Chinese semiconductor thread II

tphuang

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芯驰科技面向智能座舱、智能车控等核心应用领域提供高性能、高可靠的汽车芯片产品,经过六年多的发展,已成长为本土座舱与车规MCU芯片领军企业。截至目前,芯驰全系列产品出货量超600万片,量产上市车型超过70款。
SemiDrive provides smart cockpit and smart auto control products like MCUs and SoCs. It has sold 6 million chips for 70 different auto types
 

tokenanalyst

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New Micro Semiconductor Launches 850nm 10G VCSEL Process Platform for a Wide Range of Datacom Applications​


On September 12, Shanghai Xinwei Semiconductor Co., Ltd. (hereinafter referred to as "Xinwei Semiconductor") released its 850nm 10G VCSEL process platform. With its unique 850nm wavelength, this process platform achieves 10Gbps high-speed data transmission capability. It uses advanced oxide isolation technology and has long-term advantages such as high reliability, high data rate and low threshold. It is very suitable for short-distance optical interconnection applications and can be widely used in a wide range of scenarios such as optical transmission, HDMI, LiDAR and data centers.
The process platform adopts advanced epitaxy and manufacturing processes to ensure that the produced chips can work stably and maintain excellent beam quality in high temperature environments, meeting customers' high standards of performance. The 10G 850nm VCSEL process platform foundry products show excellent performance: the driving current is only 6mA, the output power is up to 2.4mW, the wavelength stability is strong, and the 3dB bandwidth is greater than 12GHz. These characteristics make the platform foundry chips very suitable for TO packaging and non-hermetic COB packaging, providing a solid foundation for the diversified design of optical communication modules. In terms of reliability, the process platform has passed 2000 hours of accelerated aging reliability certification, which is equivalent to a lifespan of far more than 20 years under full-day working conditions. It not only meets the needs of high-speed data transmission, but also ensures the stability and reliability of transmission.

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tokenanalyst

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"Shenyang Semiconductor Precision Slicing Equipment R&D and Industrial Base" was successfully completed.​


the beam raising ceremony of Shenyang Semiconductor Precision Slicing Equipment R&D and Industrial Base started on time. Ms. Yuan Huizhu, Chairman of Heyan Technology, gave a speech, thanking the builders for their efforts, looking forward to promoting the high-quality completion of the project in a rigorous and pragmatic manner, and jointly building a brilliant future for Heyan Semiconductor's advanced packaging equipment field.

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tokenanalyst

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Eos300+ FTIR equipment from Europu was delivered to 12-inch advanced process FAB​


Recently, Shanghai Unique Semiconductor Equipment Co., Ltd. ("Unique") delivered the FTIR equipment Eos300+ to a domestic 12-inch advanced process wafer fab for the measurement of chemical bonds such as Si-O, Si-H and NH in the chemical vapor deposition (CVD) process.

the Eos300+ device has the following technical features:

  • The equipment is a 12-inch fully automatic equipment, SECS/GEM connected to factory automation.
  • The core components of Eos300+ are 100% localized, and the localization rate of the entire machine exceeds 80%, ensuring that the equipment supply chain is independent and controllable.
  • Self-developed element concentration and chemical bond content measurement algorithm.

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tphuang

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2024H1_CocokpitChipsMarketShare.jpeg

From first half of the year, cockpit chips like display, domain control, entertainment chips (mostly SoC and MCUs) here. Dominated by Western chipmakers like NXP, QCOM, Renasas and TI.

SemiDrive is the top player domestically with 2.16% market share. Hisilicon is also in top 10 with 1.42% share.

From SemiDrive on this
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量产成绩是车规芯片企业技术成熟度与商业化实力的最直观体现。自2020年发布第一代产品以来,芯驰X9系列每年迭代升级,完成家族化的产品布局,全面覆盖3D仪表、IVI、座舱域控、舱泊一体、舱行泊一体、中央计算平台等从入门级到旗舰级的座舱应用。X9系列座舱芯片已经成为中国车规级智能座舱芯片的主流之选,累计出货量超400万片。奇瑞、长安、上汽、广汽、北汽、东风日产、东风本田等车企旗下搭载X9系列芯片的近40款车型均已量产上车。

与此同时,芯驰以E3系列产品持续领跑本土高端车规MCU赛道,在智能驾驶、车身域控、电驱、BMS电池管理、智能底盘等核心应用领域广泛落地,率先完成超200万片出货量,在理想、奇瑞、吉利、长安等车企的近20款主流车型上量产。

围绕汽车电子电气架构的演进提供核心支持,是芯驰车芯产品规划与业务聚焦的基本原则,也是芯驰能够率先在智能座舱和智能车控领域实现规模化量产的关键。在量产速度方面,芯驰协助客户从立项到SOP最快仅用了8个月的时间,做到领先行业平均水平30%。
SemiDrive's X9 series SoC for various cockpit instruments has reached over 4 million chips.

Its E3 high end MCU has also sold over 2 million.

It's used on Buick GL-8, Jetour X-70, GAC Aion V, Dongfeng Honda.

E3 supports Lidars on Li Auto L series, MEA, Lotus Electra, Leapmotor C10 and C16.
Also used in Smart and Zeekr X models
Wuling Bingo, XingGuang
 

sunnymaxi

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View attachment 135591

From first half of the year, cockpit chips like display, domain control, entertainment chips (mostly SoC and MCUs) here. Dominated by Western chipmakers like NXP, QCOM, Renasas and TI.

SemiDrive is the top player domestically with 2.16% market share. Hisilicon is also in top 10 with 1.42% share.

From SemiDrive on this
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SemiDrive's X9 series SoC for various cockpit instruments has reached over 4 million chips.

Its E3 high end MCU has also sold over 2 million.

It's used on Buick GL-8, Jetour X-70, GAC Aion V, Dongfeng Honda.

E3 supports Lidars on Li Auto L series, MEA, Lotus Electra, Leapmotor C10 and C16.
Also used in Smart and Zeekr X models
Wuling Bingo, XingGuang
how long do you think, domestic suppliers at least can capture 30-40 percent market share in cockpit chips like display, domain control, entertainment chips ..

SemiDrive started 2024 year on strong note..

just like High end Machine tools/industrial robots, need minimum 4 to 5 domestic players in top 10..
 
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