Chinese semiconductor thread II

T

tokenanalyst

Brigadier
Registered Member

1.6 billion capital increase finalized! Silan Microelectronics' 12-inch production line has made the latest progress​


Recently, Hangzhou Silan Microelectronics Co., Ltd. (hereinafter referred to as "Silan Micro") announced that it plans to jointly increase the capital of its joint-stock company Xiamen Silan Jike Microelectronics Co., Ltd. (hereinafter referred to as "Silan Jike") by RMB 1.6 billion with Xiamen Semiconductor Investment Group Co., Ltd. (hereinafter referred to as "Xiamen Semiconductor") to support the construction and operation of its 12-inch integrated circuit chip production line. Silan Micro will invest RMB 800 million and subscribe to the newly added registered capital of Silan Jike of RMB 740,775,036.

Official data shows that if the capital increase is implemented smoothly, it will further increase Silan JiKe's capital adequacy ratio and provide financial support for the construction and operation of Silan JiKe's 12-inch integrated circuit chip production line.
It is reported that Silan JiKe's 12-inch specialty integrated circuit manufacturing production line project, with power semiconductor chips and MEMS sensors as its main products, has a planned total investment of RMB 17 billion and will build two 12-inch chip production lines; the first power semiconductor chip manufacturing production line has a planned production capacity of 80,000 pieces/month, with a total investment of RMB 7 billion; the second chip manufacturing production line has an investment of RMB 10 billion.

Please, Log in or Register to view URLs content!
 
T

tokenanalyst

Brigadier
Registered Member

8-inch silicon carbide substrate! Chongqing Sanan project has achieved the lighting of the substrate factory​



According to Cailianshe, a person from San'an Optoelectronics' securities department revealed that the Chongqing San'an project, which mainly produces 8-inch silicon carbide substrates, has achieved the lighting and production of the substrate factory.
In June 2023, Sanan Optoelectronics and STMicroelectronics simultaneously announced a joint venture to build a factory in Chongqing to carry out large-scale mass production of 8-inch silicon carbide (SiC) chips. This was one of the most eye-catching multinational joint venture projects in the semiconductor field last year. STMicroelectronics is a global semiconductor leader, and Sanan Optoelectronics has strong compound semiconductor foundry capabilities. The total investment in the project is expected to reach US$3.2 billion (approximately RMB 22.8 billion), with revenue expected to reach RMB 13.9 billion, and it will be fully operational in 2028. At the same time, Sanan Optoelectronics independently invested RMB 7 billion to build an 8-inch silicon carbide substrate plant. After the Chongqing Sanan ST project is put into production, it will better support China's growing demand for applications such as automotive electrification, industrial power and energy.

Please, Log in or Register to view URLs content!
 
T

tokenanalyst

Brigadier
Registered Member

Guangli Micro: DFT design and yield diagnosis solutions integrated​

Author:
Please, Log in or Register to view URLs content!
1 hour ago
Recently, Guangliwei stated in an institutional survey that the company has launched new design EDA software DFT tools in recent years. t present, the integration of DFT design and yield diagnosis solutions has been completed, and it has been applied to many customers and achieved sales revenue. The technical performance has reached the level of benchmark tools and has gained a good reputation among customers. The research and development of the core modules of the design for manufacturability (DFM) tool has made important progress, among which CMPEXP has been tried in many leading domestic companies.
1726671367631.png
1726671411229.png


In the first half of this year, driven by many factors, AI and related applications have been accelerated, new energy inventory has been improved, electric vehicle penetration has increased, industrial applications have come out of the trough, and consumer electronics have continued to recover, the global semiconductor industry has gradually recovered. Based on the development trend of the industry, Guangli Micro has launched cost-effective products that solve customer pain points, and continues to give play to the advantages of software and hardware synergy in improving the yield of the entire process, providing customers with high value-added products and solutions, and maintaining an overall growth trend in revenue. In the first half of this year, Guangli Micro invested 132 million yuan in R&D, a year-on-year increase of 41.77%.

Please, Log in or Register to view URLs content!
Please, Log in or Register to view URLs content!
 
H

huemens

Junior Member
Registered Member
diadact said:
Please, Log in or Register to view URLs content!


Please, Log in or Register to view URLs content!
Click to expand...

The most important news from this is that YMTC’s Xtacking4.0 is in mass production now
YMTC hit the headlines last year with the 232 Layer TLC 3D NAND device, which was the most dense memory ever produced, not just in China but globally. YMTC is clearly a company to watch in the memory space. That was using the company’s Xtacking3.0 process. Now TechInsights has found YMTC’s Xtacking4.0 process in a commercial product, the ZhiTai TiPlus7100 Black Myth SSD.
Click to expand...

YMTC Xtacking4.0: Breaking New Ground in 3D NAND Technology​

Please, Log in or Register to view URLs content!

Key upgrades in Xtacking4.0 include:​

  1. Centered X-DEC die design: This architectural enhancement improves read/write performance by reducing wordline (WL) capacitance and RC load, cutting WL settling time and current demands.
  2. Backside Source Connect (BSSC): First used in Xtacking3.0, BSSC helps streamline vertical connections, now applied to the 160-layer TLC chip for enhanced performance.
  3. Vertical channel (VC) design: The 20-hole VC design, shared with KIOXIA’s BiCS8 218L, eliminates dummy holes, optimizing the 155 nm pitch for better cell density and efficiency.
  4. Higher bit density and reduced die size: With a die size of 40.44 mm² and a density of 12.66 Gb/mm² for the 512 Gb chip, Xtacking4.0 offers increased storage capacity and performance within a smaller footprint.
  5. Hybrid bonding maturity: This technology, crucial to YMTC’s process, is now more refined and is the backbone of YMTC’s high-density, vertically connected 3D NAND chips.
These improvements reflect YMTC's efforts to mitigate the challenges of U.S. sanctions by advancing its technology, boosting yields, and preparing for further product diversification.
Click to expand...
 
Last edited:
tphuang

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
there is no reason why YMTC can't be using Japanese tools still. It would actually be silly to not use it, since they need to ramp up production. But a couple of years ago, we heard from YMTC and AMEC that YMTC needed the high ratio etcher (IIRC) to restart production of 128 layers. Whether or not they have the tools ready for higher layers is hard to say. But it's quite possible that for 192 and 232 layer NAND chips, they do still need American tools.

And I wouldn't be surprised if they are doing 160 layers with Xtacking 4.0 because that's the most they can do reliably using domestic tools. YMTC needs to ramp up production quickly to supply Huawei. I'd be curious if this goes onto Mate 70.
 
T

tokenanalyst

Brigadier
Registered Member
diadact said:
Please, Log in or Register to view URLs content!


Please, Log in or Register to view URLs content!
Click to expand...
I think this tools was developed in cooperation between AMEC and YMTC to replace I think a specific AMAT tools.
1726683027488.png
As long Chinese chipmakers under the pressure of the stooges exports controls collaborate with China equipment, sub-systems and materials companies in China in developing the tools they need the replacement of most US tools is almost inevitable and Europeans-Japanese tools too if they want to keep appeasing the clowns in D.C., the clock is ticking because once Chinese tools makers and Chinese fabs have develop a close partnership in R&D and servicing going back to buy US tools will be impossible even if things go back to normal.
 
You must log in or register to reply here.
Top