5Ghz)、中核是TSV-130m(9010同款)

小核效果对标A73,从测得多核成绩来看,稍超预期,平均提升范围在40~50%,双发射设计。
not much change for large and medium core.
Small core becomes self developed. 2 channel decoder? Targeting A73 core.

We are going to get the geekerwan video at some point to test this out.
 

huemens

Junior Member
Registered Member
US considers removing some companies from the new sanction list amid lobbying from US equipment companies. Originally it was supposed to be unveiled today, which has now been delayed to Monday, while they are revising the list. According to Bloomberg some companies including CXMT has been removed from this round.

US Preps China Chip Curbs That Stop Short of Early Proposals​

Please, Log in or Register to view URLs content!
The latest proposal has key differences from earlier drafts, the people said. The first is which Chinese companies the US would add to a trade restriction list. The US had previously considered sanctioning six suppliers to Huawei Technologies Co. — the telecom giant at the center of China’s tech industry — and officials are aware of at least a half dozen more, the people said. But they now plan to add only some of those Huawei suppliers to the entity list, with the notable omission of ChangXin Memory Technologies Inc., which is trying to develop AI memory chip technology.
This version of the curbs plan seemed “better than the worst case the market had worried about,” said Leping Huang, chief technology analyst at Huatai Securities.
The rules now under consideration would also sanction two chip factories owned by Semiconductor Manufacturing International Corp.
More than 100 additional entity listings would focus on Chinese companies that make semiconductor manufacturing equipment, the people said, rather than fabrication facilities that make the chips themselves.
The latest version of the US controls also would include some provisions around high-bandwidth memory chips, which handle data storage and are essential to artificial intelligence. Samsung Electronics Co. and SK Hynix Inc. along with American memory maker Micron Technology Inc. are expected to be affected by the new measures, the people said.
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
okay this guy is more reliable

Please, Log in or Register to view URLs content!
一些独家信息:

华为已经实现了芯片关键技术突破,未来麒麟芯片将按照K9020/9030/9040,如此规律迭代;

麒麟9020是业界首发3GPP R18的5G-A SOC,内部数据小核能效平均提升50%,中核能效平均提升20%,大核高频点能效提升较大。相较于K9000S,CPU性能和能效、重载游戏、NPU算力和能效都有明显提升。
Huawei made major breakthrough here with K9020. It will be followed by 9030 and 9040
9020 is the world's 1st SGPP R1 5G-A SOC (so that's why it's the fastest)
According to internal data, score core performance improved 50% on average (vs A73)
Medium core improved by 20%
Energy efficient of large core improved significantly
compared to 9000S, CPU performance, energy efficiency for heavy loaded games & NPU computation have significantly improved.
 

antwerpery

Junior Member
Registered Member
So with the TSMC A.I chip ban, how many chinese companies will turn to Samsung instead of going along with SMIC? And how long before Samsung gets banned from producing GPUs for Chinese A.I companies?
 
Top