Chinese semiconductor thread II

Randomuser

Senior Member
Registered Member
Companies with manufacturing tools for 300mm wafer processing.
The red color indicate companies that advertise or are rumored to be developing/have tools for advanced processes like advanced 3D-NAND,advance DRAM and logic 28nm or less. I personally think is a better list that MSM put out there.

DEPOSITION
LEADMICRO
PIOTECH
NAURA
AMEC
ACM SHANGHAI
SRII​
WANYE
ASEL
SYSTECH​
ZSE SEMI​
SWAT​
ETCHING
NAURA
AMEC
YITONG
LITHOGRAPHY
SMEE
COATING/DEVELOPING
ACM SHANGHAI
KINGSEMI
XIMI SEMI​
TDSEMI​
ION IMPLANTATION
WANYE
CETC
SRII
CMP
HWATSING
GEGV
SIZONE​
METROLOGY
RSIC
ANGSTROM-E
JINGCE
DJEL-X
SMEE
VPTEK​
YUWEITEK
TZTEK​
MZ SEMI​
CLEANING
PNC SYSTEM
ACM SHANGHAI
KINGSEMI​
SYSTECH​
SSNTECH​
ZSE SEMI​
JSXM​
NAURA
THERMAL PROCESSING
LAPLACE SEMI​
YITONG
SMEE​
ETA-SEMITECH​
Watch as Digitimes or whatever steals this.

I have a feeling we got a lot of professionals who lurk these forums for updates and steal them whenever they can.
 

jli88

Junior Member
Registered Member
This article claims that while China leads in overall Lidar systems, it is still heavily reliant on Sony for lidar components. Is it true?

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tokenanalyst

Brigadier
Registered Member
Wuhan Xinfeng Precision Technology Co., Ltd. (hereinafter referred to as "Xinfeng Precision") located on Baiquan Street, Dongxihu District, announced good news - the second 12-inch ultra-precision wafer thinning machine independently developed was successfully delivered to customers , marking that Xinfeng Precision has achieved a major breakthrough in mass production capabilities in the field of high-end wafer thinning technology, and successfully solved the difficulties of thickness deviation, flatness control and cleanliness maintenance in the wafer thinning process in the three-dimensional integration (3D IC) manufacturing field, demonstrating the company's innovative strength in the field of semiconductor manufacturing equipment.

"Our ultra-precision wafer thinning machine adopts an original new design, which specifically solves the pain points of existing technologies and achieves the ultimate precision and efficiency in the wafer thinning process." Wan Xianjin, general manager of Xinfeng Precision, introduced, "By continuously optimizing the equipment structure and control algorithm, we have successfully solved the difficulties of thickness deviation, flatness control and cleanliness maintenance in the wafer thinning process in the 3D IC manufacturing field, providing customers with unprecedented process flexibility and processing efficiency."
1729780172558.png
Xinfeng Precision's customers include many domestic semiconductor giants. In addition to the ultra-precision wafer thinning machine, the ring cutting machine independently developed by Xinfeng Precision has a client installation volume of over double digits and has stably mass-produced over 100,000 wafers. This marks that Xinfeng Precision has become the first domestic semiconductor equipment company to have such equipment verified and successfully mass-produced by the client, helping the domestic artificial intelligence (AI) high-computing power chip manufacturing to move forward steadily.

"Since the start of production in March, the total sales order of Xinfeng Precision has exceeded 200 million yuan." Wan Xianjin proudly stated that from parts quality control to product design, research and development, manufacturing, assembly and testing, all are completed by Xinfeng Precision. "Currently, customers are very satisfied with our products, and sales orders are scheduled until June next year."

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tokenanalyst

Brigadier
Registered Member

Jingce Electronics acquires 11.93% stake in Xinsheng Intelligent to expand into storage test equipment field​

Jingce Electronics issued an announcement stating that the company formed a consortium with Shanghai Zhongmobile Digital Transformation Industry Private Equity Fund Partnership (hereinafter referred to as "Zhongmobile Fund") on September 24 through public delisting to participate in the 41.93% equity transfer project of Jiangsu Xinsheng Intelligent Technology Co., Ltd. (hereinafter referred to as "Xinsheng Intelligent"). Among them: the company intends to acquire 11.93% of the equity of Xinsheng Intelligent, and Zhongmobile Fund intends to acquire 30.00% of the equity of Xinsheng Intelligent; the transaction floor price is 365 million yuan (of which the company's transfer floor price is 104 million yuan, and Zhongmobile Fund's transfer floor price is 261 million yuan).

On October 21, the Shanghai United Equity Exchange issued a "Notice of Organization for Contract Signing", confirming that the company and China Mobile Fund are the transferees of 41.93% of the equity of Xinsheng Intelligent, and the transfer price is 365 million yuan. Recently, the company signed the "Shanghai Equity Transaction Contract" with the National Integrated Circuit Industry Investment Fund Co., Ltd.

It is reported that Xinsheng Intelligence is based on independent innovation of storage technology and independent control of intellectual property rights to create world-leading products that meet national information security and reliable supply. Xinsheng Intelligence has many high-quality patents, and its storage chips and SSD products cover all fields of industry, enterprise, automobile and consumer. It is a leading domestic chip and product solution provider in China.

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