TuoJing Technology (Piotech): The first ultra-high aspect ratio trench filling CVD product has passed customer verification
Recently, Tuojing Technology stated in an institutional survey that the first ultra-high aspect ratio trench filling CVD product independently developed and launched by the company has passed customer verification, achieved industrial application, and obtained repeat orders from customers and orders from different customers, and has been shipped to clients for verification.
Ultra-high aspect ratio trench filling CVD equipment can deposit high-quality dielectric film materials on the surface of the wafer. After curing and oxidation processes, it can completely fill the gap without leaving holes and gaps. Tuojing Technology said that it has shipped more than 15 reaction chambers related to ultra-high aspect ratio trench filling CVD equipment.
In addition, TuoJing Technology's PECVD Bianca equipment is a wafer backside thin film deposition equipment, which is mainly used to correct wafer warping and protect the backside of wafers during integrated circuit manufacturing, and can be used in the storage field and logic field. In the first half of this year, TuoJing Technology's first PECVD Bianca process equipment passed customer verification and achieved industrial application. As of the end of the first half of the year, a total of more than 25 reaction chambers have received orders, and some reaction chambers have been shipped to customers.
Tuojing Technology stated that research and development is the cornerstone of the company's development. The company will continue to make high-intensity R&D investments, continuously develop new products and new processes, and iterate and upgrade products according to customer needs, thereby promoting the company's stable development. It is expected that the proportion of R&D investment in operating income in 2024 will remain above 20%.