Chinese semiconductor thread II

[tokenanalyst]

Huaxin Intelligent, a domestic semiconductor advanced packaging equipment supplier, has completed tens of millions of yuan in A+ round financing this year​

Recently, Huaxin Intelligent, a domestic wafer-level advanced packaging and testing equipment company, announced that it had received tens of millions of yuan in A+ round financing in 2024. Among them: Jinhaitong (stock code 603061), a listed company and a leading integrated circuit test and sorting machine company, invested tens of millions of yuan in industry, and Jiangyin Xiayin Investment invested tens of millions of yuan .

Shenzhen Huaxin Intelligent Equipment Co., Ltd. (hereinafter referred to as Huaxin Intelligent) was established in July 2021. It is a semiconductor wafer-level packaging equipment company integrating professional research and development, production and sales. Huaxin Intelligent 's independently developed wafer-level packaging, testing and sorting equipment has been replaced by domestic products since 2023. It is the first advanced packaging and testing equipment company in China to achieve mass production of wafer-level sorting machines . It has obtained mass production orders from several domestic industry leaders and has reached cooperation with many domestic and foreign leaders . After this round of financing, Huaxin Intelligent will set up a localized wafer-level sorting machine manufacturing base in East China and continue to deepen its presence in the East China market.

Huaxin Intelligent's main products are advanced packaging, testing, sorting and testing equipment. Advanced packaging, testing, sorting and testing equipment products include WLCSP special sorting equipment, Panel-level packaging, testing and patching equipment, Fanout packaging sorting equipment, SIC KGD equipment, Wafer AOI special equipment, etc.; semiconductor sorting and testing equipment is suitable for advanced packaging such as wafer-level packaging technology (WLCSP), system-level packaging technology (SIP), 2.5/3.0D integrated packaging, Fan-in and Fan-out, Chiplet packaging, etc.

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[tokenanalyst]

Ultra-precision fabrication technology based on fusion figuring of surface height and slope profile for EUVL objective lenses.​

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Abstract​

The manufacturing requirements for extreme ultraviolet lithography (EUVL) projection lenses are highly stringent, demanding ultra-precise control over surface height and slope profile to achieve optimal imaging quality. Nevertheless, the current technology lacks the explicit capability to control the two-dimensional (2D) surface slope of optics. Focusing on the ultra-precision machining technology based on slope profile, a partial derivative exchange decoupling (PDED) method is proposed to approximately calculate the vector removal coupling problem within the 2D slope-based figuring (SF) model, specifically addressing the interplay between the slope removal function and the slope error. Furthermore, the fusion figuring (FF) model accomplishing the dual monitoring of both surface height accuracy and slope profile accuracy is proposed innovatively. Through simulation experiments, the modification results of the fusion, slope-based, and height-based figuring (HF) models are systematically compared and analyzed, demonstrating the effectiveness and superiority of the fusion figuring model. In actual manufacturing experiments, the FF model improves RMS convergence for slope errors by over 20% and for height errors by nearly 10% compared to the HF model. The research results successfully achieve a notable level of convergence in optics machining and provide a new approach with ultra-precision and stability for the fabrication of complex optics requiring precise control of both surface and slope accuracy.

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[Maikeru]

That whole Digitimes article is basically "Chinese DUV machine can't do something nobody ever claimed it could do! But it can do what they said it could do if you read the MIIT announcement properly."

 

[Oldschool]

why would i upset ?? you always derail this thread with useless articles.

Digitimes headline -

''China's latest domestically produced DUV exposure machine cannot perform the critical multiple exposures needed for advanced chip production, making it incapable of achieving finer process nodes like 28nm and below''

this is completely wrong, these people continue to make stories on MIIT report, in which China mentioned 65nm dry DUV. and for your kind information 65nm has nothing to do with 28nm and below.. the maximum process that machine can handle is 55nm. so what Digitimes said is completely wrong. these people really don't know anything..

65nm dry DUV has nothing to do with 28nm
65nm dry DUV has nothing to do with 28nm
65nm dry DUV has nothing to do with 28nm

We don't know this dry DUV can do 28nm or not. Even thought this machine not meant for 28nm production but No idea how digitimes arrived that

Overlay spec less than equal to 8nm.
Using LELE double patterning, the requirement is 13.5% of half pitch which is 8.775nm .

The spec of less and equal to 8nm meets this. Therefore this dry DUV supports double patterning.

So with double patterning this machine supports resolution of 32.5nm which is entry level for 28nm. We don't know if it actually goes to 28nm but it's very close.

What's digitimes reasoning not supporting multipatterning and goes to 28nm?

 

[huemens]

We don't know this dry DUV can do 28nm or not. Even thought this machine not meant for 28nm production but No idea how digitimes arrived that

Overlay spec less than equal to 8nm.
Using LELE double patterning, the requirement is 13.5% of half pitch which is 8.775nm .

The spec of less and equal to 8nm meets this. Therefore this dry DUV supports double patterning.

So with double patterning this machine supports resolution of 32.5nm which is entry level for 28nm. We don't know if it actually goes to 28nm but it's very close.

What's digitimes reasoning not supporting multipatterning and goes to 28nm?

This is what they say

Chinese media, citing experts in lithography, noted that a 65nm resolution ArF machine can potentially achieve a 55nm process with optimized optical proximity correction (OPC) algorithms. However, China's DUV machines, with an overlay accuracy of ≤8nm, have too much error to handle multiple exposures, limiting them to 65/55nm processes.

 

[Oldschool]

This is what they say

They are saying it uses OPC and doesn't support double patterning. Well,
overlay accuracy of ≤8nm means it can support double patterning.
It should be able to support 45nm process.
ASML dry DUV supports 45nm

45nm process is commonly used process.

Don't tell me that it has to wait for the ArFi to support 45nm.

Digtimes smells spilling BS.

Anyway, the ArFi definitely an big upgrade with NA 1.35 versus NA 0.9 projection lens ArF.