Chinese semiconductor thread II

tokenanalyst

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Jingchi Electromechanical Semiconductor Material Equipment R&D and Production Project was put into production​


On the morning of November 26, the commissioning ceremony of the Jingchi Electromechanical Semiconductor Material Equipment R&D and Production Project was held in Xindai Town. Following the start of construction of Phase III of Denair in September and the capping of Phase II of Runze in October, another project in Xindai was successfully put into production...Since the beginning of this year, Xindai Town has firmly anchored the goal of "a new growth pole for the development of the city's digital economy", insisted on taking project construction work as the engine of high-quality economic development, and truly achieved "starting construction every month and putting into production every month".

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tphuang

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MortyandRick

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Very comprehensive update from Paul Triolo on China's chip sector:

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From the article,

"Like other Chinese government mega-projects, the nucpn has lofty aims. Many such projects have fallen well short of their stated goals. "

I'm interested to see how many megas projects have "fallen well short " of their goals versus how many reached their goals. Or is the author is just pulling stats and data out of his ass?

Also didn't Paul triolo previously state that without EUV, china was to be limited to 14nm and above? He mentioned that china wont be able to do 7nm or below
Now he has changed his tone and says that DUV can only reach 5nm after the fact that china made it work and china wont be able to go any lower.
 

tokenanalyst

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Two major domestic HBM chip material manufacturers have joined forces​


The company plans to purchase 70% of the equity held by 13 counterparties including Hangzhou Shuhui through the issuance of shares, convertible corporate bonds and cash payment . This means that after the transaction is completed, Hengsuo Huawei will become a wholly-owned subsidiary of Huahai Chengke.

Both Huahai Chengke and Hengsuo Huawei are important suppliers of domestic semiconductor packaging materials, especially both are leading manufacturers of domestic semiconductor epoxy molding compounds . Huahai Chengke is also one of the main suppliers of HBM, an important component of Nvidia GPU
; its advanced packaging molding compounds GMC and LMC are used for HBM packaging.

Hengsuo Huawei has been deeply involved in the field of semiconductor chip packaging materials for more than 40 years and is the first manufacturer in China to mass-produce epoxy molding compounds . Later, it integrated the technologies of Germany and South Korea, and gradually reached the global mainstream level in the field of epoxy molding compounds. It owns the world-renowned brand "Hysol" , and currently many world-renowned semiconductor manufacturers are its customers.

Therefore, the acquisition of Hengsuo Huawei by Huahai Chengke is a strong combination of domestic semiconductor companies. After the transaction is completed, Huahai Chengke 's annual production and sales in the field of semiconductor epoxy molding materials is expected to exceed 25,000 tons , firmly maintaining its leading position and ranking second in the world . Moreover, Huahai Chengke is one of the only mass-produced GMC material suppliers in the world. Through this acquisition, it has further strengthened its global technological leadership and market recognition.

At the same time, Huahai Chengke's financial data in recent years is also known for its stability. According to its third quarter financial report for 2024 disclosed on October 25: Total operating revenue in the first three quarters of 2024 was 240 million yuan, up 17.33% year-on-year, and net profit was 34.9167 million yuan, up 48.08% year -on-year ; total operating revenue in the third quarter was 84.3283 million yuan, up 8.11% year-on-year, and net profit was 10.0223 million yuan, down 12.75% year-on-year.

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european_guy

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more SoC testing comparing K9020 to SD 8 Gen 2 and MediaTek 9200. Looking good, of course what matters more is the performance, not just the speed of the chip. And we will get update on that latter.


Huge improvement on speed this time around while fully utilizing domestic supply chain. Huawei making good use of its advanced knowledge of 5G-A and longer + more powerful antenna


One thing that caught my eye is the very big improvement in Antutu MEM score from Pura 70: 244K -> 405K (+65%!)

This score
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, so that's quite surprising considering that
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that is top range today.

Really curious about DRAM and NAND used on this phone...

Another interesting thing is that it seems to be factory shipped with HarmonyOS 4.3 (still Android based) instead of the new HarmonyOS Next

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It seems you can update to HarmonyOS via OTA....so why not factory shipping with the new OS?
 
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