1. South Korea's Eppert power semiconductor wafer grinding and packaging and testing project settled in Lingang
Recently, the signing ceremony of the Korean Eppert Power Semiconductor Wafer Grinding and Packaging and Testing Project was held in the Lingang Development Zone.
South Korea's Eppert Semiconductor Co., Ltd. is committed to engaging in semiconductor wafer testing, grinding, cutting and module packaging and testing businesses. The total investment of the project settled in Lingang is US$40 million. It plans to build a new wafer chip testing, grinding and cutting processing production line and 2 power module and smart module packaging production lines to carry out wafer chip testing, grinding, cutting, processing, as well as semiconductor power module assembly, packaging, testing and sales.
2. Public announcement of environmental impact assessment for Yuqin semiconductor crystal material research and industrialization project
On October 18, the "Wuhu Municipal Ecological Environment Bureau" made public the environmental impact report on the crystal material research and development and industrialization project of Wuhu Yuqin Semiconductor Technology Co., Ltd.
The report shows that the total investment of the project is 110 million yuan. The site is located in Wuhu High-tech Industrial Development Zone. The project covers an area of about 3,000 square meters. The factory building of Wuhu Pacific Plastic Co., Ltd. with a construction area of 2,428.6 square meters is leased to build a SiC semiconductor crystal material production line. A total of 30 crystal growth equipment have been invested in the project with a production capacity of 840 ingots/year.
It is reported that the project was first filed with the Development and Reform Commission of Yjiang District, Wuhu City on August 8, 2022. The original plan was to build a silicon carbide crystal growth furnace headquarters and production base project to assemble and produce silicon carbide crystal growth equipment (environmental impact assessment exemption); it was later changed and approved on April 1, 2024 to build a crystal material research and development and industrialization project, and in June of the same year, the construction contents such as the project area, leased factory building area, and construction period were corrected and filed.
3. The "Shengmei Semiconductor Equipment R&D and Manufacturing Center" Plant A was successfully capped
The topping-out ceremony of Building A of “SCM Semiconductor Equipment R&D and Manufacturing Center” was held in Lingang.
On December 31, 2022, the Shengmei Lingang project with a construction area of 138,000 square meters was officially capped. Currently, two R&D buildings, two high-rise factories, and one auxiliary factory are planned. At the same time, the auxiliary factory will be equipped with a R&D test clean room of the same level as the integrated circuit production line to accelerate the company's product process testing and verification and improvement and upgrade testing. In line with the goal of integrating R&D and production, Shengmei Shanghai has realized mixed R&D and production land in Lingang for the first time. After completion, the planned annual production capacity will exceed 600 units, with an annual output value of RMB 10 billion.
4. Xinjie Energy: SiC/GaN project will be completed and put into production by the end of the year
On October 17, according to "Wuxi High-tech Zone Online", the new clean energy headquarters base and industrialization project located in Wuxi High-tech Zone (Xinwu District) is about to be completed and put into production.
It is reported that the total investment of the new clean energy headquarters base and industrialization project is 1.35 billion yuan, the land area is about 31,700 square meters, and the construction area is about 54,000-57,000 square meters. The project started construction in January 2023 and is expected to be completed and put into use by the end of 2024.
After the project is completed and put into production, it is expected to produce 26.4 million silicon carbide/gallium nitride power devices per year; 1.452 billion ICs and intelligent power modules (IPMs) and other power integrated modules per year; 3.626 million SiC/IGBT/MOSFET and other power integrated modules (including automotive grade) per year. It is expected to achieve an annual output value of 1.666 billion yuan after reaching full production.
5. Mingfang integrated circuit packaging testing and industrialization project started construction
On the morning of October 18, the foundation stone laying ceremony of Mingfang integrated circuit packaging, testing and industrialization project was held. It is understood that the total investment of Mingfang integrated circuit packaging, testing and industrialization project is planned to be 1 billion yuan, mainly to build integrated circuit packaging and testing production line plant, R&D center, comprehensive building and supporting facilities. After the project is completed, it will mainly engage in advanced chip packaging and high-efficiency testing of various chips. Its main customers are leading brands in the industry such as DJI, Hikvision, Jingfeng Mingyuan, Taiwan Xinda, Taiwan Jiuchang, etc. After the project is put into production, the annual output value is expected to exceed 1 billion yuan, and the annual profit and tax will be 50 million yuan.
6. Aodong Microwave Millimeter Wave Electronics Industrial Base Project is about to be accepted
Recently, at the construction site of the Aodong Microwave Millimeter Wave Electronic Industrial Base project, workers shuttled between floors to carry out indoor partition wall construction and other work. According to reports, the main structure of the main building and the comprehensive building has been completed in the early stage of the project. At present, the construction of the secondary structure in the stairs is being accelerated to create favorable conditions for the upcoming acceptance work.
After the completion of the base, it is planned to purchase more than 200 sets of process, debugging production and test and inspection equipment, and focus on the construction of three process production lines, namely semiconductor chip design and testing lines, microwave/millimeter wave module and component process production lines, and MCM hybrid integrated micro-assembly process production lines, to form an annual production capacity of 10,000 sets of microwave/millimeter wave modules and 5,000 sets of microwave/millimeter wave components.
