its used for any vacuum equipment, including deposition, etch, furnance, ion implant and testing.
Chinese semiconductor thread II
- Thread starter vincent
- Start date
as we all know that, China don't do official announcement. but recent suppliers activities indicate 28nm Litho reaching the HVM production status. but no news about mass deliveries yet..
this is just pure speculation with no evident.
you should start reading this thread carefully what suppliers says. U-Precision talked about delivery of 20 sets(dry+immersion) this year and RSLaser production facility.
page number 533. guy just posted this information.
Software industry: IC design revenue in the first three quarters was 266 billion yuan, a year-on-year increase of 13.1%
Recently, the Operation Monitoring and Coordination Bureau of the Ministry of Industry and Information Technology released the "Economic Operation of the Software Industry in the First Three Quarters of 2024". In the first three quarters of 2024, my country's software and information technology services industry (hereinafter referred to as the "software industry") operated well, with software business revenue growing steadily, the growth rate of total profits rebounding, and software business exports continuing to improve.
Data shows that in the first three quarters, my country's software business revenue was 982.81 billion yuan, a year-on-year increase of 10.8%; the total profit of the software industry was 116.21 billion yuan, a year-on-year increase of 11.2%; and software business exports were 41.03 billion US dollars, a year-on-year increase of 4.2%.
In terms of different fields, software product revenue has grown steadily. In the first three quarters, software product revenue was 2221.3 billion yuan, up 8% year-on-year, accounting for 22.6% of the total industry revenue. Among them, industrial software product revenue was 210.4 billion yuan, up 8.8% year-on-year; basic software product revenue was 137.7 billion yuan, up 9.6% year-on-year.
China integrated circuit output was 315.6 billion pieces, a year-on-year increase of 26%.
Recently, the Operation Monitoring and Coordination Bureau of the Ministry of Industry and Information Technology released the "Operational Status of the Electronic Information Manufacturing Industry in the First Three Quarters of 2024". In the first three quarters, my country's electronic information manufacturing industry production grew steadily, investment continued to be high, efficiency declined slightly, exports remained stable, and the overall development trend of the industry was good.
In terms of production, in the first three quarters, the added value of electronic information manufacturing industry above designated size increased by 12.8% year-on-year, 7 and 3.7 percentage points higher than the industrial and high-tech manufacturing industries in the same period respectively. In September, the added value of electronic information manufacturing industry above designated size increased by 10.6% year-on-year. Among the main products, the output of mobile phones was 1.184 billion units, a year-on-year increase of 9.8%, of which the output of smart phones was 873 million units, a year-on-year increase of 10.5%; the output of microcomputer equipment was 249 million units, a year-on-year increase of 2.9%; the output of integrated circuits was 315.6 billion units, a year-on-year increase of 26% .
Qingting Optoelectronics: Focusing on 3D+AI ultra-high precision intelligent optical inspection equipment, the core business is growing rapidly, enabling advanced semiconductor manufacturing
Qingting Optoelectronics was founded in 2017 by 3D vision experts, former senior engineers at Google headquarters in Silicon Valley, and a senior team in the machine vision industry. The company focuses on ultra-high precision 3D intelligent optical inspection equipment for electronic semiconductors, integrating R&D, production, and sales to provide complete solutions for customers' various complex appearance inspection needs.
At present, the company's headquarters is located in Jiaxing, and it has R&D and sales centers in Suzhou, Shenzhen, Hangzhou, etc. Qingting Optoelectronics adheres to the core values of "truth-seeking and openness" and strives to become a world-class supplier of high-end optical inspection equipment.
In recent years, relying on its outstanding technical strength and product innovation capabilities, Qingting Optoelectronics has entered a new stage of rapid development, and its core business has grown rapidly. In November 2022, the company successfully completed the Pre-A round of financing and received support from many well-known institutions such as Tencent Investment, Ruifeng Capital, and Jie Chuang Capital.
Qingting Optoelectronics has won wide recognition in the market with its rich product line. The wafer-level 2D+3D measurement and inspection equipment Spectra-3000A launched by Qingting Optoelectronics is mainly used for Die surface defects, cutting line defects and RDL defect detection before and after semiconductor advanced packaging wafer cutting, bump height and coplanarity measurement. The Spectra-3000A integrates intelligence, automation, informatization and high precision to ensure excellent product quality. At present, Qingting Optoelectronics has supplied to many leading customers in the industry.
Qinghe Jingyuan Group's high-end wafer bonding equipment is delivered in batches
Qinghe Jingyuan's independently developed high-end wafer bonding equipment once again passed customer acceptance and was delivered in batches.
Relying on world-class semiconductor bonding technology, Qinghe Jingyuan has always been committed to promoting the industrialization of homogeneous/heterogeneous material integration and chip homogeneous/heterogeneous integration in semiconductor and related fields. The company is deeply engaged in the fields of wafer-level material heterogeneous integration, advanced packaging, ultra-precision processing, etc., providing customers with high-end semiconductor equipment and overall solutions, which are widely used in chiplet integration, device production (MEMS, RF, power), bonding substrate manufacturing and display panel packaging.
Looking ahead, Qinghe Wafer will continue to uphold the customer-centric philosophy, continue to promote integrated innovation, and constantly break through the boundaries of technology. We look forward to working hand in hand with global partners to jointly write a brilliant chapter in the field of semiconductor heterogeneous integration and contribute more Qinghe wisdom and strength to the vigorous development of the semiconductor industry.
Relying on world-class semiconductor bonding technology, Qinghe Jingyuan has always been committed to promoting the industrialization of homogeneous/heterogeneous material integration and chip homogeneous/heterogeneous integration in semiconductor and related fields. The company is deeply engaged in the fields of wafer-level material heterogeneous integration, advanced packaging, ultra-precision processing, etc., providing customers with high-end semiconductor equipment and overall solutions, which are widely used in chiplet integration, device production (MEMS, RF, power), bonding substrate manufacturing and display panel packaging.
Looking ahead, Qinghe Wafer will continue to uphold the customer-centric philosophy, continue to promote integrated innovation, and constantly break through the boundaries of technology. We look forward to working hand in hand with global partners to jointly write a brilliant chapter in the field of semiconductor heterogeneous integration and contribute more Qinghe wisdom and strength to the vigorous development of the semiconductor industry.