Chinese semiconductor thread II
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Kirin 9020 chip is stronger than Snapdragon 8+ Gen 1
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The Dimensity 9200 is built on TSMC's 2nd generation 4nm process (N4P). This process technology plays a key role in improving the performance of the chipset by providing high performance and power efficiency.
The following Dimensity chipsets have better performance than the Dimensity 9200:
Dimensity 9200+ Process: TSMC 2nd generation 4nm process (N4P)
Performance: Approximately 5% higher CPU performance and 10% higher GPU performance than the Dimensity 9200
Dimensity 9300 Process: TSMC 4nm process
Performance: Approximately 15% higher CPU performance and 40% higher GPU performance than the Dimensity 9200
These two chipsets are the successors to the Dimensity 9200, with improved performance through more advanced architecture and optimization. In particular, the Dimensity 9300 is the latest model, showing significant improvements in CPU and GPU performance.
The Snapdragon 8+ Gen 1 is manufactured using TSMC's 4nm process. This is in contrast to its predecessor, the Snapdragon 8 Gen 1, which was manufactured using Samsung's 4nm process. The Snapdragon 8+ Gen 1, manufactured using TSMC's 4nm process, has significantly improved performance and efficiency compared to its predecessor, which was manufactured using Samsung's 4nm process. Specifically, the big core performance has improved by 8%, the efficiency has improved by 28%, and the power consumption has also been reduced by 15%3. Here are the Snapdragon chipsets that outperform the Snapdragon 8+ Gen 1:
Snapdragon 8 Gen 2 Process: 4nm (TSMC)
Performance: Approximately 25% higher CPU performance, 35% higher GPU performance than the Snapdragon 8+ Gen 1
Snapdragon 8 Gen 3 Process: 3nm (TSMC)
Performance: Approximately 30% higher CPU performance, 25% higher GPU performance than the Snapdragon 8 Gen 2
These two chipsets are newer generations than the Snapdragon 8+ Gen 1, and their performance has been significantly improved through more advanced process technology and architectural improvements. The Snapdragon 8 Gen 3, in particular, is built with the latest technology, boasting the highest performance of the current Snapdragon lineup.
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US export controls incentivize U.S. firms to move production offshore, costing the United States manufacturing jobs; U.S. and international semiconductor equipment companies are being required by their Chinese customers to remove all U.S. citizens from their supply chain and ship from outside the United States when selling to China.
You forgot the newest big boys, Dimensity 9400 and Snapdragon X Elite
The second phase of Jingneng Microelectronics' automotive-grade semiconductor packaging and testing base project started.
According to news released by Wenling, the semiconductor incubation park project and the second phase of Jingneng Microelectronics automotive-grade semiconductor packaging and testing base project, which are under construction by Wenling New City Development Zone, have officially started construction recently.
Zhejiang Jingneng Microelectronics Co., Ltd. is a power semiconductor company under Geely Technology Group. It mainly focuses on chip design and module innovation in the new energy field. It has the comprehensive capabilities of "chip design + module manufacturing + vehicle regulation certification" and provides customers with new energy vehicles, electric motorcycles, photovoltaics, energy storage, new energy ships and other customers with superior performance power products and services.
In May last year, Wenling New Town Development Zone and Zhejiang Jingneng Microelectronics Co., Ltd. successfully signed a contract for a car-grade semiconductor packaging and testing base project, which was implemented in two phases. Among them, the first phase expansion project mainly built an automotive-grade Si/SiC device advanced packaging production line, which was officially put into production in July this year, and the annual output value is expected to exceed 200 million yuan.
The total land area of the Phase II project is about 15,000 square meters, and the total construction area is about 34,000 square meters. A new production building, a living service building and auxiliary buildings will be built, which will be mainly used for the research and development, production and sales of automotive-grade power device series products. At the same time, the Phase I production line will be moved into the new factory building as a whole, and it is planned to be completed and put into production in 2026.
Zhejiang Jingneng Microelectronics Co., Ltd. is a power semiconductor company under Geely Technology Group. It mainly focuses on chip design and module innovation in the new energy field. It has the comprehensive capabilities of "chip design + module manufacturing + vehicle regulation certification" and provides customers with new energy vehicles, electric motorcycles, photovoltaics, energy storage, new energy ships and other customers with superior performance power products and services.
In May last year, Wenling New Town Development Zone and Zhejiang Jingneng Microelectronics Co., Ltd. successfully signed a contract for a car-grade semiconductor packaging and testing base project, which was implemented in two phases. Among them, the first phase expansion project mainly built an automotive-grade Si/SiC device advanced packaging production line, which was officially put into production in July this year, and the annual output value is expected to exceed 200 million yuan.
The total land area of the Phase II project is about 15,000 square meters, and the total construction area is about 34,000 square meters. A new production building, a living service building and auxiliary buildings will be built, which will be mainly used for the research and development, production and sales of automotive-grade power device series products. At the same time, the Phase I production line will be moved into the new factory building as a whole, and it is planned to be completed and put into production in 2026.
Another domestic semiconductor equipment manufacturer's IPO officially launched!
Jiangsu Pioneer Precision Technology Co., Ltd. (hereinafter referred to as "Pioneer Precision") officially launched its IPO and plans to be listed on the Science and Technology Innovation Board. The announcement shows that Pioneer Precision plans to publicly issue 50,595,000 new shares, accounting for 25% of the company's total share capital after this public offering, and plans to raise a total of 587 million yuan in investment funds.
It is understood that Pioneer Precision's main business is the research and development, production and sales of precision components for semiconductor equipment. Its core products include: key process components, process components and structural components such as cavities, liners, gas uniforming plates and heaters. The products are mainly used in the wafer reaction areas of etching equipment and thin film deposition equipment.
Does it matter ? The few semicon equipment capable nations are only Netherlands, S.Korea and Japan and all their exports control are literally aligned with US demands. It is not as if any US semicon firms offshoring to those 3 are able to escape the reach of export control list from Washington.
It matters, because China is also one of the few semiconductor equipment capable nations, and the only country that can sustain a market for it's own equipment.
The choice is do you comply with China, or do you watch China take over.