AMEC speeding the research of cryogenic etching to compete with LAM and TEL in 3DNAND
CCP: As of 24H1, the company has produced and shipped more than 3,600 CCP etching reactors, and the number of newly shipped equipment in 24H1 has reached a record high; among them, the new shipments of Primo D-RIE/AD-RIE/AD-RIE-e in the dual reactor in 24H1 exceeded the full-year shipments in 2023, and the single reactor Primo HD-RIE/HD-RIEe/UD-RIE24H1 shipments increased by about 3 times compared with the full-year shipments in 2023. Primo AD-RIE-e continues to be shipped for the most advanced logic chip production lines, and has obtained repeat orders for advanced storage production lines. Primo SD-RIE has entered the yield test stage for the verification of the metal mask integrated Damascus etching process at the first advanced logic client, and has entered the second customer for on-site verification; and has reached evaluation intentions with many customers, and the current laboratory development is progressing smoothly. Primo UD-RIE has verified the mass production capability of etching ≥60:1 aspect ratio structures on the production line.
In addition, the company actively deploys ultra-low temperature etching technology, invests a lot of resources in the research of ultra-low temperature electrostatic chucks and new etching gases, and actively reserves cutting-edge technologies for etching higher aspect ratio structures (≥90:1).
ICP: The verification of multiple ICP devices in advanced logic chips, advanced DRAM and 3D NAND production lines has been progressing smoothly and has successively obtained bulk orders from customers. Nanova VE HP has invested in large-scale production in the application of high aspect ratio polysilicon masks in DRAM manufacturing. LUX has gradually achieved small-scale production on the production lines of multiple customers. PrimoTwinStar has achieved mass production on the production lines of mature logic chips, Meta Lens for AR glasses and other special devices for domestic and foreign customers, and has obtained repeat orders. The first Primo-Twin Star 200 was also delivered to the client for Meta Lens production line certification. While Primo TSV 200E/300E continues to receive repeat orders in mature markets, it has been successfully verified in the silicon via etching process of 12-inch 3D chips and has the opportunity to obtain certification on the world's first 12-inch MEMS chip production line newly built by European customers. The wafer edge Bevel etching equipment has been completed and is about to enter customer verification.
Thin film deposition equipment: The company's tungsten series of thin film deposition products can cover all tungsten applications of storage devices, and has completed the verification of CVD/HAR/ALD W tungsten equipment by multiple logic and storage customers, and has obtained customer orders. The EPI equipment R&D team has formed independent intellectual property rights and innovative pre-treatment and epitaxial reaction chamber design solutions; currently, the EPI equipment has successfully entered the customer verification stage. In 24H1, the company's new LPCVD equipment achieved its first sale, with revenue of 28 million yuan; LPCVD received new orders of 168 million yuan.
